Light emitting diode and method of fabricating the same
A light emitting diode and a method of fabricating the same are provided. The light emitting diode according to exemplary embodiments includes a lower n-type semiconductor layer, an active layer, a p-type semiconductor layer, a high-concentration n-type semiconductor layer, and an upper n-type semiconductor layer. The high concentration n-type semiconductor layer can have a higher n-type doping concentration than that of the lower or upper n-type semiconductor layer. Oxygen concentrations on a lower surface and an upper surface of the high-concentration n-type semiconductor layer may be substantially same. An electron blocking layer may be interposed between the active layer and the p-type semiconductor layer.
1 . A light emitting diode, comprising:
a lower n-type semiconductor layer;
an active layer disposed on the lower n-type semiconductor layer;
a p-type semiconductor layer disposed on the active layer;
a high-concentration n-type semiconductor layer disposed on the p-type semiconductor layer; and
an upper n-type semiconductor layer disposed on the high-concentration n-type semiconductor layer, wherein:
the high-concentration n-type semiconductor layer has a higher n-type doping concentration than that of the lower or upper n-type semiconductor layer, and
oxygen concentrations on a lower surface and an upper surface of the high-concentration n-type semiconductor layer are substantially same.
2 . The light emitting diode of claim 1 ,
wherein the upper n-type semiconductor layer has a roughened surface on its upper surface.
3 . The light emitting diode of claim 1 , further comprising:
a high concentration p-type semiconductor layer interposed between the p-type semiconductor layer and the high concentration n-type semiconductor layer,
wherein the high-concentration p-type semiconductor layer has a higher p-type doping concentration than that of the p-type semiconductor layer.
4 . The light emitting diode of claim 1 , further comprising:
a first contact layer in contact with the lower n-type semiconductor layer; and
a second contact layer in contact with the upper n-type semiconductor layer;
wherein the first and second contact layers include a layer of a same material in contact with the lower and upper n-type semiconductor layers.
5 . The light emitting diode of claim 1 , further comprising:
an electron blocking layer interposed between the active layer and the p-type semiconductor layer.
6 . The light emitting diode of claim 1 , comprising:
a mesa disposed on the lower n-type semiconductor layer, including the active layer, the p-type semiconductor layer, the high-concentration n-type semiconductor layer, and the upper n-type semiconductor layer, and having a plurality of via holes exposing the lower n-type semiconductor layer;
lower n-ohmic contact layers in contact with the lower n-type semiconductor layer in the via holes;
an upper n-ohmic contact layer in contact with the upper n-type semiconductor layer;
a first pad metal layer electrically connected to the lower n-ohmic contact layers;
a second pad metal layer electrically connected to the upper n-ohmic contact layer;
a first bump electrically connected to the first pad metal layer; and
a second bump electrically connected to the second pad metal layer,
wherein the second pad metal layer is formed to surround the first pad metal layer.
7 . The light emitting diode of claim 6 ,
wherein the first pad metal layer covers the via holes.
8 . The light emitting diode of claim 7 ,
wherein the second pad metal layer is disposed between the via holes and an edge of the mesa.
9 . The light emitting diode of claim 7 , further comprising:
a lower insulation layer covering the upper n-ohmic contact layer and the lower n-ohmic contact layers, wherein:
the lower insulation layer has openings exposing the upper n-ohmic contact layer and the lower n-ohmic contact layers, and
the first pad metal layer and the second pad metal layer are electrically connected to the lower n-ohmic contact layers and the upper n-ohmic contact layer through the openings of the lower insulation layer, respectively.
10 . The light emitting diode of claim 9 , further comprising:
an upper insulation layer covering the first and second pad metal layers, wherein the upper insulation layer has openings exposing the first pad metal layer and the second pad metal layer,
the first bump and the second bump are disposed on the upper insulation layer, and electrically connected to the first pad metal layer and the second pad metal layer through the openings of the upper insulation layer.
