Wire bonding state determination method and device using a prescribed electric waveform
Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.
1 . A wire bonding state determination method for determining a bonding state between an electrode and a wire is determined after the wire is bonded to the electrode, comprising:
a waveform detection step in which a prescribed electric waveform is incident to the wire, and a transmission waveform of the wire and a reflection waveform from a bonding surface between the electrode and the wire are detected, wherein the transmission waveform is detected after the prescribed electric waveform is incident to the wire and before the prescribed electric waveform is reflected by the bonding surface, and the reflection waveform is detected after the prescribed electric waveform is reflected by the bonding surface, wherein the bonding surface is formed from a metal of the electrode and a metal of the wire which are bonded; and
a bonding determination step in which the bonding state between the electrode and the wire is determined by comparing the transmission waveform and the reflection waveform detected by the waveform detection step, wherein
in the bonding determination step, a bonding area of the bonding surface is determined to be smaller than a prescribed area when a magnitude of the reflection waveform detected by the waveform detection step is greater than a magnitude of the transmission waveform, and the bonding area of the bonding surface is determined to be equal to or larger than the prescribed area when the magnitude of the reflection waveform is equal to or smaller than the magnitude of the transmission waveform.
2 . The wire bonding state determination method according to claim 1 , comprising
a reference waveform detection step in which the prescribed electric waveform is incident to the wire in a good bonding state with the electrode, and a reflection waveform from the bonding surface are detected as a reference waveform, wherein
in the bonding determination step, defect bonding is determined when a magnitude of the reflection waveform detected by the waveform detection step is greater than a magnitude of the reflection waveform included in the reference waveform, and good bonding is determined when the magnitude of the reflection waveform detected by the waveform detection step is equal to or smaller than the magnitude of the reflection waveform included in the reference waveform.
3 . The wire bonding state determination method according to claim 2 , wherein
bonding of the wire to the electrode is performed by ball bonding in which a free air ball formed at a front end of the wire is crimped and bonded to the electrode to form a crimp ball, and
the bonding surface is a first bonding surface between the crimp ball and the electrode.
4 . The wire bonding state determination method according to claim 1 , wherein
bonding of the wire to the electrode is performed by ball bonding in which a free air ball formed at a front end of the wire is crimped and bonded to the electrode to form a crimp ball, and
the bonding surface is a first bonding surface between the crimp ball and the electrode.
5 . A wire bonding state determination device, which determines a bonding state between an electrode and a wire after the wire is bonded to the electrode, comprising:
a waveform detector which makes a prescribed electric waveform incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a bonding surface between the electrode and the wire, wherein the transmission waveform is detected after the prescribed electric waveform is incident to the wire and before the prescribed electric waveform is reflected by the bonding surface, and the reflection waveform is detected after the prescribed electric waveform is reflected by the bonding surface, wherein the bonding surface is formed from a metal of the electrode and a metal of the wire which are bonded; and
a bonding determination unit which determines the bonding state between the electrode and the wire by comparing the transmission waveform and the reflection waveform detected by the waveform detector, wherein
a bonding area of the bonding surface is determined to be smaller than a prescribed area when a magnitude of the reflection waveform detected by the waveform detection step is greater than a magnitude of the transmission waveform, and the bonding area of the bonding surface is determined to be equal to or larger than the prescribed area when the magnitude of the reflection waveform is equal to or smaller than the magnitude of the transmission waveform.
6 . The wire bonding state determination device according to claim 5 , wherein
the bonding determination unit comprises a reference waveform database which stores, as a reference waveform, a reflection waveform from the bonding surface when the prescribed electric waveform is incident from the waveform detector to the wire in a good bonding state with the electrode, and
with reference to the reference waveform database, defect bonding is determined when a magnitude of the reflection waveform detected by the waveform detector is greater than a magnitude of the reflection waveform included in the reference waveform, and good bonding is determined when the magnitude of the reflection waveform detected by the waveform detector is equal to or smaller than the magnitude of the reflection waveform included in the reference waveform.