IP Library Granted Patent US 12,026,008
Granted Patent B2
US 12,026,008 · App. 17/973,428 · Granted Jul 2, 2024

Techniques for clock signal transmission in integrated circuits and interposers

Inventors: Jeffrey Chromczak (Toronto, CA); Chooi Pei Lim (Penang, MY); Lai Guan Tang (Penang, MY); Chee Hak Teh (Penang, MY); MD Altaf Hossain (Portland, OR); Dheeraj Subbareddy (Portland, OR); Ankireddy Nalamalpu (Portland, OR)
Assignee: Altera Corporation
G06F1/10H01L23/3114H01L23/5381H01L24/14H01L24/16H01L2224/14131H01L2224/14133H01L2224/14515H01L2224/16227
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Quick Facts
Patent No.
US 12,026,008
App. No.
17/973,428
Granted
Jul 2, 2024
Kind
B2
Abstract

An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.

Claims (31)

1. A method for transmitting input clock signals and output clock signals using a first integrated circuit die, wherein the method comprises:

enabling input buffer circuits in the first integrated circuit die during an input mode of operation in response to first control signals;

disabling output buffer circuits in the first integrated circuit die during the input mode of operation in response to second control signals;

transmitting the input clock signals from a second integrated circuit die through an interposer, through conductive bumps, and through the input buffer circuits into the first integrated circuit die during the input mode of operation;

enabling the output buffer circuits in the first integrated circuit die during an output mode of operation in response to the second control signals, wherein each of the input buffer circuits and each of the output buffer circuits is coupled to one of the conductive bumps; and

transmitting the output clock signals from the first integrated circuit die through the output buffer circuits, through the interposer, and through the conductive bumps into the second integrated circuit die during the output mode of operation.

2. The method of claim 1 , further comprising causing outputs of the input buffer circuits to be in weak pull-up or weak pull-down modes during the output mode of operation in response to the first control signals.

3. The method of claim 1 further comprising:

transmitting the output clock signals to inputs of the output buffer circuits through first multiplexer circuits during the output mode of operation.

4. The method of claim 3 further comprising:

transmitting the output clock signals to inputs of the first multiplexer circuits through second multiplexer circuits during the output mode of operation.

5. The method of claim 1 further comprising:

transmitting the input clock signals from outputs of the input buffer circuits to a logic circuit area through multiplexer circuits during the input mode of operation.

6. The method of claim 1 , wherein disabling the output buffer circuits during the input mode of operation further comprises causing the output buffer circuits to be in disabled modes during the input mode of operation in response to the second control signals.

7. The method of claim 1 , wherein the conductive bumps are arranged in pairs that alternate between pairs of power bumps.

8. The method of claim 7 , wherein the conductive bumps are arranged in pairs that alternate between pairs of ground bumps.

9. A circuit system comprising:

a first integrated circuit die comprising first input buffer circuits and first output buffer circuits;

a second integrated circuit die comprising second input buffer circuits and second output buffer circuits; and

an interposer coupled to the first integrated circuit die and to the second integrated circuit die, wherein the second output buffer circuits are enabled during a first output mode of operation in response to first control signals and the first input buffer circuits are enabled during a first input mode of operation in response to second control signals to transmit first clock signals from the second integrated circuit die through the interposer and through conductive bumps to the first integrated circuit die; and

wherein the first output buffer circuits are enabled during a second output mode of operation in response to third control signals and the second input buffer circuits are enabled during a second input mode of operation in response to fourth control signals to transmit second clock signals from the first integrated circuit die through the interposer and through the conductive bumps to the second integrated circuit die.

10. The circuit system of claim 9 , wherein the first input buffer circuits are disabled during the second output mode of operation in response to the second control signals, and wherein the second output buffer circuits are disabled during the second input mode of operation in response to the first control signals.

11. The circuit system of claim 10 , wherein the second input buffer circuits are disabled during the first output mode of operation in response to the fourth control signals, and wherein the first output buffer circuits are disabled during the first input mode of operation in response to the third control signals.

12. The circuit system of claim 9 , wherein the conductive bumps are arranged in pairs that alternate between pairs of power bumps.

13. The circuit system of claim 9 , wherein the conductive bumps are arranged in pairs that alternate between pairs of ground bumps.

14. The circuit system of claim 9 , wherein the first integrated circuit die further comprises first multiplexer circuits coupled to transmit the second clock signals to the first output buffer circuits during the second output mode of operation.

15. The circuit system of claim 14 , wherein the first integrated circuit die further comprises second multiplexer circuits coupled to transmit the second clock signals to the first multiplexer circuits during the second output mode of operation.

16. The circuit system of claim 9 , wherein the first integrated circuit die further comprises multiplexer circuits coupled to transmit the first clock signals from the first input buffer circuits to a logic circuit area in the first integrated circuit die.

17. The circuit system of claim 9 , wherein outputs of the first input buffer circuits are in weak pull-up or weak pull-down modes during the second output mode of operation.

18. The circuit system of claim 9 , wherein the first integrated circuit die is a programmable logic integrated circuit.

19. The circuit system of claim 9 , wherein the second integrated circuit die is a programmable logic integrated circuit.

Assignments (2)
SECURITY INTEREST Recorded Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2024
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 066353/0886 →