IP Library › Granted Patent US 12,495,511
Granted Patent B2
US 12,495,511 · App. 18/038,319 · Granted Dec 9, 2025

Electronic control device

Inventors: Yusuke Takahashi (Hitachinaka, JP); Yoshio Kawai (Hitachinaka, JP)
Assignee: Hitachi Astemo, Ltd.
H05K5/065H05F3/02H05K5/0052H05K5/006H05K5/0069H05K5/04H05K9/0067B60R16/02
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,495,511
App. No.
18/038,319
Granted
Dec 9, 2025
Kind
B2
Abstract

An electronic control device includes a non-conductive resin housing; a circuit board; a metal housing; a waterproof seal material; and a conductive adhesive. The circuit board has a circuit ground (GND pattern), and is held by the resin housing. The metal housing covers the circuit board and is attached to the resin housing. The waterproof seal material seals and waterproofs the resin housing and the metal housing. The conductive adhesive is in contact with the metal housing and the circuit ground, and electrically connects the metal housing to the circuit ground at a plurality of points.

Claims (49)

1 . An electronic control device comprising:

a non-conductive resin housing;

a circuit board having a circuit ground and held by the non-conductive resin housing;

a conductive metal housing that covers the circuit board and that is attached to the non-conductive resin housing;

a waterproof seal material that seals and waterproofs the non-conductive resin housing and the metal housing;

a conductive adhesive that is in contact with the conductive metal housing, the circuit board, and the circuit ground and that electrically connects the conductive metal housing to the circuit ground at a plurality of points; and

a recess provided in the non-conductive resin housing and between the waterproof seal material and the conductive adhesive, and

wherein in a cross-sectional view a first end of the circuit board is a portion of a first inner wall of the recess.

2 . The electronic control device according to claim 1 ,

wherein the recess is a depression provided in the non-conductive resin housing, and

wherein the depression penetrates below the circuit board.

3 . The electronic control device according to claim 1 , comprising:

a protrusion adjacent to a second inner wall of the recess on the waterproof seal material side.

4 . The electronic control device according to claim 3 ,

wherein the height of the protrusion is greater than the thickness of the waterproof seal material.

5 . The electronic control device according to claim 3 ,

wherein the protrusion is provided to the non-conductive resin housing.

6 . The electronic control device according to claim 3 ,

wherein the protrusion is provided with a taper.

7 . The electronic control device according to claim 1 ,

wherein a cross-section of the recess as viewed in the depth direction is rectangular.

8 . The electronic control device according to claim 1 ,

wherein the cross-section of the recess as viewed in the depth direction includes an arcuate shape.

9 . The electronic control device according to claim 1 ,

wherein the cross-section of the recess as viewed in the depth direction is U-shaped.

10 . The electronic control device according to claim 1 ,

wherein the recess is a notch provided to the circuit board.

11 . The electronic control device according to claim 1 , further comprising

a pit provided in the circuit board,

wherein the pit is located at a position next to the recess and between the waterproof seal material and the conductive adhesive.

12 . The electronic control device according to claim 1 ,

wherein the conductive adhesive electrically connects the conductive metal housing to the circuit ground at four or more points.

13 . The electronic control device according to claim 1 ,

wherein the conductive adhesive is located on edges of the circuit board.

14 . An electronic control device comprising:

a non-conductive resin housing;

a circuit board having a circuit ground and held by the non-conductive resin housing;

a conductive metal housing that covers the circuit board and that is attached to the non-conductive resin housing;

a waterproof seal material that seals and waterproofs the non-conductive resin housing and the metal housing;

a conductive adhesive that is in contact with the conductive metal housing, the circuit board, and the circuit ground and that electrically connects the conductive metal housing to the circuit ground at a plurality of points; and

a recess provided in the non-conductive resin housing and between the waterproof seal material and the conductive adhesive,

wherein the recess includes a protrusion adjacent to one of a first inner wall of the recess on a side with the waterproof seal material or a second inner wall of the recess on a side with the conductive adhesive, and

wherein the protrusion is adjacent to the first inner wall of the recess when the waterproof seal material has a higher viscosity than the conductive adhesive, and the protrusion is adjacent to the second inner wall of the recess when the conductive adhesive has a higher viscosity than the waterproof seal material.

