Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
1. A chemical mechanical polishing (CMP) table having a monitoring function for monitoring a CMP process in-situ, the CMP table comprising:
a polishing pad including an in-situ window area that is thinner than the polishing pad adjacent to the in-situ window area; and
a platen attached to a side of the polishing pad opposite to a polishing side; wherein
the in-situ window area is composed of the same material layer as the polishing pad adjacent to the in-situ window area, and the platen has a hole which is vertically aligned with the in-situ window area, and
the platen has a platen window made of a transparent material in the hole of the platen to provide a void between the in-situ window area and the platen window.
2. The CMP table according to claim 1 , wherein the in-situ window area has a thickness of 1.0 to 2.0 mm.
3. The CMP table according to claim 1 , wherein the polishing pad is made of at least one of syndiotactic 1,2-polybutadiene, polyurethane, and PBD.
4. The CMP table according to claim 1 , wherein the transparent material is at least one of polycarbonate, polyethylene tereplithalate glycol, polypropylene, 2-aryl glycol carbonate, quartz, and glass.
5. The CMP table according to claim 1 , wherein the platen window is flush with the platen.
6. A chemical mechanical polishing (CMP) table having a monitoring function for monitoring a CMP process in-situ, the CMP table comprising:
a polishing pad including an in-situ window area that is thinner than the polishing pad adjacent to the in-situ window area; and
a platen attached to a side of the polishing pad opposite to a polishing side; wherein
the in-situ window area is composed of the same material layer as the polishing pad adjacent to the in-situ window area, and the platen has a hole which is vertically aligned with the in-situ window area,
the platen has a platen window made of a transparent material in the hole of the platen, the hole separating the in-situ window area and the platen window, and
the platen window protrudes into the hole toward the in-situ window area.
7. A chemical mechanical polishing (CMP) table having a monitoring function for monitoring a CMP process in-situ, the CMP table comprising:
a polishing pad including an in-situ window area that is thinner than the polishing pad adjacent to the in-situ window area; and
a platen attached a side of the polishing pad opposite to a polishing side; wherein
the in-situ window area is composed of the same material layer as the polishing pad adjacent to the in-situ window area, and the platen has a hole which is vertically aligned with the in-situ window area,
the platen has a platen window made of a transparent material in the hole of the platen, and
the platen window protrudes from the platen to fill a void between the platen window and the in-situ window area.
8. A chemical mechanical polishing (CMP) table having a monitoring function for monitoring a CMP process in-situ, the CMP table comprising:
a polishing pad including an in-situ window area that is thinner than the polishing pad adjacent to the in-situ window area;
a platen attached to a side of the polishing pad opposite to a polishing side; and
a transparent supporting layer arranged between the in-situ window area and the platen; wherein
the in-situ window area is composed of the same material layer as the polishing pad adjacent to the in-situ window area, and the platen has a hole which is vertically aligned with the in-situ window area,
the platen has a platen window made of a transparent material in the hole of the platen, the hole separating the in-situ window area and the platen window.
9. The CMP table according to claim 8 , wherein the platen window protrudes from the platen and the transparent supporting layer is recessed from the polishing pad.
10. The CMP table according to claim 8 , wherein the platen window is recessed from the platen and the transparent supporting layer protrudes from the polishing pad.
11. The CMP table according to claim 8 , wherein the transparent supporting layer fills a space between the in-situ window area and the platen.