Cooling system for the liquid immersion cooling of electronic components
A cooling system for the liquid immersion cooling of electronic components. The system includes a container containing, in an interior, liquid heat transfer fluid into which electronic components are immersed, the container having a gas space above the surface of the liquid heat transfer fluid, and a heat exchanger device in the gas space of the container for forming liquid heat transfer fluid. The cooling system further includes a lock device on the container for exchanging electronic components, and the lock device has a lock space, which lock space is hermetically sealed with respect to the gas space of the container to prevent gas exchange.
1. A cooling system for liquid immersion cooling of electronic components, comprising:
a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid;
a lock device on the container for exchanging the electronic components,
the lock device having a lock space,
the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; and
a partition arranged to hermetically seal the lock space, the partition being immersed to an immersion depth in the liquid heat transfer fluid.
2. The cooling system as claimed in claim 1 , wherein the immersion depth of the partition is variable.
3. The cooling system as claimed in claim 1 , further including a loading system arranged in the container, the loading system transporting the electronic components from the lock device to an operating position for exchange of the electronic components.
4. The cooling system as claimed in claim 1 , further including a storage device disposed in the lock space for the intermediate storage of the electronic components.
5. The cooling system as claimed in claim 1 , wherein the heat exchanger device is a first heat exchanger device, and the cooling system includes a second heat exchanger device configured as a lock cooling system, the locking cooling system being configured to specifically control a temperature of the liquid heat transfer fluid located in the lock space.
6. A cooling system for liquid immersion cooling of electronic components comprising:
a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid; and
a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange;
wherein the lock device and/or the container includes a degassing device, the degassing device separating non-condensable gases from gaseous heat transfer fluid.
7. A cooling system for liquid immersion cooling of electronic components comprising:
a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
a heat exchanger in the gas space of the container for forming the liquid heat transfer fluid;
a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; and
a gas connection, the lock device being flooded with a protective gas via the gas connection.
8. The cooling system as claimed in claim 1 , further including a pressure equalization tank arranged on the container and/or on the lock device.
9. The cooling system as claimed in claim 1 , wherein the container includes an auxiliary heating system, the auxiliary heating system serving as an aid for evaporation of the liquid heat transfer fluid.
10. The cooling system as claimed in claim 1 , wherein the container is configured as a pressure vessel operating at a negative pressure and/or a positive pressure.