IP Library › Granted Patent US 12,366,715
Granted Patent B2
US 12,366,715 · App. 18/010,564 · Granted Jul 22, 2025

Opto-electric hybrid board

Inventors: Tadao Okawa (Ibaraki, JP); Takashi Oda (Ibaraki, JP); Masataka Yamaji (Ibaraki, JP); Kazushi Ichikawa (Ibaraki, JP)
Assignee: NITTO DENKO CORPORATION
G02B6/428G02B6/12002G02B6/12004H05K1/0274G02B6/4214H05K1/0245H05K2201/2009
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Quick Facts
Patent No.
US 12,366,715
App. No.
18/010,564
Granted
Jul 22, 2025
Kind
B2
Abstract

In an opto-electric hybrid board, an electric circuit part E is provided on a first surface side of an insulative layer, and includes pads for mounting an optical element, pads for a driving device for the optical element, and electrical interconnect lines Y including interconnect line portions A connecting the pads. A metal reinforcement layer and an optical waveguide W partially overlapping the metal reinforcement layer are provided on a second surface side of the insulative layer. A portion of the metal reinforcement layer which faces the interconnect line portions A on the opposite side of the insulative layer therefrom is removed to form an opening. This opto-electric hybrid board is capable of transmitting higher-frequency electric signals because the influence of the metal reinforcement layer on electrical properties is suppressed.

Claims (9)

1. An opto-electric hybrid board for use in an optical communication module, comprising:

an insulative layer;

an electric circuit part provided on a first surface side of the insulative layer, the electric circuit part including a pad for mounting an optical element, a pad for an optical element driving device, and an electrical interconnect line Y including an interconnect line portion A connecting the pads;

a metal reinforcement layer provided on a second surface side of the insulative layer; and

an optical waveguide provided similarly on the second surface side of the insulative layer, with a portion thereof in an arrangement that partially overlaps the metal reinforcement layer,

wherein a portion of the metal reinforcement layer which faces the interconnect line portion A provided on the opposite side of the insulative layer therefrom is removed to form an opening, and

wherein an opening dimension of the opening of the metal reinforcement layer as measured in a longitudinal direction of the interconnect line portion A is set to 0.8 to 1 when a longitudinal dimension of the interconnect line portion A is 1.

2. The opto-electric hybrid board according to claim 1 ,

wherein the optical element is a photodiode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2022
From: OKAWA, TADAO; ODA, TAKASHI; YAMAJI, MASATAKA; ICHIKAWA, KAZUSHI
To: NITTO DENKO CORPORATION
Reel/Frame 062101/0727 →
Priority Claims (1)
JP 2020-128012 · Jul 29, 2020 · national
Continuity (1)
Related Publication 20230258893A1 · Aug 17, 2023
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