Granted Patent B2

US 12,255,061 · App. 18/007,267 · Granted Mar 18, 2025

Inventors: Tetsuya Emoto (Kyoto, JP); Shigeru Yamamoto (Kyoto, JP); Daiki Fujii (Kyoto, JP); Kenji Edamitsu (Kyoto, JP); Keiji Iwata (Kyoto, JP); Yuya Kawai (Kyoto, JP); Kenichi Ito (Kyoto, JP)

Assignee: SCREEN HOLDINGS CO., LTD.

H01L21/02057B08B3/08

Abstract

Claims (11)

1. A substrate processing method for processing a substrate, comprising:

supplying a water repellent agent to the substrate;

supplying dilute isopropyl alcohol to the substrate after supplying the water repellent agent, the dilute isopropyl alcohol being obtained by diluting isopropyl alcohol;

supplying isopropyl alcohol to the substrate after supplying the dilute isopropyl alcohol; and

drying the substrate after supplying the isopropyl alcohol; wherein isopropyl alcohol is supplied immediately before the drying, and wherein the dilute isopropyl alcohol includes DIW (deionized water) and isopropyl alcohol, and wherein the ratio of the DIW to the isopropyl alcohol is at least 10% and no greater than 30%.

2. The substrate processing method according to claim 1 , further comprising

supplying isopropyl alcohol to the substrate after supplying the water repellent agent.

3. The substrate processing method according to claim 1 , further comprising

supplying isopropyl alcohol to the substrate after supplying the water repellent agent and before supplying the dilute isopropyl alcohol.

4. The substrate processing method according to claim 2 , further comprising

supplying isopropyl alcohol to the substrate after supplying the water repellent agent and before supplying the dilute isopropyl alcohol.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (22)