Optical coupling
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.
1. An apparatus comprising:
a first optical waveguide;
a first mirror proximate to the first optical waveguide configured to redirect an optical signal from the first optical waveguide;
a first curved mirror vertically spaced from the first mirror, the first curved mirror configured to substantially collimate the optical signal from the first mirror; and
a second curved mirror horizontally distanced from the first mirror, the second curved mirror configured to focus the substantially collimated optical signal from the first curved mirror toward a transceiver of a photonic integrated circuit (PIC).
2. The apparatus of claim 1 , further comprising a tilted curved mirror (TCM) horizontally distanced from the transceiver of the PIC.
3. The apparatus of claim 1 , wherein the first optical waveguide comprises:
an optical fiber.
4. The apparatus of claim 1 , wherein the transceiver of the PIC comprises a second optical waveguide.
5. The apparatus of claim 1 , further comprising a second mirror horizontally distanced from the first curved mirror, wherein the second mirror comprises a substantially flat mirror disposed at an angle with respect to the transceiver of the PIC.
6. The apparatus of claim 1 wherein, the first mirror and the second curved mirror are incorporated with a first substrate, and the transceiver of the PIC and the first curved mirror are incorporated with a second substrate.
7. The apparatus of claim 1 , wherein the first mirror comprises a substantially flat mirror that is angled with respect to the first optical waveguide.
8. The apparatus of claim 1 , wherein the first curved mirror is disposed on a glass carrier substrate disposed on a substrate of the PIC.
9. The apparatus of claim 1 , wherein the first curved mirror is fabricated on a substrate of the PIC.
10. The apparatus of claim 1 , wherein the second curved mirror is vertically distanced from the first curved mirror.
11. The apparatus of claim 1 , wherein the first curved mirror and the second curved mirror are configured to transform the optical signal and to enable multi-dimensional misalignment tolerance between a first substrate comprising the second curved mirror, and a second substrate comprising the PIC.
12. The apparatus of claim 1 , further comprising a first substrate wherein the first mirror and the second curved mirror are disposed on the first substrate, and wherein the first optical waveguide is connected to the first substrate.
13. The apparatus of claim 2 , wherein the TCM is further configured to redirect the optical signal from the second curved mirror.
14. The apparatus of claim 2 , wherein the transceiver of the PIC comprises a second optical waveguide, and wherein the first optical waveguide has a first mode size and the second optical waveguide has a second mode size different from the first mode size, and wherein the TCM converts a mode size of the optical signal between the first mode size to the second mode size.
15. The apparatus of claim 2 , wherein the TCM is configured to redirect the optical signal from the transceiver of the PIC at an angle that is other than 90 degrees from the transceiver of the PIC.
16. The apparatus of claim 2 , wherein the first optical waveguide is associated with a first mode size and wherein the transceiver of the PIC is associated with a second mode size different from the first mode size, and wherein the TCM is configured to convert the mode size of the optical signal.
17. The apparatus of claim 2 , wherein the TCM is disposed between the transceiver of the PIC and the first curved mirror.
18. The apparatus of claim 6 , further comprising a spacer disposed between the first and second substrates.
19. The apparatus of claim 7 , wherein the first mirror is angled such that the optical signal propagates from the first mirror at a substantially pre-defined angle with respect to the first optical waveguide.
20. The apparatus of claim 18 , wherein the spacer further comprises through vias configured to electrically connect the first substrate to an electronic component.
21. An apparatus comprising:
a first optical waveguide;
a mirror horizontally distanced from the first optical waveguide;
a first curved mirror substantially parallel with and vertically distanced from the first optical waveguide,
wherein the first curved mirror is disposed in a first reference plane;
a second curved mirror disposed in a second reference plane, the second reference plane being substantially parallel with and vertically distanced from the first reference plane,
wherein the second curved mirror is configured to interface an optical beam with a transceiver of a photonic integrated circuit (PIC) comprising a second optical waveguide; and
a tilted curved mirror (TCM) horizontally distanced between the first curved mirror and the second optical waveguide.
22. The apparatus of claim 21 , wherein the TCM is angled with respect to the second optical waveguide.
23. The apparatus of claim 21 , wherein the first optical waveguide has a first mode size and the second optical waveguide has a second mode size different from the first mode size, and wherein the TCM transforms an optical signal between the first mode size and the second mode size.
24. The apparatus of claim 21 , wherein the first optical waveguide comprises an optical fiber.
25. The apparatus of claim 21 , wherein the second optical waveguide comprises:
an optical fiber; or an optical waveguide of the PIC.
26. The apparatus of claim 21 , wherein the mirror comprises a substantially flat mirror disposed proximate to the first optical waveguide and at an angle with respect to a propagation direction of the optical beam propagating from the optical waveguide.
27. The apparatus of claim 21 , further comprising a first substrate, wherein the mirror and the second curved mirror are disposed on the first substrate.
28. The apparatus of claim 21 , wherein the first optical waveguide is associated with a first optical mode size and wherein the PIC is associated with a second optical mode size, and wherein the TCM is configured to convert a mode size of the optical beam to enable coupling of the optical beam between the transceiver of the PIC and the first optical waveguide.