15 . The electronic control device according to claim 14 ,

wherein when the protrusion is adjacent to the first inner wall, a height of the protrusion is greater than the thickness of the waterproof seal material.

16 . The electronic control device according to claim 14 ,

wherein the protrusion is provided to the non-conductive resin housing.

17 . The electronic control device according to claim 14 ,

wherein the protrusion is provided with a taper.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2023
From: TAKAHASHI, YUSUKE; KAWAI, YOSHIO
To: HITACHI ASTEMO, LTD.
Reel/Frame 063732/0502 →
Priority Claims (1)
JP 2021-038527 · Mar 10, 2021 · national
Continuity (1)
Related Publication 20240008207A1 · Jan 4, 2024
References Cited (43)
US 6407925B1 · Kobayashi · 2002 [cited by examiner]
US 7257003B2 · Ono · 2007 [cited by examiner]
US 7259969B2 · Zarganis · 2007 [cited by examiner]
US 7417873B2 · Kadoya · 2008 [cited by examiner]
US 7791888B2 · Tominaga · 2010 [cited by examiner]
US 8107242B2 · Yoshimoto · 2012 [cited by examiner]
US 8139364B2 · Wickett · 2012 [cited by examiner]
US 8520397B2 · Azumi · 2013 [cited by examiner]
US 9281607B2 · Lee · 2016 [cited by examiner]
US 9480189B2 · Kawai · 2016 [cited by examiner]
US 9795053B2 · Sanada · 2017 [cited by examiner]
US 10188005B2 · Albert · 2019 [cited by examiner]
US 10194548B2 · Ishikawa · 2019 [cited by examiner]
US 10201108B2 · Lee · 2019 [cited by examiner]
US 10212831B2 · Karszt · 2019 [cited by examiner]
US 10729021B1 · Sanchez · 2020 [cited by examiner]
US 20090251843A1 · Hironaka · 2009 [cited by examiner]
US 20100103632A1 · Kato · 2010 [cited by examiner]
US 20130215582A1 · Dittrich · 2013 [cited by examiner]
US 20140016242A1 · Hattori · 2014 [cited by examiner]
US 20140334115A1 · Yang · 2014 [cited by examiner]
US 20150264829A1 · Christoph · 2015 [cited by examiner]
US 20160033621A1 · Ottenhues · 2016 [cited by examiner]
US 20160165736A1 · Tsuboi · 2016 [cited by examiner]
US 20160174404A1 · Kang · 2016 [cited by examiner]
US 20190044452A1 · Arita · 2019 [cited by examiner]
US 20190223287A1 · Nishida et al. · 2019 [cited by applicant]
US 20190252953A1 · Tsuboi · 2019 [cited by examiner]
US 20190380226A1 · Kojima · 2019 [cited by examiner]
US 20200236797A1 · Stilianos · 2020 [cited by examiner]
JP H0897584A · 1996 [cited by applicant]
JP H0897854A · 1996 [cited by applicant]
JP H10107476A · 1998 [cited by applicant]
JP 2007005356A · 2007 [cited by applicant]
JP 2009077211A · 2009 [cited by applicant]
JP 2014220921A · 2014 [cited by examiner]
JP 2015220153A · 2015 [cited by applicant]
JP 6277061B2 · 2018 [cited by examiner]
JP 6302093B2 · 2018 [cited by examiner]
JP 2019125668A · 2019 [cited by applicant]
JP 2019133858A · 2019 [cited by applicant]
PCT/JP2021/035128 International Search Report, Nov. 30, 2021, 3 pgs. [cited by applicant]
Notification of Transmittal of Copies of Translation of the International Preliminary Report on Patentability. issued on Sep. 21, 2023 for PCT International Application No. PCT/JP2021/035128. [cited by applicant]