Direct cooling for SoIC architectures
The disclosed device includes a bottom die layer comprising a bottom die and a top die layer positioned on the bottom die layer and comprising a plurality of top dies and at least one gap between two of the plurality of top dies. The device also includes a cover encapsulating the bottom die layer and the top die layer and comprising an inlet and an outlet for a fluid channel, wherein the fluid channel includes the at least one gap. Various other methods, systems, and computer-readable media are also disclosed.
1 . A device comprising:
a bottom die layer comprising a bottom die;
a top die layer positioned on the bottom die layer and comprising a plurality of top dies;
a gap fill material in the top die layer;
at least one gap between two of the plurality of top dies, wherein the at least one gap is empty of the gap fill material and extends between sidewalls of the two of the plurality of top dies; and
a cover encapsulating the bottom die layer and the top die layer and comprising an inlet and an outlet for a fluid channel, wherein the fluid channel includes the at least one gap.
2 . The device of claim 1 , wherein the bottom die layer includes a second bottom die.
3 . The device of claim 2 , wherein at least one of the plurality of top dies includes a first sidewall overlying a top face of the bottom die and a second sidewall opposite the first sidewall overlying a top face of the second bottom die.
4 . The device of claim 2 , wherein the bottom die layer includes a gap between the bottom die and the second bottom die.
5 . The device of claim 1 , wherein dies of the top die layer are directly bonded to dies of the bottom die layer.
6 . The device of claim 1 , wherein the top die layer includes a greater number of dies than the bottom die layer.
7 . The device of claim 1 , wherein the bottom die is larger than at least one of the plurality of top dies.
8 . The device of claim 1 , wherein at least one of the plurality of top dies includes a first sidewall overlying a top face of the bottom die and a second sidewall opposite the first sidewall overlying the top face of the bottom die.
9 . The device of claim 1 , further comprising a pump for pumping a cooling fluid through the fluid channel.
10 . The device of claim 1 , wherein at least one of the inlet or the outlet is located at a top surface of the cover.
11 . The device of claim 1 , wherein at least one of the inlet or the outlet is located at a sidewall of the cover.
12 . A system comprising:
a substrate;
a first die tier positioned on the substrate and comprising a bottom die;
a second die tier positioned on the first die tier and comprising a plurality of top dies and at least one gap between two of the plurality of top dies;
a cover attached to the substrate and encapsulating the first die tier and the second die tier and comprising an inlet and an outlet for a fluid channel, wherein the fluid channel includes the at least one gap; and
a pump for pumping a cooling fluid through the fluid channel.
13 . The system of claim 12 , wherein the first die tier includes a second bottom die and a gap between the bottom die and the second bottom die.
14 . The system of claim 13 , wherein at least one of the plurality of top dies includes a first sidewall overlying a top face of the bottom die and a second sidewall opposite the first sidewall overlying a top face of the second bottom die.
15 . The system of claim 12 , wherein dies of the second die tier are directly bonded to dies of the first die tier.
16 . The system of claim 12 , wherein at least one of the inlet or the outlet is located at a top surface or a sidewall of the cover.
17 . The system of claim 12 , wherein the second die tier includes a greater number of dies than the first die tier and the bottom die is larger than at least one of the plurality of top dies.
18 . The system of claim 12 , wherein at least one of the plurality of top dies includes a first sidewall overlying a top face of the bottom die and a second sidewall opposite the first sidewall overlying the top face of the bottom die.
19 . A method comprising:
bonding, to a first die tier, a second die tier;
etching away gap fill regions between dies of the second die tier to form a plurality of gaps;
attaching the first die tier to a substrate; and
attaching, to the substrate, a cover encapsulating the first die tier and the second die tier, the cover including an inlet and an outlet for a fluid channel, wherein the fluid channel includes the plurality of gaps.
20 . The method of claim 19 , further comprising etching away gap fill regions between dies of the first die tier.