Fabricating equipment for semiconductor device and method for fabricating semiconductor device
A fabricating equipment and method for a semiconductor device is provided. The fabricating equipment comprises a process chamber including an internal space, a substrate support which supports a substrate including a first film and a second film, inside the internal space, a nozzle which is placed on the substrate support and supplies a process gas, a first heater which is placed inside the substrate support and heats the substrate and a second heater which generates one of waves of a first frequency and waves of a second frequency to differentially heat the first film and the second film.
1 . A method for fabricating a semiconductor device, the method comprising:
providing a substrate on which a first layer having a maximum dielectric loss value at a first frequency and a second layer having a maximum dielectric loss value at a second frequency different from the first frequency are formed;
providing waves of the first frequency from a heater to the substrate to heat a temperature of the first layer to be higher than the temperature of the second layer;
while the temperature of the first layer is higher than the temperature as a result of the heating of the second layer, forming a third layer, which is thinner than the first layer and is thinner than the second layer, on the heated first layer and not on the second layer,
providing, from the heater, waves of a second frequency different from the first frequency to the substrate to heat the temperature of the second layer to be higher than the temperature of the first layer; and
while the temperature of the second layer is higher than the temperature of the first layer as a result of the heating, forming a fourth layer thinner than the first layer and thinner than the second layer on the heated second layer and not on the first layer.
2 . The method of claim 1 , wherein the heater is a light source that provides light to the first layer and the second layer.
3 . The method of claim 1 , wherein the first layer is a conductive layer, and the second layer is an insulating layer.
4 . The method of claim 3 , wherein the conductive layer is a capacitor electrode having an exposed side surface and an exposed top surface, and the third layer is formed on the exposed side surface and the exposed top surface.
5 . The method of claim 4 , wherein the semiconductor device is a DRAM chip.
6 . The method of claim 1 , wherein the third layer is a thin film deposited using a process gas.
7 . The method of claim 1 , wherein the heater is a second heater, and further comprising:
heating the substrate with a first heater disposed below the substrate; and
forming the third layer as part of a temperature-dependent selective deposition in a process chamber including an internal space to which the waves are propagated.
8 . The method of claim 7 , wherein the first heater is a heater that uses a Joule heating method.
9 . A method for fabricating a semiconductor device by using temperature-dependent selective deposition in a process chamber including an internal space, a first heater, and a second heater, the method comprising:
providing a substrate on a substrate support in the process chamber;
forming a first integrated circuit component on the substrate, the first integrated circuit component formed of a first material;
forming a second integrated circuit component on the substrate, the second integrated circuit component formed of a second material;
applying heat from the first heater to the first integrated circuit component and second integrated circuit component simultaneously;
providing at least one of an electromagnetic wave and a magnetic field from the second heater to the first integrated circuit component and the second integrated circuit component simultaneously, to heat a temperature of the first integrated circuit component to be higher than the temperature of the second integrated circuit component; and
depositing a layer on the first integrated circuit component having the higher temperature,
wherein the first integrated circuit component is formed of a conductive material, and the second integrated circuit component is formed of an insulating material.
10 . The method of claim 9 , wherein the first integrated circuit component is an electrode of a capacitor and the second integrated circuit component is a supporter film connected to the electrode.
11 . The method of claim 10 , wherein the semiconductor device is a DRAM chip.
12 . The method of claim 9 , wherein providing at least one of an electromagnetic wave and a magnetic field from the second heater includes providing light having a wavelength that causes the first integrated circuit component to increase in temperature more than the second integrated circuit component.
13 . The method of claim 9 , wherein the first heater is below the substrate support, and the second heater is spaced apart from the substrate support.
14 . The method of claim 9 , wherein the first heater is a heater that uses a Joule heating method.
15 . A method for fabricating a semiconductor device by using temperature-dependent selective deposition in a process chamber including an internal space and a heater, the method comprising:
providing a substrate on a substrate support in the process chamber;
forming electrodes on the substrate and forming a supporter film between the electrodes and supporting the electrodes on the substrate;
providing at least one of an electromagnetic wave and a magnetic field from the heater to the electrodes and the supporter film simultaneously, to heat a temperature of the electrodes to be higher than the temperature of the supporter film; and
using a process gas, depositing a layer along surfaces of the electrodes having the higher temperature resulting from the heating, and not depositing the layer along surfaces of the supporter film.
16 . The method of claim 15 , wherein the electrodes are capacitor electrodes.