Photosensor having a scattering structure comprises circular ring and peripheral patterns
A photosensor provided herein includes a sensing structure and a microlens. The sensing structure includes an epitaxial layer, a deep trench and a scattering structure. The epitaxial layer has an illuminated surface and a non-illuminated surface. The deep trench isolation is located along an edge of the epitaxial layer. The scattering structure is embedded in the epitaxial layer and extends inwardly from the illuminated surface. The scattering structure includes a first circular ring pattern and a peripheral pattern. The deep trench isolation surrounds the scattering structure, the peripheral pattern is connected with the deep trench isolation and the first circular ring pattern is separated from the peripheral pattern and the deep trench isolation. The microlens is disposed on the epitaxial layer, wherein the illuminated surface of the epitaxial layer is relatively close to the microlens than the non-illuminated surface.
1. A photosensor, comprising:
a sensing structure including:
an epitaxial layer having an illuminated surface and a non-illuminated surface;
a deep trench isolation located along an edge of the epitaxial layer;
a scattering structure embedded in the epitaxial layer and extending inwardly from the illuminated surface, wherein the scattering structure comprises a first circular ring pattern and a peripheral pattern, wherein the deep trench isolation surrounds the scattering structure, the peripheral pattern is connected with the deep trench isolation and the first circular ring pattern is separated from the peripheral pattern and the deep trench isolation; and
a microlens disposed on the sensing structure, wherein the illuminated surface of the epitaxial layer is relatively close to the microlens than the non-illuminated surface.
2. The photosensor according to claim 1 , wherein a material of the scattering structure is different from the epitaxial layer.
3. The photosensor according to claim 1 , wherein the scattering structure has taper sidewalls.
4. The photosensor according to claim 1 , wherein a depth of the deep trench isolation is not less than a depth of the scattering structure.
5. The photosensor according to claim 1 , wherein the scattering structure further comprises a second circular ring pattern, wherein the first circular ring pattern and the second circular ring pattern are centered at a center point, and a radius of the first circular ring pattern is different from a radius of the second circular ring pattern.
6. The photosensor according to claim 1 , wherein the scattering structure further comprises a traversal pattern extending in an extending direction traversing the first circular ring pattern, and the first circular ring pattern is centered at a center point and the traversal pattern extends across the center point.
7. The photosensor according to claim 6 , wherein the peripheral pattern is located at a terminal of the traversal pattern.
8. The photosensor according to claim 6 , wherein the traversal pattern extends along the extending directions substantially parallel to a side edge of the sensing structure.
9. The photosensor according to claim 6 , wherein the traversal pattern extends along an extending direction substantially parallel to a diagonal line of the sensing structure.
10. The photosensor according to claim 6 , wherein terminals of the traversal pattern are connected to the deep trench isolation.
11. The photosensor according to claim 1 , wherein the epitaxial layer comprises a first doped region and a second doped region laterally spaced from the first doped region by a gap.
12. The photosensor according to claim 11 , wherein the sensing structure further comprises a gate structure and a floating diffusion contact, the gate structure is disposed on the epitaxial layer and located corresponding to the gap between the first doped region and the second doped region and the floating diffusion contact is disposed on the epitaxial layer and in contact with the second doped region.
13. The photosensor according to claim 12 , further comprising an interconnect structure, wherein the interconnect structure is electrically connected to the gate structure and the floating diffusion contact.
14. The photosensor according to claim 12 , wherein the first doped region and the second doped region are disposed close to the non-illuminated surface of the epitaxial layer.
15. The photosensor according to claim 12 , wherein the first doped region and the second doped region are disposed close to the illuminated surface of the epitaxial layer.
16. The photosensor according to claim 15 , wherein the scattering structure is embedded in the first doped region.
17. The photosensor according to claim 11 , wherein the first doped region comprises a first doped layer and a second doped layer on top of the first doped layer, and a dopant type of the first doped layer and a dopant type of the second doped layer are different.
18. The photosensor according to claim 17 , wherein a dopant type of the second doped region is the same as the dopant type of the first doped layer.
19. The photosensor according to claim 1 , further comprising an optical layer disposed between the microlens and the sensing structure.
20. The photosensor according to claim 1 , wherein a top of the scattering structure is coplanar with a top of the epitaxial layer.