Transversely-excited film bulk acoustic filters with excess piezoelectric material removed
Filter devices and fabrication methods are disclosed. A filter device includes a piezoelectric plate and a conductor pattern on a front surface of the piezoelectric plate. The conductor pattern includes interdigital transducers (IDTs) of a plurality of transversely-excited film bulk acoustic resonators (XBARs) and a plurality of conductors connecting the plurality of XBARs in a ladder filter circuit architecture. The plurality of conductors includes a first conductor adjacent to a second conductor. An opening is provided through the piezoelectric plate between the first conductor and the second conductor.
1. A filter device comprising:
a piezoelectric layer;
a conductor pattern on a surface of the piezoelectric layer, the conductor pattern comprising:
interdigital transducers (IDTs) of a plurality of transversely-excited film bulk acoustic resonators (XBARs), and
a plurality of conductors connecting the IDTs of the plurality of XBARs in a ladder filter circuit architecture, the plurality of conductors including a first conductor adjacent to a second conductor; and
an opening through the piezoelectric layer between the first conductor and the second conductor,
wherein the opening comprises a width that is less than a distance between the first conductor and the second conductor.
2. The filter device of claim 1 , further comprising:
a substrate,
wherein the piezoelectric layer is attached to the substrate, and
wherein interleaved fingers of each of the plurality of IDTs are on respective portions of the piezoelectric layer that span respective cavities in the substrate.
3. The filter device of claim 2 , wherein:
the substrate comprises a base and an intermediate layer between the base and the piezoelectric layer, and
the cavities are in the intermediate layer.
4. The filter device of claim 3 , wherein all of the intermediate layer is removed where the opening extends through the piezoelectric layer between the first conductor and the second conductor.
5. The filter device of claim 1 , further comprising one or more additional openings through the piezoelectric layer between other adjacent conductors of the plurality of conductors.
6. The filter device of claim 1 , further comprising additional openings through the piezoelectric layer between all other pairs of adjacent conductors of the plurality of conductors.
7. The filter device of claim 1 , wherein the first conductor is a signal conductor and the second conductor is a ground conductor.
8. The filter device of claim 1 , wherein the first conductor and the second conductor are signal conductors.
9. A method for fabricating a filter device comprising:
forming a conductor pattern on a surface of a piezoelectric layer, the conductor pattern comprising:
interdigital transducers (IDTs) of a plurality of transversely-excited film bulk acoustic resonators (XBARs), and
a plurality of conductors connecting the IDTs of the plurality of XBARs in a ladder filter circuit architecture, the plurality of conductors including a first conductor adjacent to a second conductor; and
forming an opening through the piezoelectric layer between the first conductor and the second conductor,
wherein the opening comprises a width that is less than a distance between the first conductor and the second conductor.
10. The method of claim 9 , wherein the first conductor is a signal conductor and the second conductor is a ground conductor.
11. The method of claim 9 , wherein the first conductor and the second conductor are signal conductors.
12. The method of claim 9 , wherein the opening encompasses practically all of an area between adjacent portions of the first and second conductors.
13. The method of claim 9 , wherein forming the opening further comprises forming one or more additional openings through the piezoelectric layer between other adjacent conductors from the plurality of conductors.
14. The method of claim 9 , wherein forming the opening further comprises forming additional openings through the piezoelectric layer between all other pairs of adjacent conductors from the plurality of conductors.
15. The method of claim 9 , further comprising:
attaching the piezoelectric layer to a substrate,
wherein interleaved fingers of the plurality of IDTs are on a respective portions of the piezoelectric layer that span respective cavities in the substrate.
16. The method of claim 9 , wherein:
the substrate comprises a base and an intermediate layer between the base and the piezoelectric layer, and
the cavities are in the intermediate layer.
17. The method of claim 16 , further comprising removing all of the intermediate layer to form the opening that extends through the piezoelectric layer between the first conductor and the second conductor.
18. A filter device comprising:
a piezoelectric layer;
a conductor pattern on a surface of the piezoelectric layer, the conductor pattern comprising:
interdigital transducers (IDTs) of a plurality of transversely-excited film bulk acoustic resonators (XBARs), and
a plurality of conductors connecting the IDTs of the plurality of XBARs in a ladder filter circuit architecture, the plurality of conductors including a first conductor adjacent to a second conductor; and
an opening through the piezoelectric layer between the first conductor and the second conductor,
wherein the opening encompasses practically all of an area between adjacent portions of the first and second conductors.
19. The filter device of claim 18 , wherein the opening that encompasses practically all of the area between adjacent portions of the first and second conductors is as large an area as possible as limited by manufacturing tolerances of the filter device.