IP Library › Granted Patent US 10,295,769

Granted Patent B2

US 10,295,769 · App. 15/527,502 · Granted May 21, 2019

Opto-electric hybrid board and method of manufacturing same

Inventors: Naoyuki Tanaka (Ibaraki, JP); Yuichi Tsujita (Ibaraki, JP)

Assignee: NITTO DENKO CORPORATION

G02B6/4281 G02B6/122 G02B6/43 H05K1/0274 H05K3/06 G02B6/136 G02B6/138 G02B6/4214 H05K1/0278 H05K2201/09036

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Quick Facts

Patent No.: US 10,295,769
App. No.: 15/527,502
Granted: May 21, 2019
Kind: B2

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Abstract

An opto-electric hybrid board includes: an electric circuit board including an insulation layer and electrical interconnect lines formed on the front surface of the insulation layer; and an optical waveguide provided on the back surface side of the insulation layer of the electric circuit board, with a metal layer therebetween. At least one opening is formed by removing at least part of a region of the metal layer which is overlaid on the contour of an end portion of the optical waveguide. The optical waveguide is formed, with part of the optical waveguide extending into the opening. The opto-electric hybrid board is favorably usable over a prolonged period because the end portion of the optical waveguide provided on the back surface side of the electric circuit board does not peel off the metal layer.

Claims (80)

1. An opto-electric hybrid board comprising:

an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer;

an optical waveguide including a core, the optical waveguide having an upper surface substantially extending in parallel to the core, a lower surface substantially extending in parallel to the core, and side surfaces joining the upper surface and the lower surface of the optical waveguide, the optical waveguide having a contour as viewed in a first direction, the first direction being perpendicular to the upper surface and the lower surface of the optical waveguide, the contour of the optical waveguide corresponding to the side surfaces of the optical waveguide; and

a metal layer having an upper surface substantially extending in parallel to the upper surface of the optical waveguide, a lower surface substantially extending in parallel to the upper surface of the metal layer, and side surfaces joining the upper surface and the lower surface of the metal layer, the metal layer having a contour as viewed in the first direction,

wherein the optical waveguide is provided on a back surface side of the insulation layer of the electric circuit board, with the metal layer therebetween,

wherein the metal layer is overlaid on at least one end portion of the optical waveguide in such a configuration that the contour of the end portion of the optical waveguide is disposed inside the contour of the metal layer, as viewed in the first direction,

wherein at least one opening is formed in the metal layer, the at least one opening being disposed at a position which is overlaid on the contour of the end portion of the optical waveguide, as viewed in the first direction, and

wherein part of the optical waveguide extends into the at least one opening.

2. The opto-electric hybrid board according to claim 1 , wherein the at least one opening in the metal layer includes a plurality of openings, and the openings are formed discontinuously along the contour of the end portion of the optical waveguide.

3. An opto-electric hybrid board comprising:

an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer; and

wherein the optical waveguide is provided on a back surface side of the insulation layer of the electric circuit board, with the metal layer therebetween,

wherein the metal layer is overlaid on at least one end portion of the optical waveguide in such a configuration that the contour of the end portion of the optical waveguide coincides with the contour of the metal layer or is disposed outside the contour of the metal layer, as viewed in the first direction,

wherein at least one opening is formed in the metal layer, the at least one opening being disposed at a position in which the contour of the metal layer is overlaid on the end portion of the optical waveguide, as viewed in the first direction, and

wherein part of the optical waveguide extends into the at least one opening.

4. The opto-electric hybrid board according to claim 3 , wherein the at least one opening in the metal layer includes a plurality of openings, and

wherein the openings are formed discontinuously along the contour of the metal layer.

5. An opto-electric hybrid board comprising:

an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer; and

wherein the optical waveguide is provided directly on a back surface side of the insulation layer of the electric circuit board,

wherein the insulation layer has an upper surface substantially extending in parallel to the upper surface of the optical waveguide, a lower surface substantially extending in parallel to the upper surface of the insulation layer, and side surfaces joining the upper surface and the lower surface of the insulation layer, the insulation layer having a contour as viewed in the first direction,

wherein the insulation layer is overlaid on at least one end portion of the optical waveguide in such a configuration that the contour of the end portion of the optical waveguide is disposed inside the contour of the insulation layer, as viewed in the first direction,

wherein at least one recess is formed in the insulation layer, the at least one recess being overlaid on the contour of the end portion of the optical waveguide, as viewed in the first direction, and

wherein part of the optical waveguide extends into the at least one recess.

6. The opto-electric hybrid board according to claim 5 , wherein the at least one recess in the insulation layer includes a plurality of recesses, and

wherein the recesses are formed discontinuously along the contour of the end portion of the optical waveguide.

7. An opto-electric hybrid board comprising:

an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer; and

wherein the optical waveguide is provided directly on a back surface side of the insulation layer of the electric circuit board,

wherein the insulation layer is overlaid on at least one end portion of the optical waveguide in such a configuration that the contour of the end portion of the optical waveguide coincides with the contour of the insulation layer or is disposed outside the contour of the insulation layer, as viewed in the first direction,

wherein at least one recess is formed in the insulation layer, the at least one recess being disposed at a position in which the contour of the insulation layer is overlaid on the end portion of the optical waveguide, as viewed in the first direction, and

wherein part of the optical waveguide extends into the at least one recess.

