Method and computer program product for identifying element which limits throughput of plating apparatus
An element which limits throughput of a plating apparatus is identified. A method for identifying an element which limits throughput of a plating apparatus is provided. The method comprises: a step for creating a time chart which represents process schedules of plural processing units and one or plural transfer apparatuses; a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out.
1 . A method for identifying, in a plating apparatus comprising plural processing units for processing substrates and one or plural transfer apparatuses for conveying the substrates, an element in elements comprising the processing units and the one or plural transfer apparatuses which limits throughput of the whole plating apparatus, comprising:
a step for inputting a set of plating process conditions;
a step for creating, based on the set of plating process conditions, a time chart which represents process schedules of the plural processing units and the one or plural transfer apparatuses;
a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the operation rate of the processing unit or the transfer apparatus is defined as a ratio of time relating to operation of the processing unit or the transfer apparatus relative to total operation time of the plating apparatus, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and
a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out.
2 . The method according to claim 1 , wherein the operation rate of the processing unit is calculated based on the sum of substrate processing time spent processing the substrate in the subject processing unit and substrate conveying time spent conveying the substrate between the subject processing unit and a different processing unit by the one or plural transfer apparatuses.
3 . The method according to claim 2 , wherein the substrate conveying time includes time from a start of action to take a substrate out of the subject processing unit to completion of action to store the substrate in a processing unit in a subsequent stage following that including the subject processing unit, and time from a start of action to take a next substrate out of a processing unit in a previous stage before that including the subject processing unit to completion of action to store the next substrate in the subject processing unit.
4 . The method according to claim 3 , wherein the substrate conveying time comprises time of movement of the one or plural transfer apparatuses from the processing unit in the subsequent stage to the processing unit in the previous stage.
5 . The method according to claim 1 , wherein the operation rate of the transfer apparatus is calculated based on the sum of lengths of time spent conveying the substrate by the subject transfer apparatus.
6 . The method according to claim 1 , wherein the degree of freedom of taking-out of the processing unit is calculated based on substrate waiting time from a point in time when processing of the substrate in the subject processing unit is completed to a point in time when it becomes possible to take the substrate out of the subject processing unit.
7 . The method according to claim 6 , wherein the degree of freedom of taking-out of the processing unit is calculated based on a difference between the maximum value and the minimum value of the substrate waiting time of the subject processing unit in the time chart.
8 . The method according to claim 1 , wherein the time chart comprises information relating to timing when each of the plural processing units starts and terminates processing of the substrate.
9 . The method according to claim 1 , wherein the time chart comprises information relating to timing of a start and timing of an end of movement of each of the one or plural transfer apparatuses from one processing unit to the other processing unit.
10 . The method according to claim 9 , wherein the time chart comprises information relating to timing when each of the one or plural transfer apparatuses starts and terminates action for taking the substrate out of the one processing unit, and information relating to timing when each of the one or plural transfer apparatuses starts and terminates action for storing the substrate in the other processing unit.
11 . The method according to claim 1 , wherein each of the operation rate and the degree of freedom of taking-out is displayed with respect to each of the elements in the plating apparatus by using a heat map or a brightness map.
12 . A computer program product which is constructed to make a processor in a computer perform steps for identifying, in a plating apparatus comprising plural processing units for processing substrates and one or plural transfer apparatuses for conveying the substrates, an element in elements comprising the processing units and the one or plural transfer apparatuses which limits throughput of the whole plating apparatus, wherein the steps comprise:
a step for receiving input of a set of plating process conditions;
a step for creating, based on the set of plating process conditions, a time chart which represents process schedules of the plural processing units and the one or plural transfer apparatuses;
a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the operation rate of the processing unit or the transfer apparatus is defined as a ratio of time relating to operation of the processing unit or the transfer apparatus relative to total operation time of the plating apparatus, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and
a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out on a display.