IP Library Granted Patent US 12,495,634
Granted Patent B2
US 12,495,634 · App. 18/074,642 · Granted Dec 9, 2025

Photoelectric conversion device and equipment

Inventors: Kazuo Yamazaki (Kanagawa, JP); Hideo Kobayashi (Tokyo, JP)
Assignee: Canon Kabushiki Kaisha
H10F39/811H10F39/18H10F39/809H10F39/813
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Quick Facts
Patent No.
US 12,495,634
App. No.
18/074,642
Granted
Dec 9, 2025
Kind
B2
Abstract

A photoelectric conversion device includes a first substrate and a second substrate laminated one on another. The first substrate has a pixel region having a photoelectric conversion element for acquiring a pixel signal, the second substrate has a processing circuit for processing the pixel signal, a first wire, which includes a plurality of wire layers and which is a common wire to be connected in common with a plurality of pixels in the pixel region, is arranged, and a second wire, which includes a plurality of wire layers and which is a wire for supplying a power supply voltage to the processing circuit, is arranged. At least a part of a shield wire, which is not to be electrically connected with any of the first wire and the second wire, is arranged between the first wire and the second wire.

Claims (38)

1 . A photoelectric conversion device comprising:

a first substrate and a second substrate laminated one on another,

wherein the first substrate has a pixel region including a photoelectric conversion element for acquiring a pixel signal,

wherein the second substrate has a processing circuit for (1) processing the pixel signal, (2) obtaining a digital signal, and (3) performing digital signal processing of the digital signal,

wherein a first wire, which is a wire including a plurality of wire layers and which is a common wire to be connected in common with a plurality of pixels in the pixel region, is arranged,

wherein a second wire, which is a wire including a plurality of wire layers and which is a wire for supplying a power supply voltage to the processing circuit, is arranged,

wherein at least a part of a shield wire, which is not to be electrically connected with any of the first wire and the second wire, is arranged between the first wire and the second wire, and

wherein the shield wire extends from one end to another end opposite thereto of the processing circuit in a plan view of the second substrate, and

wherein the processing circuit is a circuit for performing gain adjustment of the digital signal.

2 . The photoelectric conversion device according to claim 1 , wherein the first wire is a power supply wire of the pixel region.

3 . The photoelectric conversion device according to claim 1 , wherein the first wire is a ground wire of the pixel region.

4 . The photoelectric conversion device according to claim 1 , wherein the first wire is a vertical output line of the pixel region.

5 . The photoelectric conversion device according to claim 1 , wherein the first wire is a control line of the pixel region.

6 . The photoelectric conversion device according to claim 1 , wherein the second wire is a wire different from a ground wire of the processing circuit, and is a power supply wire of the processing circuit.

7 . The photoelectric conversion device according to claim 1 , wherein the second wire is a ground wire of the processing circuit.

8 . The photoelectric conversion device according to claim 1 , wherein the first wire has a connection region for connecting the first substrate and the second substrate, and

wherein at least a part of the shield wire is arranged between the connection region and the second wire.

9 . The photoelectric conversion device according to claim 1 , wherein at least a part of the shield wire is arranged at the second substrate.

10 . The photoelectric conversion device according to claim 1 , wherein at least a part of the shield wire is arranged at the first substrate.

11 . The photoelectric conversion device according to claim 1 , wherein the second substrate has a pad to which a voltage is supplied from outside the photoelectric conversion device, and

wherein at least a part of the shield wire is arranged between (1) a portion of the second wire for connecting the pad and the processing circuit, and (2) the first wire.

12 . The photoelectric conversion device according to claim 1 , wherein the second substrate has a timing generation circuit for supplying a control signal to the processing circuit, and

wherein the shield wire is connected with a ground wire of the timing generation circuit.

13 . Equipment comprising:

the photoelectric conversion device according to claim 1 ; and

at least any of: (1) an optical device adapted to the photoelectric conversion device, (2) a control device for controlling the photoelectric conversion device, (3) a processing device for processing a signal outputted from the photoelectric conversion device, (4) a display device for displaying information acquired at the photoelectric conversion device, (5) a storage device for storing the information acquired at the photoelectric conversion device, and (6) a machine device operating based on the information acquired at the photoelectric conversion device.

14 . A photoelectric conversion device comprising:

a first substrate and a second substrate laminated one on another,

wherein the first substrate has a pixel region including a photoelectric conversion element for acquiring a pixel signal,

wherein the second substrate has a processing circuit for (1) processing the pixel signal, (2) obtaining a digital signal, and (3) performing digital signal processing of the digital signal,

wherein a first wire, which is a wire including a plurality of wire layers and which is a common wire to be connected in common with a plurality of pixels in the pixel region, is arranged,

wherein a second wire, which is a wire including a plurality of wire layers and which is a wire for supplying a power supply voltage to the processing circuit, is arranged,

wherein at least a part of a shield wire, which is not to be electrically connected with any of the first wire and the second wire, is arranged between the first wire and the second wire,

wherein the shield wire extends from one end to another end opposite thereto of the processing circuit in a plan view of the second substrate, and

wherein the processing circuit is a circuit for performing sorting of data of the digital signal.

