III-nitride devices with through-via structures
A semiconductor device comprises a III-N device including an insulating substrate. The insulating substrate includes a first side and a second side. The device further includes a III-N material structure on a first side of the insulating substrate, and a gate electrode, a source electrode, and a drain electrode on a side of the III-N material structure opposite the substrate. A backmetal layer on the second side of the insulating substrate, and a via hole is formed through the III-N material structure and the insulating substrate. A metal formed in the via-hole is electrically connected to the drain electrode on the first side of the substrate and electrically connected to the backmetal layer on the second side of the substrate.
1 . A semiconductor device, comprising:
a III-N device comprising an insulating substrate, the insulating substrate comprising a first side and a second side;
a III-N material structure on a first side of the insulating substrate, and a gate electrode, a source electrode, and a drain electrode on a side of the III-N material structure opposite the substrate;
a backmetal layer on the second side of the insulating substrate; and
a via-hole formed through the III-N material structure and the insulating substrate, wherein a metal formed in the via-hole is electrically connected to the drain electrode on the first side of the substrate and electrically connected to the backmetal layer on the second side of the substrate;
wherein the device has a breakdown voltage greater than 600V and an on-resistance less than 15 mΩ.
2 . The device of claim 1 , wherein the substrate is a sapphire substrate.
3 . The device of claim 1 , wherein the III-N material structure comprises a III-N barrier layer, and a III-N channel layer; and a compositional difference between the III-N barrier layer and the III-N channel layer causes a lateral 2DEG channel to be induced in the III-N channel layer, and the drain electrode is electrically connected to the 2DEG.
4 . The device of claim 3 , wherein the device further comprises an active region between the source electrode and the drain electrode, and the via-hole is formed outside the active region.
5 . The device of claim 1 , wherein the backmetal layer is configured to be electrically coupled to a circuit high-voltage node.
6 . A semiconductor device, comprising
a III-N device comprising an insulating substrate, the insulating substrate comprising a first side and a second side;
a III-N material structure on a first side of the insulating substrate, and a gate electrode, a source electrode, and a drain electrode on a side of the III-N material structure opposite the substrate;
a backmetal layer on the second side of the insulating substrate;
a via-hole formed through the III-N material structure and the insulating substrate, wherein a metal formed in the via-hole is electrically connected to the drain electrode on the first side of the substrate and electrically connected to the backmetal layer on the second side of the substrate; and
a second via-hole formed through the III-N material structure and the insulating substrate, and a metal formed in the second via-hole is electrically connected to the gate electrode on the first side of the substrate and electrically connected to a second backmetal layer on the second side of the substrate.
7 . The device of claim 6 , wherein a separation between the backmetal layer and the second backmetal layer is greater than 10 μm.
8 . A semiconductor device, comprising
a III-N device comprising an insulating substrate, the insulating substrate comprising a first side and a second side;
a III-N material structure on a first side of the insulating substrate, and a gate electrode, a source electrode, and a drain electrode on a side of the III-N material structure opposite the substrate;
a backmetal layer on the second side of the insulating substrate;
a via-hole formed through the III-N material structure and the insulating substrate, wherein a metal formed in the via-hole is electrically connected to the drain electrode on the first side of the substrate and electrically connected to the backmetal layer on the second side of the substrate; and
a second via-hole formed through the III-N material structure and the insulating substrate, and a metal formed in the second via-hole is electrically connected to the source electrode on the first side of the substrate and electrically connected to a second backmetal layer on the second side of the substrate.
9 . The device of claim 8 , wherein the device has a breakdown voltage greater than 600V and an on-resistance less than 15 mΩ.
10 . The device of claim 8 , wherein the substrate is a sapphire substrate.
11 . The device of claim 8 , wherein the III-N material structure comprises a III-N barrier layer, and a III-N channel layer; and a compositional difference between the III-N barrier layer and the III-N channel layer causes a lateral 2DEG channel to be induced in the III-N channel layer, and the drain electroide is electrically connected to the 2DEG.
12 . An electronic component, comprising:
an enhancement-mode transistor;
a depletion-mode transistor comprising an insulating substrate and a backmetal layer; and
a package comprising a conductive structural package base, the package enclosing both the enhancement-mode transistor and the depletion-mode transistor;
wherein a gate electrode of the enhancement-mode transistor is electrically connected to a gate terminal of the package, a source electrode of the enhancement-mode transistor is electrically connected to a source terminal of the package, and the gate electrode of the depletion-mode transistor is electrically connected to the source terminal of the package;
wherein a drain electrode of the depletion-mode transistor directly contacts and is electrically connected to the backmetal layer, the backmetal layer is directly contacting and electrically connected to the conductive structural package base, and the conductive structural package base is electrically connected to a drain terminal of the package.
13 . The electronic component of claim 12 , wherein the drain electrode of the depletion-mode transistor is electrically connected to the drain terminal of the package without an external drain wire connector.
