Ceramic electronic component and method of manufacturing the same
A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.
1. A ceramic electronic component comprising:
a body including first and second internal electrodes overlapping each other with a dielectric layer disposed therebetween,
wherein dielectric grains of the dielectric layer have core-shell structures having a core and a shell surrounding at least a portion of the core and including a rare earth element in a concentration higher than the core,
wherein at least one of the dielectric grains has a core-dual shell structure having a core and a dual shell, the dual shell comprises a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, and
wherein a thickness of the first shell along a straight line connecting α and β is 5 to 30% of a distance between α and β, where α denotes a center of the core-dual shell structure in a cross-section of the core-dual shell structure and β denotes a point on a surface of the second shell.
2. The ceramic electronic component according to claim 1 , wherein a concentration of any rare earth element included in the core of the core-shell structure is 0.1 times or less than a concentration of the any rare earth element included in the shell.
3. The ceramic electronic component according to claim 1 , wherein the first shell in the core-dual shell structure is disposed to cover at least 90 area % of a surface of the core.
4. The ceramic electronic component according to claim 1 , wherein a total number of dielectric grains having the core-shell structure in the dielectric layer is 50% or more of a total number of the plurality of dielectric grains in the dielectric layer.
5. The ceramic electronic component according to claim 1 , wherein the dielectric layer comprises one or more of BaTiO3, (Ba,Ca)(Ti,Ca)O 3 , (Ba,Ca)(Ti,Zr)O 3 , Ba(Ti,Zr)O 3 , or (Ba,Ca)(Ti,Sn)O 3 as a main component.
6. The ceramic electronic component according to claim 5 , wherein the dielectric layer has an amount of the rare earth element in a range of 0.1 to 15 moles, relative to 100 moles of the main component.
7. The ceramic electronic component according to claim 1 , wherein the rare earth element is one or more of lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), or ruthenium (Ru).
8. The ceramic electronic component according to claim 5 , wherein the dielectric layer further comprises one or more of Mn, Cr, Ba, Si, Al, Mg, or Zr as a minor component.
9. The ceramic electronic component according to claim 1 , wherein at least one of the dielectric grains having the core-shell structure is arranged in a region of the dielectric layer disposed 0.41 μm or less from both the first and second internal electrodes.
10. The ceramic electronic component according to claim 1 , wherein the first and second shells include different rare earth elements.
11. The ceramic electronic component according to claim 1 , wherein β denotes a point on a surface of the second shell farthest from α.