Resin composition and molded article
The present invention provides a resin composition including a 4-methyl-1-pentene copolymer (A) that satisfies particular requirements and a 4-methyl-1-pentene copolymer (B) that satisfies particular requirements. The resin composition of the present invention can provide a smooth film with a small surface roughness and can be suitably used for molded articles such as films for capacitors, while containing the 4-methyl-1-pentene copolymers and having properties such as heat resistance. A film for capacitors of the present invention has a small surface roughness and is smooth, which eliminates problems such as worsening of dielectric properties and shortening of service life.
1 . A resin composition comprising a 4-methyl-1-pentene copolymer (A) that satisfies the following requirements (A-a) to (A-d) and a 4-methyl-1-pentene copolymer (B) that satisfies the following requirements (B-a) to (B-d),
wherein the resin composition satisfies the following requirements (1) and (2):
(A-a) in the copolymer (A), an amount (U1) of constitutional units derived from 4-methyl-1-pentene is 80.0 to 99.9% by mol and a total amount (U2) of constitutional units derived from at least one selected from linear α-olefins having 2 to 20 carbon atoms is 20.0 to 0.1% by mol (provided that U1 and U2 in total is 100% by mol);
(A-b) an intrinsic viscosity [η] A measured in decalin of 135° C. of the copolymer (A) is 0.5 to 5.0 dL/g;
(A-c) when the copolymer (A) is measured in a cross fractionation chromatograph apparatus (CFC) using an infrared spectrophotometer as a detector part, at least one peak of an amount of a component eluted is present in a range of 100 to 140° C.;
(A-d) when the copolymer (A) is measured in the CFC, a molecular weight distribution (Mw/Mn), which is a ratio between a weight average molecular weight (Mw) and a number average molecular weight (Mn), in the component eluted in a range of 100 to 140° C. is 1.0 to 4.5;
(B-a) in the copolymer (B), an amount (U3) of constitutional units derived from 4-methyl-1-pentene is 20.0 to 98.0% by mol and a total amount (U4) of constitutional units derived from at least one selected from linear α-olefins having 2 to 20 carbon atoms is 80.0 to 2.0% by mol (provided that U3 and U4 in total is 100% by mol);
(B-b) an intrinsic viscosity [η] B measured in decalin of 135° C. of the copolymer (B) is 2.0 to 8.0 dL/g;
(B-c) when the copolymer (B) is measured in a cross fractionation chromatograph apparatus (CFC) using an infrared spectrophotometer as a detector part, at least one peak of an amount of a component eluted is present in a range of 0° C. or higher and lower than 100° C.;
(B-d) when the copolymer (B) is measured in the CFC, a molecular weight distribution (Mw/Mn), which is a ratio between a weight average molecular weight (Mw) and a number average molecular weight (Mn), in the component eluted in a range of 0° C. or higher and lower than 100° C. is 1.0 to 7.0;
(1) a content of the copolymer (A) is 5 parts by mass or more and less than 50 parts by mass and a content of the copolymer (B) is greater than 50 parts by mass and 95 parts by mass or less with respect to 100 parts by mass of the total content of the copolymers (A) and (B); and
(2) a value (U4-U2) obtained by subtracting U2 (% by mol) described in the requirement (A-a) from U4 (% by mol) described in the requirement (B-a) is 0% by mol or more and 6.5% by mol or less.
2 . The resin composition according to claim 1 , wherein the linear α-olefins in the copolymers (A) and (B) are each independently a linear α-olefin having 10 to 20 carbon atoms.
3 . A molded article comprising the resin composition according to claim 1 .
4 . A film comprising the resin composition according to claim 1 .
5 . The film according to claim 1 , satisfying the following requirements (II) to (III):
(II) a surface roughness (Ra) of the film is less than 100 nm; and
(III) a surface roughness (Rz) of the film is less than 500 nm.
6 . The film according to claim 4 , wherein the film is a film for capacitors.
7 . The film according to claim 1 , wherein the resin composition has a melting point (Tm) of 210 to 240° C.