14 . The electronic component of claim 13 , wherein the depletion-mode transistor comprises a III-N material structure over the insulating substrate.
15 . The electronic component of claim 14 , wherein the drain electrode of the depletion-mode transistor is on an opposite side of the III-N material structure from the insulating substrate, the III-N material structure includes a via that extends through the insulating substrate, and the drain electrode of the depletion-mode transistor is electrically connected to the conductive structural package base through the via.
16 . The electronic component of claim 15 , wherein the via is outside of an active region of the depletion-mode transistor.
17 . The electronic component of claim 16 , wherein a drain electrode of the enhancement-mode transistor is directly contacting and electrically connected to a source electrode of the depletion-mode transistor, and the enhancement-mode transistor is at least partially over the active region of the depletion-mode transistor.
18 . A semiconductor device, comprising:
a III-N device comprising an insulating substrate, the insulating substrate comprising a first side and a second side;
a III-N material structure on a first side of the insulating substrate, and a gate electrode, a source electrode, and a drain electrode on a side of the III-N material structure opposite the substrate, and a dielectric layer over the III-N material structure, wherein the III-N material structure comprises a III-N barrier layer, and a III-N channel layer, and a compositional difference between the III-N barrier layer and the III-N channel layer causes a lateral 2DEG channel to be induced in the III-N channel layer, and the drain electrode is electrically connected to the 2DEG;
a backmetal layer on the second side of the insulating substrate, wherein the backmetal layer is configured to be electrically coupled to a ground; and
a via-hole formed through the III-N material structure and the insulating substrate, wherein a metal formed in the via-hole is electrically connected to the source electrode on the first side of the substrate and electrically connected to the backmetal layer on the second side of the substrate and the source electrode is fully encapsulated in the dielectric layer on the first side of the substrate.
19 . An electronic module, comprising:
a base substrate comprising an insulating layer between a first metal layer and a second metal layer, the first metal layer including a first portion, a second portion, and a third portion, wherein a trench formed through the first metal layer electrically isolates the first, second and third portions of the first metal layer from one another;
a high-side switch comprising an enhancement-mode transistor and a depletion-mode transistor, wherein the depletion-mode transistor comprises a III-N material structure on a first side of an insulating substrate and a backmetal layer on a second side opposite the first side;
a via-hole is formed through the III-N material structure and the insulating substrate; and
a low-side switch;
wherein a source electrode of the enhancement-mode transistor is electrically connected to the second portion of the first metal layer, a drain electrode of the enhancement-mode transistor is electrically connected to a source electrode of the depletion-mode transistor, a gate electrode of the depletion-mode transistor is electrically connected to the second portion of the first metal layer, and a metal formed in the via-hole is electrically connected to the drain electrode of the depletion-mode transistor and electrically connected to the backmetal layer, and the backmetal layer is electrically connected and physically mounted to the first portion of the first metal layer.
20 . The electronic module of claim 19 , wherein the low-side switch comprises a second enhancement-mode transistor and a second depletion-mode transistor, the second depletion mode transistor comprising a second III-N material structure on a first side of a second insulating substrate and a second backmetal layer on a second side opposite the first side;
a second via-hole is formed through the second III-N material structure and the second insulating substrate; wherein
a drain electrode of the second depletion-mode transistor is electrically connected to the second portion of the first metal layer;
a source electrode of the second enhancement-mode transistor is connected to a third portion of the first metal layer;
a drain electrode of the second enhancement-mode transistor is electrically connected to a source electrode of the second depletion-mode transistor;
a gate electrode of the second depletion-mode transistor is electrically connected to the third portion of the first metal layer; and
a metal formed in the second via-hole is electrically connected to the drain electrode of the second depletion-mode transistor and electrically connected to the second backmetal layer, and the second backmetal layer is electrically connected and physically mounted to the second portion of the first metal layer.
21 . The electronic module of claim 19 , wherein the high-side switch and the low-side switch form a half bridge circuit.
22 . The electronic module of claim 19 , wherein the depletion-mode transistor is configured to be able to block at least 600V while the high-side switch is biased off and conduct current greater than 30 A while the high-side switch is biased on.
23 . The electronic module of claim 19 , further comprising a capacitor, wherein a first terminal of the capacitor is electrically connected to the first portion of the first metal layer and a second terminal of the capacitor is electrically connected to the third portion of the first metal layer.
24 . The electronic module of claim 19 , further comprising a package, wherein the base substrate, the high-side switch, and the low-side switch are encased within the package.
25 . The electronic module of claim 19 , wherein further comprising a second high-side switch connected in parallel to the high-side switch and a second low-side switch connected in parallel to the low-side switch.
26 . The electronic module of claim 19 , wherein the second portion of the first metal layer is connected to an output node of the electronic module.
27 . The electronic module of claim 26 , wherein the module is configured such that during operation, the first portion of the first metal layer is connected to a DC voltage supply and the third portion of the first metal layer is connected to a DC ground.