Polishing pad with window and method of manufacturing the same
This invention relates to a polishing pad and a method for manufacturing the same. The polishing pad may include a top pad layer and a window block. The top pad layer may include a groove pattern formed on an upper surface of the top pad layer. A first hole may be formed through the top pad layer. The window block may be inserted into the first hole. The top pad layer and the window block may have a structure coincided with following Formula 1. 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 3. Formula 1 In Formula 1, the gap may indicate a height difference between an upper surface of the top pad layer and an upper surface of the window block, the Thk RTPC may indicate a thickness of the window block, and the Thk grv may indicate a depth of the groove pattern.
1 . A polishing pad comprising:
a top pad layer including a groove pattern formed at an upper surface of the top pad layer to a first depth and a first hole formed through the top pad layer;
a window block inserted into the first hole, and disposed to form a first hole gap formed between the upper surface of the top pad layer and an upper surface of the window block;
wherein the top pad layer and the window block satisfy Formula 1:
1.1
≤
Gap
+
Thk
RTPC
Thk
grv
≤
3.
,
wherein Gap in Formula 1 indicates a height difference between the upper surface of the top pad layer and an upper surface of the window block at the first hole gap, and the Gap in Formula 1 ranges from 0.001 mm to 2 mm, Thk RTPC indicates a thickness of the window block and Thk grv indicates a depth of the groove pattern.
2 . The polishing pad of claim 1 , wherein the depth of the groove pattern is 0.5 mm to 2 mm.
3 . The polishing pad of claim 1 , wherein a thickness of the top pad layer is 0.5 mm to 5 mm.
4 . The polishing pad of claim 1 , wherein a thickness of an upper portion of the window block is 0.2 mm to 5 mm.
5 . The polishing pad of claim 1 , wherein the window block further includes a recess formed at a central portion of a lower surface of the window block.
6 . The polishing pad of claim 1 , wherein the height difference between the upper surface of the top pad layer and the upper surface of the window block is 0.01 mm to 2 mm.
7 . The polishing pad of claim 1 , further comprising a sub-pad layer arranged on a lower surface of the top pad layer, the sub-pad layer including a second hole that is formed through a portion of the sub-pad layer corresponding to the first hole.
8 . The polishing pad of claim 7 , wherein the second hole has a cross-sectional area smaller than a cross-sectional area of the first hole.
9 . The polishing pad of claim 7 , further comprising a first adhesive layer arranged between the top pad layer and the sub-pad layer, the first adhesive layer including a third hole connected to the first hole and the second hole.
10 . The polishing pad of claim 9 , wherein the first adhesive layer has a thickness of 0.001 mm to 3 mm.
11 . The polishing pad of claim 1 , further comprising an additional adhesive layer arranged on a lower surface of the window block.
12 . The polishing pad of claim 7 , wherein the sub-pad layer comprises a thermally fused portion formed at a portion of the sub-pad layer adjacent to a lower surface of the window block.
13 . The polishing pad of claim 1 , wherein the top pad layer and the window block satisfy Formula 2:
1.1
≤
Gap
+
Thk
RTPC
Thk
grv
≤
1.9
.
14 . The polishing pad of claim 1 , wherein the window block further includes a gap-controlling film formed on the upper surface of the window block.
15 . A method of manufacturing a polishing pad, the method comprising:
providing a top pad layer with a groove pattern on an upper surface of the top pad layer;
forming a first hole in the top pad layer; and
forming a window block in the first hole such that a first hole gap is formed between the upper surface of the top pad layer and an upper surface of the window block,
wherein the top pad layer and the window block are formed to satisfy Formula 1,
1.1
≤
Gap
+
Thk
RTPC
Thk
grv
≤
3.
,
wherein Gap in Formula 1 indicates a height difference between the upper surface of the top pad layer and an upper surface of the window block at the first hole gap, and the Gap in Formula 1 ranges from 0.001 mm to 2 mm, Thk RTPC indicates a thickness of the window block and Thk grv indicates a depth of the groove pattern.
16 . The method of claim 15 , further comprising:
forming a gap-controlling film for adjusting the height difference on one surface of the window block; and
pressing an upper surface of the gap-controlling film.
17 . The method of claim 15 , further comprising:
forming a sub-pad layer with a second hole smaller than the first hole, on a lower surface of the top pad layer;
forming a first adhesive layer with a third hole between the lower surface of the top pad layer and the sub pad layer; and
forming an additional adhesive layer on an upper surface of the first adhesive layer around the third hole.
18 . The method of claim 17 , further comprising
forming a fused portion on a lower surface of the first adhesive layer exposed by the second hole.
19 . The method of claim 15 , wherein the top pad layer and the window block are formed to satisfy Formula 2,
1.1
≤
Gap
+
Thk
RTPC
Thk
grv
≤
1.9
.