Boiler plates for computing systems
A boiler plate is provided. The boiler plate includes a heat spreader layer operable to transfer heat from a computing component across the heat spreader layer. The heat spreader layer extends along a plane. At least one heat pipe extends from the heat spreader layer in a direction substantially perpendicular to the plane away from the computing component. The at least one heat pipe is operable to transfer the heat away from the heat spreader layer to reduce a temperature of the computing component.
1. A boiler plate comprising:
a heat spreader layer having a surface and a depth below the surface, the heat spreader layer operable to transfer heat from a computing component across the heat spreader layer, wherein the heat spreader layer extends along a plane;
at least one heat pipe operable to transfer the heat away from the heat spreader layer to reduce a temperature of the computing component, the at least one heat pipe including a snaking heat pipe,
wherein the snaking heat pipe includes a plurality of evaporation sections and a plurality of condensation sections,
wherein each of the plurality of evaporation sections is embedded in the depth of the heat spreader layer and each of the plurality of condensation sections extends away from the heat spreader layer in a direction substantially perpendicular to the plane away from the computing component such that at least part of each condensation section of the plurality of condensation sections directly contacts an immersion fluid,
wherein the snaking heat pipe has in a snaking arrangement which includes a first condensation section of the plurality of condensation sections extending away from the heat spreader layer and then back towards the heat spreader layer into a subsequent evaporation section of the plurality of evaporation sections.
2. The boiler plate of claim 1 , wherein each of the plurality of evaporation sections is coupled with the heat spreader layer.
3. The boiler plate of claim 1 , wherein each of the plurality of condensation sections forms one or more geometries.
4. The boiler plate of claim 3 , wherein each of the one or more geometries includes at least one of the following: linear, curved, rectangular, triangular, diamond shaped, and/or ohm shaped.
5. The boiler plate of claim 1 , wherein a diameter of the plurality of evaporation sections is greater than a diameter of the plurality of condensation sections.
6. The boiler plate of claim 1 , wherein the at least one heat pipe consists of one continuous heat pipe traversing through the heat spreader layer.
7. The boiler plate of claim 1 , wherein the at least one heat pipe includes a plurality of individual heat pipes received in the heat spreader layer.
8. The boiler plate of claim 1 , wherein each of the at least one heat pipe includes a boiling enhancement surface operable to generate and detach bubbles.
9. The boiler plate of claim 8 , wherein the boiling enhancement surface includes at least one of the following: microchannels, dimples, microporous coating, and/or rough surfaces.
10. A computing system comprising:
a computing component; and
a boiler plate mounted on the computing component, the boiler plate comprising:
a heat spreader layer operable to transfer heat from the computing component across the heat spreader layer, wherein the heat spreader layer extends along a plane;
at least one heat pipe operable to transfer the heat away from the heat spreader layer to reduce a temperature of the computing component, the at least one heat pipe including a snaking heat pipe,
wherein the snaking heat pipe includes a plurality of evaporation sections and a plurality of condensation sections,
wherein each of the plurality of evaporation sections is embedded in a depth of the heat spreader layer and each of the plurality of condensation sections extends away from the heat spreader layer in a direction substantially perpendicular to the plane away from the computing component such that at least part of each condensation section of the plurality of condensation sections directly contacts an immersion fluid,
wherein the snaking heat pipe has in a snaking arrangement which includes a first condensation section of the plurality of condensation sections extending away from the heat spreader layer and then back towards the heat spreader layer into a subsequent evaporation section of the plurality of evaporation sections.
11. The computing system of claim 10 , wherein each of the plurality of evaporation sections is coupled with the heat spreader layer.
12. The computing system of claim 10 , wherein each of the plurality of condensation sections forms one or more geometries, wherein each of the one or more geometries includes at least one of the following: linear, curved, rectangular, triangular, diamond shaped, and/or ohm shaped.
13. The computing system of claim 10 , wherein a diameter of the plurality of evaporation sections is greater than a diameter of the plurality of condensation sections.
14. The computing system of claim 10 , wherein the at least one heat pipe consists of one continuous heat pipe traversing through the heat spreader layer.
15. The computing system of claim 10 , wherein the at least one heat pipe includes a plurality of individual heat pipes received in the heat spreader layer.
16. The computing system of claim 10 , wherein each of the at least one heat pipe includes a boiling enhancement surface operable to generate and detach bubbles, wherein the boiling enhancement surface includes at least one of the following: microchannels, dimples, microporous coating, and/or rough surfaces.
17. The computing system of claim 10 , wherein the computing component includes a central processing unit and/or a graphics processing unit.