Surface treatment apparatus and manufacturing apparatus for semiconductor device
A surface treatment apparatus applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding. The surface treatment apparatus includes a support base and a spray nozzle. The support base supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects. The spray nozzle causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface.
1 . A surface treatment apparatus which applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding, the surface treatment apparatus comprising:
a support base which supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects;
a spray nozzle which causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface; and
a movement mechanism comprising a motor, wherein
the movement mechanism is configured to move the spray nozzle with respect to the support base so that the spraying nozzle is capable of scanning the bonding surface while spraying the humidified air, wherein
the support base further comprises a cooler which cools the temperature of the bonding surface to a temperature lower than a temperature of an ambient atmosphere and higher than a dew point temperature of a water vapor pressure of the ambient atmosphere,
the one or more target objects are placed on the support base with their periphery lateral surface being surrounded by a frame member having a ring-shape, and
the cooler cools the one or more target objects, and the frame member has a position and a size at which the frame member is not cooled.
2 . The surface treatment apparatus according to claim 1 , wherein
the spray nozzle has a spray area covering all of the one or more target objects.
3 . The surface treatment apparatus according to claim 1 , wherein
the target object is a chip which is a semiconductor integrated circuit or a wafer to which the chip is bonded.
4 . A manufacturing apparatus for a semiconductor device, which manufactures a semiconductor device by bonding a chip, which is a semiconductor integrated circuit, to a wafer using hydrogen bonding, the manufacturing apparatus for a semiconductor device comprising:
a bonding unit which bonds the chip to a top surface of the wafer or another chip mounted on the wafer; and
one or more surface treatment apparatuses which apply a hydrophilic treatment to a bonding surface of a target object, which is the chip or the wafer, prior to the bonding, wherein
each of the one or more surface treatment apparatuses comprises:
a support base which supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects;
a spray nozzle which causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface; and
a movement mechanism comprising a motor, wherein
the movement mechanism is configured to move the spray nozzle with respect to the support base so that the spraying nozzle is capable of scanning the bonding surface while spraying the humidified air, wherein
the support base further comprises a cooler which cools the temperature of the bonding surface to a temperature lower than a temperature of an ambient atmosphere and higher than a dew point temperature of a water vapor pressure of the ambient atmosphere,
the one or more target objects are placed on the support base with their periphery lateral surface being surrounded by a frame member having a ring-shape, and
the cooler cools the one or more target objects, and the frame member has a position and a size at which the frame member is not cooled.