11 . A light emitting diode, comprising:
a lower n-type semiconductor layer;
a mesa including:
an active layer disposed on the lower n-type semiconductor layer;
an electron blocking layer disposed on the active layer;
a p-type semiconductor layer disposed on the electron blocking layer;
a high-concentration n-type semiconductor layer disposed on the p-type semiconductor layer; and
an upper n-type semiconductor layer disposed on the high-concentration n-type semiconductor layer;
a first pad metal layer electrically connected to a first semiconductor layer;
a second pad metal layer electrically connected to a second semiconductor layer that differs from the first semiconductor layer;
a first bump electrically connected to the first pad metal layer; and
a second bump electrically connected to the second pad metal layer,
wherein the second pad metal layer is formed to surround the first pad metal layer, and
wherein the high-concentration n-type semiconductor layer has a higher n-type doping concentration than that of the lower or upper n-type semiconductor layer.
12 . The light emitting diode of claim 11 ,
wherein the upper n-type semiconductor layer has a roughened surface on its upper surface.
13 . The light emitting diode of claim 11 , further comprising:
a high concentration p-type semiconductor layer interposed between the p-type semiconductor layer and the high concentration n-type semiconductor layer,
wherein the high-concentration p-type semiconductor layer has a higher p-type doping concentration than that of the p-type semiconductor layer.
14 . The light emitting diode of claim 11 , further comprising:
a first contact layer in contact with the lower n-type semiconductor layer; and
a second contact layer in contact with the upper n-type semiconductor layer;
wherein the first and second contact layers include a layer of a same material in contact with the lower and upper n-type semiconductor layers.
15 . The light emitting diode of claim 11 ,
wherein the mesa is disposed on the lower n-type semiconductor layer and includes a plurality of via holes exposing the lower n-type semiconductor layer;
the light emitting diode comprising:
lower n-ohmic contact layers in contact with the lower n-type semiconductor layer in the via holes; and
an upper n-ohmic contact layer in contact with the upper n-type semiconductor layer;
wherein the first pad metal layer is electrically connected to the lower n-ohmic contact layers; and
wherein the second pad metal layer is electrically connected to the upper n-ohmic contact layer.
16 . The light emitting diode of claim 11 ,
wherein the mesa includes a via hole exposing the lower n-type semiconductor layer, and
wherein the first pad metal layer covers the via hole.
17 . The light emitting diode of claim 11 ,
wherein the mesa includes a plurality of via holes exposing the lower n-type semiconductor layer, and
wherein the second pad metal layer is disposed between the plurality of via holes and an edge of the mesa.
18 . The light emitting diode of claim 11 ,
wherein the mesa includes a via hole exposing the lower n-type semiconductor layer;
the light emitting diode further comprising:
a lower n-ohmic contact layer in contact with the lower n-type semiconductor layer in the via hole;
an upper n-ohmic contact layer in contact with the upper n-type semiconductor layer; and
a lower insulation layer covering the upper n-ohmic contact layer and the lower n-ohmic contact layer, wherein:
the lower insulation layer has openings exposing the upper n-ohmic contact layer and the lower n-ohmic contact layer, and
the first pad metal layer and the second pad metal layer are electrically connected to the lower n-ohmic contact layer and the upper n-ohmic contact layer through the openings of the lower insulation layer, respectively.
19 . The light emitting diode of claim 18 , further comprising:
an upper insulation layer covering the first and second pad metal layers, wherein the upper insulation layer has openings exposing the first pad metal layer and the second pad metal layer,
the first bump and the second bump are disposed on the upper insulation layer, and electrically connected to the first pad metal layer and the second pad metal layer through the openings of the upper insulation layer.
20 . A light emitting diode, comprising:
a lower n-type semiconductor layer;
an active layer disposed on the lower n-type semiconductor layer;
an electron blocking layer disposed on the active layer;
a p-type semiconductor layer disposed on the electron blocking layer;
a high-concentration n-type semiconductor layer disposed on the p-type semiconductor layer; and
an upper n-type semiconductor layer disposed on the high-concentration n-type semiconductor layer,
wherein the high-concentration n-type semiconductor layer has a higher n-type doping concentration than that of the lower or upper n-type semiconductor layer;
wherein the high-concentration n-type semiconductor layer is a gallium nitride-based semiconductor layer having a same composition as that of the p-type semiconductor layer; and
wherein oxygen concentrations on a lower surface and an upper surface of the high-concentration n-type semiconductor layer are substantially same.