8. The opto-electric hybrid board according to claim 7 , wherein the at least one recess in the insulation layer includes a plurality of recesses, and

wherein the recesses are formed discontinuously along the contour of the insulation layer.

9. A method of manufacturing an opto-electric hybrid board comprising:

preparing an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer, a metal layer being formed on a back surface of the insulation layer; and

forming an optical waveguide on the metal layer,

wherein the optical waveguide includes a core, the optical waveguide having an upper surface substantially extending in parallel to the core, a lower surface substantially extending in parallel to the core, and side surfaces joining the upper surface and the lower surface of the optical waveguide, the optical waveguide having a contour as viewed in a first direction, the first direction being perpendicular to the upper surface and the lower surface of the optical waveguide, the contour of the optical waveguide corresponding to the side surfaces of the optical waveguide; and

wherein the metal layer has an upper surface substantially extending in parallel to the upper surface of the optical waveguide, a lower surface substantially extending in parallel to the upper surface of the metal layer, and side surfaces joining the upper surface of the metal layer and the lower surface of the metal layer, the metal layer having a contour as viewed in the first direction,

wherein the optical waveguide is formed on the metal layer such that the contour of at least one end portion of the optical waveguide is disposed inside the contour of the metal layer,

wherein the preparing the electric circuit board includes forming at least one opening by removing at least part of the metal layer which is to be overlaid on the contour of the end portion of the optical waveguide, as viewed in the first direction, and

wherein the forming the optical waveguide includes forming the optical waveguide such that part of the optical waveguide extends into the at least one opening in the metal layer.

10. The method of manufacturing an opto-electric hybrid board according to claim 9 , wherein the at least one opening in the metal layer includes a plurality of openings, and

wherein the preparing the electric circuit board includes forming the openings discontinuously along the contour of the end portion of the optical waveguide.

11. A method of manufacturing an opto-electric hybrid board comprising:

forming an optical waveguide on the metal layer,

wherein the optical waveguide is formed on the metal layer such that the contour of at least one end portion of the optical waveguide coincides with the contour of the metal layer or is disposed outside the contour of the metal layer,

wherein the preparing the electric circuit board includes forming at least one opening by removing at least part of the metal layer in which the contour of the metal layer is to be overlaid on the end portion of the optical waveguide, as viewed in the first direction, and

wherein the forming the optical waveguide includes forming the optical waveguide such that part of the optical waveguide extending into the at least one opening in the metal layer.

12. The method of manufacturing an opto-electric hybrid board according to claim 11 , wherein the at least one opening in the metal layer includes a plurality of openings, and

wherein the preparing the electric circuit board includes forming the openings discontinuously along the contour of the metal layer.

13. A method of manufacturing an opto-electric hybrid board comprising:

preparing an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer; and

forming an optical waveguide on the insulation layer,

wherein the optical waveguide is formed on the insulation layer such that the contour of at least one end portion of the optical waveguide is disposed inside the contour of the insulation layer, as viewed in the first direction,

wherein the preparing the electric circuit board includes forming at least one recess in the insulation layer at a position which is to be overlaid on the contour of the end portion of the optical waveguide, as viewed in the first direction, and

wherein the forming the optical waveguide includes forming the optical waveguide such that part of the optical waveguide extends into the at least one recess in the insulation layer.

14. The method of manufacturing an opto-electric hybrid board according to claim 13 ,

wherein the at least one recess in the insulation layer includes a plurality of recesses, and

wherein the preparing the electric circuit board includes forming the recesses discontinuously along the contour of the end portion of the optical waveguide.

15. A method of manufacturing an opto-electric hybrid board comprising:

preparing an electric circuit board including an insulation layer and an electrical interconnect line formed on a front surface of the insulation layer; and

forming an optical waveguide on the insulation layer,

wherein the optical waveguide is formed on the insulation layer such that the contour of at least one end portion of the optical waveguide coincides with the contour of the insulation layer or is disposed outside the contour of the insulation layer, as viewed in the first direction,

wherein the preparing the electric circuit board includes forming at least one recess in the insulation layer at a position in which the contour of the insulation layer itself is to be overlaid on the end portion of the optical waveguide, as viewed in the first direction, and

wherein the forming the optical waveguide includes forming the optical waveguide such that part of the optical waveguide extends into the recess in the insulation layer.

16. The method of manufacturing an opto-electric hybrid board according to claim 15 , wherein the at least one recess in the insulation layer includes a plurality of recesses, and

wherein the preparing the electric circuit board includes forming the recesses discontinuously along the contour of the insulation layer.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2017

From: TANAKA, NAOYUKI; TSUJITA, YUICHI

To: NITTO DENKO CORPORATION

Reel/Frame 042414/0322 →

Priority Claims (2)

JP 2014-237820 · Nov 25, 2014 · national

JP 2015-221084 · Nov 11, 2015 · national

Continuity (1)

Related Publication 20170329093A1 · Nov 16, 2017

Cited By (1)

US 12,366,715