15 . Equipment comprising:

the photoelectric conversion device according to claim 14 ; and

at least any of: (1) an optical device adapted to the photoelectric conversion device, (2) a control device for controlling the photoelectric conversion device, (3) a processing device for processing a signal outputted from the photoelectric conversion device, (4) a display device for displaying information acquired at the photoelectric conversion device, (5) a storage device for storing the information acquired at the photoelectric conversion device, and (6) a machine device operating based on the information acquired at the photoelectric conversion device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2023
From: YAMAZAKI, KAZUO; KOBAYASHI, HIDEO
To: CANON KABUSHIKI KAISHA
Reel/Frame 062304/0182 →
Priority Claims (1)
JP 2021-198362 · Dec 7, 2021 · national
Continuity (1)
Related Publication 20230178580A1 · Jun 8, 2023
References Cited (74)
US 7816755B2 · Yamazaki · 2010 [cited by applicant]
US 7889254B2 · Kochi · 2011 [cited by applicant]
US 7990440B2 · Kobayashi · 2011 [cited by applicant]
US 8049799B2 · Sonoda · 2011 [cited by applicant]
US 8325260B2 · Yamazaki · 2012 [cited by applicant]
US 8519459B2 · Horiike et al. · 2013 [cited by applicant]
US 8710558B2 · Inoue · 2014 [cited by applicant]
US 8760337B2 · Yamazaki · 2014 [cited by applicant]
US 8810706B2 · Yamazaki · 2014 [cited by applicant]
US 8836313B2 · Takagi · 2014 [cited by applicant]
US 8884391B2 · Fudaba · 2014 [cited by applicant]
US 8946798B2 · Horiike et al. · 2015 [cited by applicant]
US 9060139B2 · Yamazaki · 2015 [cited by applicant]
US 9136304B2 · Maeda · 2015 [cited by applicant]
US 9264641B2 · Kobayashi · 2016 [cited by applicant]
US 9288415B2 · Yamazaki · 2016 [cited by applicant]
US 9305954B2 · Kato · 2016 [cited by applicant]
US 9357122B2 · Kususaki · 2016 [cited by applicant]
US 9407847B2 · Maehashi · 2016 [cited by applicant]
US 9438828B2 · Itano · 2016 [cited by applicant]
US 9438841B2 · Yamazaki · 2016 [cited by applicant]
US 9509931B2 · Kobayashi · 2016 [cited by applicant]
US 9602752B2 · Kobayashi · 2017 [cited by applicant]
US 9667901B2 · Sakai · 2017 [cited by applicant]
US 9681076B2 · Oguro · 2017 [cited by applicant]
US 9762840B2 · Yamazaki · 2017 [cited by applicant]
US 10015430B2 · Kobayashi · 2018 [cited by applicant]
US 10057529B2 · Saito et al. · 2018 [cited by applicant]
US 10249670B2 · Seko · 2019 [cited by applicant]
US 10403658B2 · Takada · 2019 [cited by applicant]
US 10609316B2 · Kobayashi · 2020 [cited by applicant]
US 10834354B2 · Kobayashi · 2020 [cited by applicant]
US 10854678B2 · Isono et al. · 2020 [cited by applicant]
US 10903253B2 · Wada et al. · 2021 [cited by applicant]
US 10992886B2 · Yamazaki · 2021 [cited by applicant]
US 11114505B2 · Isono et al. · 2021 [cited by applicant]
US 11115608B2 · Sakai · 2021 [cited by applicant]
US 11268851B2 · Kobayashi · 2022 [cited by applicant]
US 11310453B2 · Takada · 2022 [cited by applicant]
US 11431929B2 · Kobayashi · 2022 [cited by applicant]
US 11463644B2 · Soda · 2022 [cited by applicant]
US 11470275B2 · Kobayashi · 2022 [cited by applicant]
US 11496704B2 · Sato · 2022 [cited by applicant]
US 11637147B2 · Isono et al. · 2023 [cited by applicant]
US 20120105696A1 · Maeda · 2012 [cited by applicant]
US 20160336371A1 · Seko · 2016 [cited by applicant]
US 20210021770A1 · Nakazawa · 2021 [cited by applicant]
US 20210021777A1 · Kobayashi et al. · 2021 [cited by applicant]
US 20210314508A1 · Kusano · 2021 [cited by applicant]
US 20210352801A1 · Miyamoto et al. · 2021 [cited by applicant]
US 20210360180A1 · Saito · 2021 [cited by applicant]
US 20220030164A1 · Kobayashi · 2022 [cited by applicant]
US 20220201233A1 · Takada · 2022 [cited by applicant]
US 20220247964A1 · Kobayashi · 2022 [cited by applicant]
US 20220272295A1 · Kobayashi · 2022 [cited by applicant]
US 20220302199A1 · Kobayashi · 2022 [cited by applicant]
US 20220303484A1 · Kobayashi · 2022 [cited by applicant]
US 20220303485A1 · Kobayashi · 2022 [cited by applicant]
US 20220303486A1 · Kobayashi · 2022 [cited by applicant]
US 20230041974A1 · Kobayashi · 2023 [cited by applicant]
US 20230070568A1 · Kobayashi · 2023 [cited by applicant]
US 20230072715A1 · Kobayashi · 2023 [cited by applicant]
US 20230188869A1 · Nakamura · 2023 [cited by examiner]
JP 2011114731A · 2011 [cited by applicant]
JP 2012089739A · 2012 [cited by applicant]
JP 2012094720A · 2012 [cited by applicant]
JP 2015138862A · 2015 [cited by applicant]
JP 2018007000A · 2018 [cited by applicant]
JP 2019102947A · 2019 [cited by applicant]
JP 2019129322A · 2019 [cited by applicant]
JP 2020043219A · 2020 [cited by applicant]
JP 2021019256A · 2021 [cited by applicant]
JP 2021150898A · 2021 [cited by applicant]
Office Action dated Jul. 4, 2023, in Japanese Patent Application No. 2021-198362. [cited by applicant]