Bipolar junction transistors and P-N junction diodes including stacked nano-semiconductor layers
Integrated circuit devices including a bipolar junction transistor (BJT) and/or a P-N junction diode are provided. The integrated circuit devices may include a first stack including first and second semiconductor regions that are spaced apart from each other in a horizontal direction and have a first conductivity type and a plurality of nano-semiconductor layers that are stacked in a vertical direction and are between the first and second semiconductor regions. The plurality of nano-semiconductor layers each have a second conductivity type, and the first semiconductor region may include a side surface facing the plurality of nano-semiconductor layers. The integrated circuit device may also include a vertical semiconductor layer having the second conductivity type and a conductive contact that contacts the plurality of nano-semiconductor layers. The vertical semiconductor layer may contact the side surface of the first semiconductor region and the plurality of nano-semiconductor layers.
1 . An integrated circuit device including a bipolar junction transistor (BJT) and/or a P-N junction diode, the integrated circuit device comprising:
a first stack comprising:
first and second semiconductor regions that are spaced apart from each other in a horizontal direction and have a first conductivity type;
a plurality of nano-semiconductor layers that are stacked in a vertical direction and are between the first and second semiconductor regions, wherein the plurality of nano-semiconductor layers each have a second conductivity type different from the first conductivity type, and the first semiconductor region comprises a side surface facing the plurality of nano-semiconductor layers;
a vertical semiconductor layer having the second conductivity type, wherein the vertical semiconductor layer contacts the side surface of the first semiconductor region and the plurality of nano-semiconductor layers; and
a conductive contact that directly contacts the plurality of nano-semiconductor layers.
2 . The integrated circuit device of claim 1 , wherein the conductive contact is spaced apart from the vertical semiconductor layer.
3 . The integrated circuit device of claim 1 , further comprising a contact insulator that separates the conductive contact from the vertical semiconductor layer.
4 . The integrated circuit device of claim 1 , wherein the plurality of nano-semiconductor layers extend through the conductive contact in the horizontal direction.
5 . The integrated circuit device of claim 1 , wherein the plurality of nano-semiconductor layers and the vertical semiconductor layer comprise the same semiconductor material.
6 . The integrated circuit device of claim 5 , wherein the plurality of nano-semiconductor layers and the vertical semiconductor layer comprise the same dopant.
7 . The integrated circuit device of claim 1 , further comprising:
a substrate; and
a connection contact that is in the substrate and is electrically connected to the conductive contact.
8 . The integrated circuit device of claim 1 , wherein the first semiconductor region is a first conductivity type region of the BJT or the P-N junction diode, and
the plurality of nano-semiconductor layers and the vertical semiconductor layer are collectively a second conductivity type region of the BJT or the P-N junction diode.
9 . The integrated circuit device of claim 1 , wherein the second semiconductor region comprises a side surface facing the plurality of nano-semiconductor layers, and
wherein the vertical semiconductor layer is a first vertical semiconductor layer, and the first stack further comprises a second vertical semiconductor layer that contacts the side surface of the second semiconductor region and the plurality of nano-semiconductor layers.
10 . The integrated circuit device of claim 9 , wherein the plurality of nano-semiconductor layers and the first and second vertical semiconductor layers comprise the same semiconductor material.
11 . The integrated circuit device of claim 9 , wherein the conductive contact is spaced apart from the first and second vertical semiconductor layers.
12 . The integrated circuit device of claim 9 , wherein the first and second semiconductor regions are an emitter and a collector of the BJT, respectively, and
the plurality of nano-semiconductor layers and the first and second vertical semiconductor layers are collectively a base of the BJT.
13 . The integrated circuit device of claim 1 , wherein the plurality of nano-semiconductor layers are a plurality of first nano-semiconductor layers, and
the integrated circuit device further comprises a second stack comprising:
third and fourth semiconductor regions that are spaced apart from each other in the horizontal direction and each have the second conductivity type; and
a plurality of second nano-semiconductor layers that are stacked in the vertical direction and are between the third and fourth semiconductor regions, wherein the plurality of second nano-semiconductor layers comprise respective first side surfaces contacting the third semiconductor region and respective second side surfaces contacting the fourth semiconductor region.
14 . The integrated circuit device of claim 13 , wherein the conductive contact is a first conductive contact, and
the second stack further comprises a second conductive contact that is between the third and fourth semiconductor regions and contacts the plurality of second nano-semiconductor layers.
15 . The integrated circuit device of claim 13 , wherein the first side surfaces of the plurality of second nano-semiconductor layers contact a side surface of the third semiconductor region, and
the integrated circuit device further comprises an insulating spacer that contacts the side surface of the third semiconductor region, and the plurality of second nano-semiconductor layers extend through the insulating spacer in the horizontal direction.
16 . The integrated circuit device of claim 13 , wherein the integrated circuit device further comprises a substrate, and the first stack is between the substrate and the second stack, and
the integrated circuit device further comprises a connection contact that is in the substrate and is electrically connected to the plurality of first nano-semiconductor layers.
17 . The integrated circuit device of claim 13 , wherein the plurality of first nano-semiconductor layers and the plurality of second nano-semiconductor layers overlap each other in the vertical direction.
18 . The integrated circuit device of claim 13 , wherein the first and third semiconductor regions overlap each other in the vertical direction.
19 . The integrated circuit device of claim 1 , wherein the first stack comprises the BJT or the P-N junction diode, and the first stack is stacked with a dummy element.
20 . The integrated circuit device of claim 19 , wherein the integrated circuit device further comprises a substrate, and
the dummy element is between the first stack and the substrate.