Patent Assignment
Reel/Frame 072291/0546
Merger
Recorded: 2025-09-18
Pages: 17
Assignor
YAMAHA ROBOTICS HOLDINGS CO., LTD.
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, JAPAN
Covered Properties
(5)
Wire Bonding State Determination Method and Device Using a Prescribed Electric Waveform
Electronic Component Cleaning Apparatus
Surface Treatment Apparatus and Manufacturing Apparatus for Semiconductor Device
Defect Detection Device and Defect Detection Method
Acoustic Foreign Matter Removal Device
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2021
From: MUNAKATA, HIROSHI; NAKANO, SHOTA; ADACHI, TAKUYA; MAHDI, CHOYEKH
To: YAMAHA ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 058067/0081 →
Assignment of Assignor's Interest
Feb 9, 2023
From: KIKUCHI, HIROSHI; RI, KINN
To: YAMAHA ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 062647/0183 →
Assignment of Assignor's Interest
Jun 26, 2025
From: MUNAKATA, HIROSHI; KIRKBY, MICHAEL; ADACHI, TAKUYA
To: YAMAHA ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 071525/0721 →
Assignment of Assignor's Interest
Jun 30, 2025
From: KIRKBY, MICHAEL; LANDAEZ GARCIA, YSMALDO JOSE; MUNAKATA, HIROSHI
To: YAMAHA ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 071557/0469 →
Assignment of Assignor's Interest
Jul 4, 2025
From: KIKUCHI, HIROSHI; RI, KIN; TAKANO, TETSUO
To: YAMAHA ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 071609/0776 →