Apparatus with circuit-locating mechanism

1. An apparatus, comprising:

a substrate;

circuit components disposed on the substrate;

a planar mesh over the circuit components; and

one or more section labels formed on the planar mesh, the one or more section labels corresponding to physical locations of the circuit components.

2. The apparatus of claim 1 , wherein the one or more section labels include filler material patterned into the planar mesh.

3. The apparatus of claim 2 , wherein the planar mesh is electrically conductive and comprises a top metal layer.

4. The apparatus of claim 3 , wherein the filler material is a dummy filler.

5. The apparatus of claim 2 , wherein a top metal layer is configured to connect to a supply voltage or a ground connection.

6. The apparatus of claim 1 , wherein each of the section labels (1) correspond to a macro-cell that includes a region in the planar mesh, and (2) include a number, a letter, a shape, or a combination thereof for identifying the unique region.

7. The apparatus of claim 6 , wherein:

the planar mesh includes slots, and

the one or more section labels include a subset of slots that are filled with a filler material to provide the number, the letter, the shape, or the combination thereof.

8. The apparatus of claim 7 , wherein each of the subset of slots that are filled with the filler in the planar mesh is configured to provide a reference for further locating the circuit components.

9. The apparatus of claim 1 , wherein:

the one or more section labels are arranged along a plane that is between the circuit components and a top surface of the apparatus.

10. The apparatus of claim 9 , further comprising:

a top passivation layer over the planar mesh; and

wherein:

the one or more section labels are visible through the top passivation layer.

11. The apparatus of claim 10 , wherein:

the top passivation layer includes a first material; and

the one or more section labels include a second material having at least one physical characteristic different than the first material.

12. The apparatus of claim 1 , wherein the apparatus comprises a semiconductor device.

13. A method of manufacturing an apparatus, the method comprising:

providing a substrate;

forming circuit components over the substrate;

attaching a planar mesh structure over the circuit components; and

forming one or more section labels on the planar mesh, wherein the one or more section labels are located relative to the circuit components for providing locational reference to the circuit components.

14. The method of claim 13 , wherein forming the one or more section labels includes patterning a number, a letter, a shape, or a combination thereof on a layer disposed between a top surface of the apparatus and the circuit components.

15. The method of claim 13 , wherein:

the planar mesh includes slots; and

forming the one or more section labels includes filling a subset of the slots with filler material.

16. The method of claim 15 , wherein the planar mesh structure comprises a metallic layer and the filler material is a dummy filler.

17. The method of claim 16 , further comprising:

connecting the metallic layer to a voltage source or an electrical ground.

18. The method of claim 15 , further comprising:

forming a top passivation layer over the planar mesh structure, wherein the filler material is detectable through the top passivation layer.

19. The method of claim 15 , further comprising:

attaching a top metal layer over and electrically coupled to the circuit components; and

wherein:

forming the one or more section labels includes filling a subset of the slots with filler material; and

forming circuit components includes:

forming a first metal layer over the substrate,

forming at least one insulative layer over the first metal layer, and

forming the circuit components over at least one insulative layer, wherein at least one of the circuit components are electrically coupled to the first metal layer.

20. A semiconductor device, comprising:

a substrate;

a circuit layer over the substrate, wherein the circuit layer includes a set of components that are arranged in a repetitive pattern along at least one lateral plane;

a top metal layer over the circuit layer, wherein the top metal layer includes slots;

a filler material within the slots for providing visual references in locating and identifying defects and/or components in the circuit layer;

an encapsulant over the top metal layer, the circuit layer, and the substrate; and

wherein:

the filler material is detectable through the encapsulant.