Apparatuses and methods for bridge-based packaging with direct power delivery
The disclosed computer-implemented apparatus for bridge-based packaging with direct power delivery can include an first layer stacked on a second layer. The second layer can include an interposer die and a connection die. The first layer can include a chiplet die positioned above the interposer die and a first-layer bridge die spanning across the interposer die and the connection die. The interposer die can include a set of physical interfaces and a set of routing features configured to route signals from the set of physical interfaces to the first-layer bridge die. Various other apparatuses, systems, and methods of manufacture are also disclosed.
1 . An apparatus for bridge-based packaging with direct power delivery, the apparatus comprising:
a first layer parallel and adjacent to a second layer, wherein:
the second layer comprises:
an interposer die; and
a connection die;
the first layer comprises:
a first-layer bridge die spanning across the interposer die and the connection die, the first-layer bridge die being parallel to and adjacent to the interposer die; and
the interposer die comprises:
a set of routing features configured to route signals from the interposer die to the first-layer bridge die.
2 . The apparatus of claim 1 , wherein the connection die is configured to route signals from the first-layer bridge die to a fanout bridge below the connection die.
3 . The apparatus of claim 2 , wherein the connection die comprises a set of vias configured to route signals from the first-layer bridge die to the fanout bridge.
4 . The apparatus of claim 1 , wherein:
the interposer die comprises an active die; and
the first layer further comprises a chiplet die which comprises an active die.
5 . The apparatus of claim 1 , wherein the first-layer bridge die comprises a passive die.
6 . The apparatus of claim 1 , wherein the connection die comprises a passive die.
7 . The apparatus of claim 1 , wherein at least one of the first-layer bridge die and the connection die comprises an active die comprising circuitry configured to implement a built-in self-test.
8 . The apparatus of claim 1 , wherein the set of routing features comprises a set of vias.
9 . The apparatus of claim 8 , wherein the set of vias comprises, for each logical connection from a set of physical interfaces, a subset of vias connected in parallel.
10 . A system for bridge-based packaging with direct power delivery, the system comprising:
a substrate;
a mold coupled to the substrate, the mold comprising:
a fanout bridge; and
a set of electrical connectivity elements;
a multi-layer module coupled to the mold, the multi-layer module comprising:
a second layer comprising:
an interposer die; and
a connection die above a first side of the fanout bridge; and
an first layer parallel and adjacent to the second layer comprising:
a first-layer bridge die spanning across the interposer die and the connection die, the first-layer bridge die being parallel and adjacent to the interposer die;
wherein the interposer die comprises:
a set of routing features configured to route signals from the interposer die to the first-layer bridge die.
11 . The system of claim 10 , wherein a subset of the set of electrical connectivity elements are below a set of physical interfaces.
12 . The system of claim 10 , further comprising a connected module stacked on the mold and at least in part over a second side of the fanout bridge.
13 . The system of claim 10 , wherein the connection die comprises a set of vias configured to route signals from the first-layer bridge die to the fanout bridge.
14 . The system of claim 11 , wherein:
the interposer die comprises an active die; and
the first layer further comprises a chiplet die which comprises an active die.
15 . The system of claim 11 , wherein the first-layer bridge die comprises a passive die.
16 . The system of claim 11 , wherein the connection die comprises a passive die.
17 . The system of claim 11 , wherein at least one of the first-layer bridge die and the connection die comprises an active die comprising circuitry configured to implement a built-in self-test.
18 . The system of claim 11 , wherein the set of routing features comprises a set of vias.
19 . The system of claim 11 , wherein the multi-layer module comprises a chip-on-wafer module.
20 . The apparatus of claim 1 , wherein the set of routing features comprises a set of through silicon vias running through at least one layer of the interposer die and to the first-layer bridge die.