Patent Assignment
Reel/Frame 058067/0081
Assignment of Assignor's Interest
Recorded: 2021-11-10
Pages: 7
Assignors
MUNAKATA, HIROSHI
Executed: 2021-07-27
NAKANO, SHOTA
Executed: 2020-06-10
ADACHI, TAKUYA
Executed: 2021-07-27
MAHDI, CHOYEKH
Executed: 2021-07-28
YSMALDO, LANDAEZ
Executed: 2021-07-27
Assignee
YAMAHA ROBOTICS HOLDINGS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 2088585, JAPAN
Covered Property
(1)
Wire Bonding State Determination Method and Device Using a Prescribed Electric Waveform
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.