Induction welding using a heat sink and/or cooling
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
1 . A method of forming a heat sink, the method comprising:
spacing a number of tiles into a single layer with a gap between the tiles, wherein the tiles are electrically non-conductive and thermally conductive; and
filling the gap between the tiles with an adhesive flexibly joining sides of the number of tiles to each other.
2 . The method of claim 1 , further comprising joining the tiles with a mechanical hinge disposed within the gap.
3 . The method of claim 1 , further comprising setting the tiles onto a layer of flexible adhesive sprayed onto a backing material comprising fibers comprised of a glass.
4 . The method of claim 3 , further comprising disposing cooling channels within the gap.
5 . The method of claim 3 , further comprising curing the adhesive.
6 . The method of claim 1 , wherein:
spacing the tiles includes spacing the tiles on a backing material: and
the adhesive comprises:
a tensile strength of between 690 psi to 1035 psi; and
a tear strength (Die B) of between 31 lb/in to 190 lb/in.
7 . The method of claim 1 , further comprising the flexible adhesive comprising a silicone.
8 . The method of claim 1 , wherein;
the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec; and
the adhesive comprises:
a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and
an elongation of between 120% and 670%.
9 . The method of claim 1 , further comprising fluid channels within the tiles and the gap defining a fluid path for communicating a coolant through the heat sink.
10 . A method for forming a heat sink for induction welding, the method comprising:
spacing a number of tiles into a single layer within a frame having a jig;
removing the jig;
applying a flexible adhesive between the tiles; and
subsequently curing the flexible adhesive.
11 . The method of claim 10 , further comprising priming the tiles with a primer.
12 . The method of claim 11 , wherein:
priming the tiles includes priming the tiles with a silicone primer: and
the flexible adhesive comprises:
a long-term degradation temperature greater than about 570 degrees Fahrenheit in air; and
an elongation of between 120% and 670%.
13 . The method of claim 10 , further comprising providing the number of tiles that are electrically non-conductive and thermally conductive prior to spacing the number of tiles within the frame.
14 . The method of claim 10 , wherein spacing the tiles within the frame includes spacing the tiles on a backing material comprising a glass disposed under the frame.
15 . The method of claim 14 , wherein;
spacing the tiles on the backing material includes adhering the tiles to the backing material; and
the flexible adhesive comprises:
a tensile strength of between 690 psi to 1035 psi; and
a tear strength (Die B) of between 31 lb/in to 190 lb/in.
16 . The method of claim 15 , further comprising disposing cooling channels within the flexible adhesive.
17 . The method of claim 16 , further comprising removing the backing material after curing the flexible adhesive.
18 . The method of claim 10 , wherein the flexible adhesive forms a joint between the tiles at edges of the tiles and the flexible adhesive is comprised of silicon.
19 . The method of claim 10 wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec.
20 . The method of claim 10 , further comprising disposing a fluid path defined by fluid channels within the tiles and the flexible adhesive for communicating a coolant through the heat sink.