Power semiconductor device and method for fabricating the same
View Patent ↗A power semiconductor device includes a semiconductor layer, a well region located inside the semiconductor layer and having a first conductivity type, a source region located on the well region and having a second conductivity type, a gate region in contact with a side surface of the well region and surrounding the well region, a drift region in contact with bottom surfaces of the well region and the gate region and having the second conductivity type, and a contact region located on the well region and having the first conductivity type. The drift region includes a protruding region in contact with another side surface of the well region. The power semiconductor device includes a source electrode in contact with each of the source region, the contact region, and the protruding region.
1 . A power semiconductor device comprising:
a semiconductor layer;
a well region located inside the semiconductor layer and having a first conductivity type;
a source region located on the well region and having a second conductivity type;
a gate region in contact with a side surface of the well region and surrounding the well region;
a drift region in contact with bottom surfaces of the well region and the gate region and having the second conductivity type;
a contact region located on the well region and having the first conductivity type; and
a first channel region and a second channel region located in a region where the gate region and the well region are in contact with each other,
wherein the drift region includes a protruding region in contact with another side surface of the well region,
wherein the power semiconductor device includes a source electrode in contact with each of the source region, the contact region, and the protruding region,
wherein the first channel region includes a horizontal channel extending from the source region toward the protruding region, and
wherein the second channel region includes a vertical channel extending from the source region along a side surface of the gate region.
2 . The power semiconductor device of claim 1 , wherein a Schottky barrier diode is formed between the source electrode and the protruding region.
3 . The power semiconductor device of claim 1 , wherein a doping concentration of the source region is higher than a doping concentration of the drift region.
4 . The power semiconductor device of claim 1 , wherein a doping concentration of the contact region is higher than a doping concentration of the well region.
5 . The power semiconductor device of claim 1 , further comprising:
a substrate region located beneath the drift region and having the second conductivity type; and
a drain electrode located beneath the substrate region and in contact with the substrate region,
wherein a doping concentration of the substrate region is higher than a doping concentration of the drift region.
6 . A power semiconductor device comprising:
a semiconductor layer;
a well region located inside the semiconductor layer and having a first conductivity type;
a source region located on the well region and having a second conductivity type;
a gate region in contact with a side surface of the well region and surrounding the well region;
a drift region in contact with bottom surfaces of the well region and the gate region and having the second conductivity type; and
a contact region located on the well region and having the first conductivity type,
wherein the drift region includes a protruding region in contact with another side surface of the well region,
wherein the power semiconductor device includes a source electrode in contact with each of the source region, the contact region, and the protruding region, and
wherein the gate region is in contact with the well region on at least three surfaces.
7 . A power semiconductor device comprising:
a semiconductor layer;
a well region located inside the semiconductor layer and having a first conductivity type;
a source region located on the well region and having a second conductivity type;
a gate region in contact with a side surface of the well region and surrounding the well region;
a drift region in contact with bottom surfaces of the well region and the gate region and having the second conductivity type; and
a contact region located on the well region and having the first conductivity type,
wherein the drift region includes a protruding region in contact with another side surface of the well region,
wherein the power semiconductor device includes a source electrode in contact with each of the source region, the contact region, and the protruding region,
wherein the well region is located at a first depth from one surface of the semiconductor layer,
wherein the gate region is located at a second depth from the one surface of the semiconductor layer,
wherein the first depth is greater than the second depth, and
wherein the well region includes an extended region extending along the bottom surface of the gate region.
8 . The power semiconductor device of claim 7 , further comprising:
a channel region located in a region where the gate region and the well region are in contact with each other,
wherein the channel region includes a vertical channel extending from the source region along a side surface of the gate region and an extended channel positioned on the extended region and extending along the bottom surface of the gate region.