Semiconductor devices and methods of manufacturing semiconductor devices
In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.
1 . An electronic device, comprising:
a substrate comprising a conductive structure and an inner side and an outer side;
a first electronic component over the inner side of the substrate and coupled with the conductive structure;
a lid over the substrate and the first electronic component and comprising a first hole in the lid;
a wettability enhancing layer on sidewalls of the first hole; and
a thermal interface material between the first electronic component and the lid;
wherein the thermal interface material is in the first hole.
2 . The electronic device of claim 1 , wherein the lid comprises a plurality of holes, the plurality of holes including the first hole.
3 . The electronic device of claim 1 , wherein:
the first electronic component comprises a backside facing the lid; and
the first electronic component has a metallization layer on the backside and contacting the thermal interface material.
4 . The electronic device of claim 1 , wherein:
the lid comprises a lid wall extending from a lateral end of the lid; and
the lid wall is coupled with the inner side of the substrate.
5 . The electronic device of claim 1 , further comprising:
a second electronic component over the inner side of the substrate and coupled with the conductive structure.
6 . The electronic device of claim 5 , wherein:
the lid comprises a lid top; and
the lid comprises a leg extending between the lid top and the inner side of the substrate between the first electronic component and the second electronic component.
7 . The electronic device of claim 1 , further comprising:
solder in the first hole and contacting the thermal interface material.
8 . An electronic device, comprising:
a substrate comprising a dielectric structure and a conductive structure and having a top side;
an electronic component over the top side of the substrate and coupled with the conductive structure;
a metallization layer on a backside of the electronic component;
a stiffener coupled with the top side of the substrate;
a lid over the top side of the substrate and coupled with the stiffener, wherein the lid comprises a hole located over the electronic component;
a first thermal interface material between the lid and the electronic component;
a heat sink over the lid; and
a second thermal interface material between the lid and the heat sink;
wherein the second thermal interface material covers the hole.
9 . The electronic device of claim 8 , wherein the stiffener comprises:
an outer stiffener at an outer periphery of the substrate; and
an inner stiffener at an inner periphery of the substrate between the electronic component and the outer stiffener.
10 . An electronic device, comprising:
a substrate comprising a conductive structure and an inner side and an outer side;
a first electronic component over the inner side of the substrate and coupled with the conductive structure;
a lid over the substrate and the first electronic component and comprising a first hole in the lid;
a thermal interface material between the first electronic component and the lid; and
solder in the first hole and contacting the thermal interface material.
11 . The electronic device of claim 10 , wherein:
the first electronic component comprises a backside facing the lid; and
the first electronic component has a metallization layer on the backside and contacting the thermal interface material.
12 . The electronic device of claim 10 , wherein:
the lid comprises a lid wall extending from a lateral end of the lid; and
the lid wall is coupled with the inner side of the substrate.
13 . The electronic device of claim 10 , further comprising:
a second electronic component over the inner side of the substrate and coupled with the conductive structure.
14 . The electronic device of claim 13 , wherein:
the lid comprises a lid top; and
the lid comprises a leg extending between the lid top and the inner side of the substrate between the first electronic component and the second electronic component.