Bottom contact formation for 4F
View Patent ↗Disclosed herein are approaches for forming contacts in a 4F 2 vertical dynamic random-access memory device. One method includes providing a plurality of fins extending from a substrate, forming a spacer layer over the plurality of fins, and etching the substrate to expose a base portion of the plurality of fins. The method may include forming a doped layer along the base portion of the plurality of fins and along an upper surface of the substrate, and forming an oxide spacer over the doped layer.
1. A method, comprising:
providing a plurality of fins extending from a substrate in a first direction;
forming a spacer layer over the plurality of fins;
etching the substrate to expose a base portion of the plurality of fins, wherein a thickness, in a second direction, of the base portion of the plurality of fins and an upper portion of the plurality of fins is the same, and wherein the second direction is perpendicular to the first direction;
forming a conformal doped layer along an upper surface of the substrate and along the base portion of the plurality of fins having the same thickness as the upper portion of the plurality fins, wherein the conformal doped layer defines a trench; and
forming an oxide spacer over the conformal doped layer, including within the trench.
2. The method of claim 1 , further comprising:
removing the spacer layer from over the plurality of fins;
forming a gate oxide layer over the plurality of fins; and
forming a gate material over the gate oxide layer.
3. The method of claim 2 , further comprising forming the gate oxide layer over the oxide spacer.
4. The method of claim 1 , further comprising forming a source in an upper portion of the plurality of fins and forming a drain in the conformal doped layer.
5. The method of claim 1 , wherein forming the spacer layer over the plurality of fins comprises:
forming an oxide layer over an outer surface of each of the plurality of fins; and
forming a nitride layer over the oxide layer.
6. The method of claim 1 , wherein forming the conformal doped layer comprises doping the base portion of the plurality of fins and the upper surface of the substrate using a plasma doping process.
7. The method of claim 1 , wherein etching the substrate to expose the base portion of the plurality of fins further comprises recessing the upper surface of the substrate.
8. A method of forming a dynamic random-access memory device, the method comprising:
providing a plurality of fins extending from a substrate in a first direction;
forming a spacer layer over the plurality of fins;
etching the substrate to expose a base portion of the plurality of fins, wherein a thickness, in a second direction, of the base portion of the plurality of fins and an upper portion of the plurality of fins is the same, and wherein the second direction is perpendicular to the first direction;
forming, using a plasma doping process, a conformal doped layer along an upper surface of the substrate and along the base portion of the plurality of fins having the same thickness as the upper portion of the plurality fins, wherein the conformal doped layer defines a trench; and
forming an oxide spacer over the conformal doped layer, including within the trench.
9. The method of claim 8 , further comprising:
removing the spacer layer from over the plurality of fins;
forming a gate oxide layer over the plurality of fins; and
forming a gate material over the gate oxide layer.
10. The method of claim 9 , further comprising forming the gate oxide layer over the oxide spacer.
11. The method of claim 8 , further comprising forming a source in an upper portion of the plurality of fins and forming a drain in the conformal doped layer.
12. The method of claim 8 , wherein forming the spacer layer over the plurality of fins comprises:
forming an oxide layer over an outer surface of each of the plurality of fins; and
forming a nitride layer over the oxide layer.
13. A method of forming a 4F 2 vertical dynamic random-access memory device, the method comprising:
providing a plurality of pillars extending from an upper surface of a substrate in a first direction;
forming a spacer layer over the plurality of pillars;
exposing a base portion of the plurality of pillars by etching the upper surface of the substrate, wherein a thickness, in a second direction, of the base portion of the plurality of fins and an upper portion of the plurality of fins is the same, and wherein the second direction is perpendicular to the first direction;
forming, using a plasma doping process, a conformal doped layer along an upper surface of the substrate and along the base portion of the plurality of fins having the same thickness as the upper portion of the plurality fins, wherein the conformal doped layer defines a trench; and
forming an oxide spacer over the conformal doped layer.
14. The method of claim 13 , further comprising:
removing the spacer layer from over the plurality of pillars;
forming a gate oxide layer over the plurality of pillars; and
forming a gate material over the gate oxide layer.
15. The method of claim 14 , further comprising forming the gate oxide layer over the oxide spacer.
16. The method of claim 13 , further comprising forming a source in an upper portion of the plurality of pillars and forming a drain in the conformal doped layer.
17. The method of claim 13 , wherein forming the spacer layer over the plurality of pillars comprises:
forming an oxide layer over an outer surface of each of the plurality of pillars; and
forming a nitride layer over the oxide layer.