IP Library › Granted Patent US 11,071,232
Granted Patent B2
US 11,071,232 · App. 16/732,500 · Granted Jul 20, 2021

Liquid immersion cooling apparatus

Inventors: Kento Ohga (Yokohama, JP); Keita Hirai (Kawasaki, JP)
Assignee: FUJITSU LIMITED
H05K7/20236H05K7/20272H05K7/203
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Quick Facts
Patent No.
US 11,071,232
App. No.
16/732,500
Granted
Jul 20, 2021
Kind
B2
Abstract

A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.

Claims (26)

1. A liquid immersion cooling apparatus comprising:

a first receptacle in which a refrigerant liquid is accommodated, configured to include:

a first tank that has a first sidewall,

a first lid configured to cover the first tank, and

a first space provided between the refrigerant liquid and the first lid;

a second receptacle in which a sealing material is accommodated, configured to include:

a second tank that has a second sidewall facing the first sidewall and a third sidewall facing the second sidewall,

a second lid configured to cover the second tank,

a second space provided between the sealing material and the second lid, and configured to communicate with the first space through a first hole formed through both the first sidewall and the second sidewall, and

a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside of the second receptacle; and

a heat insulator provided outside of the second space and the third space and between the first sidewall and the second sidewall.

2. The liquid immersion cooling apparatus according to claim 1 , wherein the heat insulator is a hollow provided between the first sidewall and the second sidewall.

3. The liquid immersion cooling apparatus according to claim 1 , wherein the heat insulator is a heat insulating material provided between the first sidewall and the second sidewall.

4. The liquid immersion cooling apparatus according to claim 1 , further comprising:

a cooling plate connected to the second tank, and configured to cool the second tank and the sealing material.

5. The liquid immersion cooling apparatus according to claim 4 , further comprising:

a first cooler connected to a first flow path and a second flow path which are connected to the second tank, and configured to cool the sealing material sent from the second tank through the first flow path and to send the cooled sealing material to the second tank through the second flow path.

6. The liquid immersion cooling apparatus according to claim 5 , wherein the second flow path is connected to the cooling plate.

7. The liquid immersion cooling apparatus according to claim 5 , further comprising:

a second cooler connected to a third flow path and a fourth flow path which are connected to the first tank, and configured to cool the refrigerant liquid sent from the first tank through the third flow path and to send the cooled refrigerant liquid to the first tank through the fourth flow path.

8. The liquid immersion cooling apparatus according to claim 7 , wherein the fourth flow path is connected to the cooling plate.

9. The liquid immersion cooling apparatus according to claim 1 , wherein a surface of the second tank is configured to have an uneven portion.

10. The liquid immersion cooling apparatus according to claim 1 , wherein the second receptacle is configured to include a partition provided on the second lid to partition a portion between the sealing material and the second lid body into the second space and the third space.

11. The liquid immersion cooling apparatus according to claim 1 , wherein a cable coupled to an electronic device immersed in the refrigerant liquid is drawn out to the outside through the first space, the second space, the sealing material, and the third space.

12. The liquid immersion cooling apparatus according to claim 1 , wherein a second hole is formed through the third sidewall, and the third space is configured to communicate with the outside of the second receptacle through the second hole.

13. The liquid immersion cooling apparatus according to claim 1 , wherein the heat insulator is provided below the first hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2020
From: OHGA, KENTO; HIRAI, KEITA
To: FUJITSU LIMITED
Reel/Frame 051460/0037 →
Priority Claims (1)
JP JP2019-018777 · Feb 5, 2019 · national
Continuity (1)
Related Publication 20200253086A1 · Aug 6, 2020
Cited By (1)
US 12,363,865