29. The apparatus of claim 21 , wherein the first curved mirror and the second curved mirror are horizontally offset from each other.
30. The apparatus of claim 21 , wherein the PIC comprises a PIC substrate, and wherein the first curved mirror is disposed on a glass carrier substrate disposed on the PIC substrate.
31. The apparatus of claim 21 , wherein the first curved mirror and the second curved mirror are configured to transform the optical beam such that multi-dimensional misalignment tolerance, between a first substrate, comprising the first optical waveguide and the second curved mirror, and a second substrate comprising the PIC, is enabled.
32. The apparatus of claim 21 , further comprising a first substrate, wherein the mirror and the second curved mirror are fabricated on the first substrate, and wherein the first optical waveguide is attached to the first substrate.
33. The apparatus of claim 21 , further comprising a spacer disposed between the first curved mirror and the second curved mirror, wherein the spacer is substantially transparent to the optical beam.
34. The apparatus of claim 26 , wherein the substantially flat mirror is configured to interface the optical beam between the first curved mirror and the first optical waveguide.
35. The apparatus of claim 32 , wherein the mirror and the second curved mirror are fabricated on the first substrate via lithography.
36. The apparatus of claim 33 , wherein the spacer further comprises one or more through vias configured to electrically connect a first substrate, attached to the first optical waveguide, and the PIC.
37. A method comprising:
receiving a diverging optical signal from an optical waveguide;
redirecting the diverging optical signal at a first angle measured from a reference plane that is normal to the optical waveguide;
substantially collimating the diverging optical signal to a substantially collimated optical signal;
directing the substantially collimated optical signal at a second angle from the diverging optical signal that is substantially similar to the first angle measured from the reference plane that is normal to the optical waveguide;
converging the substantially collimated optical signal to a converging optical signal; and
directing the converging optical signal at a third angle from the substantially collimated optical signal that is substantially similar to the first and second angles measured from the reference plane that is normal to the optical waveguide.
38. The method of claim 37 , wherein the diverging optical signal is received by a mirror, from the optical waveguide, the method further comprising:
interfacing the substantially converging optical signal with a second optical waveguide.
39. The method of claim 37 , further comprising:
transforming a mode size of the converging optical signal.
40. The method of claim 37 , wherein the first angle, the second angle, and the third angle are about 8 degrees from the reference plane that is normal to the optical waveguide.
41. The method of claim 37 , wherein the substantially collimating the diverging optical signal comprises substantially collimating, via a first curved mirror, the diverging optical signal, and
wherein the directing the substantially collimated optical signal comprises directing, via the first curved mirror, the substantially collimated optical signal.
42. The method of claim 37 , wherein the converging the optical signal comprises converging, via a second curved mirror, the optical signal, and
wherein the directing the converging optical signal comprises, directing, via the second curved mirror, the converging optical signal.
43. The method of claim 37 , further comprising:
connecting the converging optical signal with a transmitter of a photonic integrated circuit (PIC),
wherein the optical waveguide is connected to a first substrate; and
enabling multi-dimensional misalignment tolerance between the first substrate and the PIC based on the substantially collimating the diverging optical signal, the directing the substantially collimated optical signal, the converging the optical signal, and the directing the converging optical signal.
44. The method of claim 37 , further comprising interfacing the converging optical signal with a transmitter of an optical circuit.
45. The method of claim 39 , wherein the mode size of the converging optical signal is transformed by a tilted curved mirror (TCM).
46. The method of claim 39 , wherein the transforming the mode size comprises transforming the mode size between a mode size of the optical waveguide and a mode size associated with a transmitter of a photonic integrated circuit.
47. An apparatus comprising:
a first optical waveguide;
a substantially flat mirror horizontally distanced from the first optical waveguide;
a first curved mirror substantially parallel with and vertically distanced from the first optical waveguide,
wherein the first curved mirror is disposed in a first reference plane; and
a second curved mirror disposed in a second reference plane, the second reference plane being substantially parallel with and vertically distanced from the first reference plane,
wherein the second curved mirror is configured to interface an optical beam with a transceiver of a photonic integrated circuit (PIC).
48. The apparatus of claim 47 , wherein the PIC further comprises a second optical waveguide and a tilted curved mirror (TCM) horizontally distanced between the first curved mirror and the second optical waveguide.
49. The apparatus of claim 47 , wherein the substantially flat mirror is configured to interface the optical beam between the first curved mirror and the first optical waveguide.
50. The apparatus of claim 47 , further comprising a first substrate, wherein the substantially flat mirror and the second curved mirror are disposed on the first substrate.
51. The apparatus of claim 47 , wherein the first curved mirror and the second curved mirror are configured to transform the optical beam such that multi-dimensional misalignment tolerance, between a first substrate, comprising the first optical waveguide and the second curved mirror, and a second substrate comprising the PIC, is enabled.
52. The apparatus of claim 48 , wherein the TCM is angled with respect to the second optical waveguide.
53. The apparatus of claim 48 , wherein the first optical waveguide has a first mode size and the second optical waveguide has a second mode size different from the first mode size, and wherein the TCM transforms an optical signal between the first mode size and the second mode size.