Photonic integrated circuit packaging architectures
Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC is embedded in the insulating material with an active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; an optical component optically coupled to the active surface of the PIC; and a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the second layer.
1. A photonic assembly, comprising:
a photonic integrated circuit (PIC) in a first layer including an insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the insulating material with the active surface facing up;
a conductive pillar in the first layer;
an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar;
an optical component optically coupled to the active surface of the PIC; and
a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the second layer.
2. The photonic assembly of claim 1 , wherein the optical component is a glass block, a waveguide, a fiber array block, or a pass-through structure.
3. The photonic assembly of claim 1 , wherein the optical component is a first optical component, and the photonic assembly further comprising:
a second optical component optically coupled to the first optical component.
4. The photonic assembly of claim 3 , wherein the second optical component is an optical lens.
5. The photonic assembly of claim 1 , wherein the IC is electrically coupled to the conductive pillar and the active surface of the PIC.
6. The photonic assembly of claim 1 , further comprising:
a bridge die in the first layer electrically coupled to the IC.
7. The photonic assembly of claim 6 , further comprising:
a processor circuit in the second layer electrically coupled to the bridge die.
8. The photonic assembly of claim 1 , further comprising:
a package substrate electrically coupled to the backside of the PIC and the conductive pillar.
9. The photonic assembly of claim 1 , wherein the insulating material is a first insulating material in the first layer, and the photonic assembly further comprising:
a second insulating material in the second layer, wherein the second insulating material is different than the first insulating material.
10. The photonic assembly of claim 1 , wherein the IC includes a first surface facing the first layer and an opposing second surface, and the photonic assembly further comprising:
a heat transfer structure at the second surface of the IC.
11. The photonic assembly of claim 8 , further comprising:
a heat transfer structure embedded in the package substrate.
12. A photonic assembly, comprising:
an integrated circuit (IC) in a first layer including an insulating material, wherein the IC is embedded in the insulating material;
a photonic integrated circuit (PIC), having an active surface, in a second layer, wherein the second layer is on the first layer, the second layer includes the insulating material, and the PIC is embedded in the insulating material with the active surface facing the first layer and electrically coupled to the IC;
an optical component optically coupled to the active surface of the PIC; and
a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the first layer.
13. The photonic assembly of claim 12 , wherein the optical component is a glass block, a waveguide, a fiber array block, a pass-through structure, or an optical lens.
14. The photonic assembly of claim 12 , wherein the optical component is a first optical component, and the photonic assembly further comprising:
a second optical component optically coupled to the first optical component.
15. The photonic assembly of claim 14 , wherein the first optical component is a glass block and the second optical component is an optical lens.
16. The photonic assembly of claim 12 , wherein the IC includes a first surface and an opposing second surface and the second layer is at the second surface of the IC, and the photonic assembly further comprising:
a package substrate electrically coupled to the first surface of the IC, wherein the package substrate includes an aperture and the optical component is aligned with the aperture.
17. The photonic assembly of claim 12 , wherein the insulating material is a first insulating material in the first layer, and the photonic assembly further comprising:
a second insulating material in the second layer, wherein the second insulating material is different than the first insulating material.
18. The photonic assembly of claim 16 , further comprising:
a heat transfer structure embedded in the package substrate.
19. The photonic assembly of claim 12 , further comprising:
a conductive pillar in the first layer embedded in the insulating material; and
a processor circuit in the second layer embedded in the insulating material and electrically coupled to the IC and the conductive pillar.
20. The photonic assembly of claim 12 , wherein the PIC includes a backside surface opposite the active surface, and the photonic assembly further comprising:
a heat transfer structure at the backside surface of the PIC.