Optical communication module substrate
An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.
1. An optical communication module substrate comprising:
a wiring board; and
an opto-electronic hybrid substrate,
the wiring board and the opto-electronic hybrid substrate being connected to each other,
wherein the wiring board includes an electric wiring X and a connection terminal of the electric wiring X,
the opto-electronic hybrid substrate includes an insulating layer, an electric circuit portion that is provided on a first surface side of the insulating layer and includes a pad for mounting an optical element, an electric wiring Y, and a connection terminal of the electric wiring Y, a metal reinforcing layer that is provided on a second surface side of the insulating layer, and an optical waveguide that is disposed on the second surface side of the insulating layer such that a portion of the optical waveguide overlaps the metal reinforcing layer,
the connection terminal of the wiring board and the connection terminal of the opto-electronic hybrid substrate are electrical connection points, and
a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal of the electric wiring Y that is provided on the opposite side to the insulating layer so as to surround each terminal, and
an inner side of the frame-shaped removal portion is a small piece independent of a surrounding region.
2. The optical communication module substrate according to claim 1 ,
wherein the metal reinforcing layer has at least one portion that is surrounded by the frame-shaped removal portion and is electrically connected to the connection terminal of the electric wiring Y.
3. The optical communication module substrate according to claim 1 ,
wherein the portion of the metal reinforcing layer that faces the electric wiring Y provided on the opposite side to the insulating layer is removed in a strip shape along the electric wiring Y.
4. The optical communication module substrate according to claim 1 ,
wherein the connection terminal of the wiring board and the connection terminal of the opto-electronic hybrid substrate are disposed so as to overlap each other, and the connection terminals that overlap each other are electrically connected to each other directly or via a conductive member.
5. The optical communication module substrate according to claim 1 ,
wherein the connection terminal of the wiring board and the connection terminal of the opto-electronic hybrid substrate are electrically connected to each other via an electric connector provided between the wiring board and the opto-electronic hybrid substrate.