Method of manufacturing a semiconductor device and pattern formation method
A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate. A first precursor and a second precursor are combined. The first precursor is an organometallic having a formula: M a R b X c , where M is one or more of Sn, Bi, Sb, In, and Te, R is one or more of a C7-C11 aralkyl group, a C3-C10 cycloalkyl group, a C2-C10 alkoxy group, and a C2-C10 alkylamino group, X is one or more of a halogen, a sulfonate group, and an alkylamino group, and 1≤a≤2, b≥1, c≥1, and b+c≤4, and the second precursor is one or more of water, an amine, a borane, and a phosphine. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern. The latent pattern is developed by applying a developer to the selectively exposed photoresist layer.
1. A method of manufacturing a semiconductor device, comprising:
forming a photoresist layer over a substrate,
wherein the forming the photoresist layer comprises:
combining a first precursor and a second precursor to form a photoresist material,
wherein the first precursor is an organometallic selected from the group consisting of
and
the second precursor is one or more selected from the group consisting of water, an amine, a borane, and a phosphine; and
depositing the photoresist layer over the substrate;
selectively exposing the photoresist layer to actinic radiation to form a latent pattern; and
developing the latent pattern by applying a developer to the selectively exposed photoresist layer to form a pattern in the photoresist layer.
2. The method according to claim 1 , wherein the actinic radiation is extreme ultraviolet radiation.
3. The method according to claim 1 , further comprising after selectively exposing the photoresist layer to actinic radiation to form a latent pattern and before developing the latent pattern, heating the photoresist layer at a temperature ranging from 50° C. to 300° C.
4. The method according to claim 1 , wherein the photoresist material is deposited over the substrate by atomic layer deposition (ALD) or chemical vapor deposition (CVD).
5. The method according to claim 1 , wherein the developer is a dry developer.
6. The method according to claim 5 , wherein the developer is a plasma or a chemical vapor.
7. The method according to claim 1 , further comprising before selectively exposing the photoresist layer to actinic radiation to form a latent pattern, heating the photoresist layer at a temperature ranging from 40° C. to 120° C.
8. The method according to claim 1 , wherein the second precursor is ammonia.
9. The method according to claim 1 , wherein the second precursor is hydrazine.
10. A method of manufacturing a semiconductor device, comprising:
combining a first precursor and a second precursor in a vapor state to form a photoresist material,
wherein the first precursor is selected from the group consisting of
and
the second precursor is one or more selected from the group consisting of water, an amine, a borane, and a phosphine;
depositing the photoresist material over a target layer to be patterned to form a photoresist layer;
selectively exposing the photoresist layer to actinic radiation; and
applying a developer to the selectively exposed photoresist layer to form a pattern in the photoresist layer.
11. The method according to claim 10 , wherein the second precursor is ammonia.
12. The method according to claim 10 , wherein the actinic radiation is extreme ultraviolet radiation.
13. The method according to claim 10 , further heating the photoresist layer at a temperature ranging from 50° C. to 300° C. after selectively exposing the photoresist layer to actinic radiation and before applying the developer.
14. The method according to claim 10 , wherein the photoresist material is deposited over the target layer to be patterned by atomic layer deposition (ALD) or chemical vapor deposition (CVD).
15. The method according to claim 10 , wherein the developer is plasma or a chemical vapor.
16. A method of manufacturing a semiconductor device, comprising:
forming a resist layer over a target layer to be patterned,
wherein the resist layer comprises a reaction product of a first precursor and a second precursor,
wherein the first precursor is selected from the group consisting of
and
the second precursor is one or more selected from the group consisting of water, an amine, a borane, and a phosphine; and
patterning the resist layer.
17. The method according to claim 16 , further comprising before patterning the resist layer, heating the resist layer at a temperature ranging from 40° C. to 120° C.
18. The method according to claim 16 , wherein the second precursor is water vapor.
19. The method according to claim 16 , wherein the resist layer is deposited over target layer by atomic layer deposition (ALD) or chemical vapor deposition (CVD).
20. The method according to claim 16 , wherein the patterning the resist layer further comprises:
patternwise exposing the resist layer to actinic radiation to form a latent pattern; and
applying a developer to the latent pattern to form a pattern in the resist layer.