IP Library › Granted Patent US 12,359,344
Granted Patent B2
US 12,359,344 · App. 18/087,156 · Granted Jul 15, 2025

Silicon carbide powder and method for manufacturing silicon carbide ingot using the same

Inventors: Jong Hwi Park (Gyeonggi-do, KR); Kap Ryeol Ku (Gyeonggi-do, KR); Jung Gyu Kim (Gyeonggi-do, KR); Jung Woo Choi (Gyeonggi-do, KR); Jung Doo Seo (Gyeonggi-do, KR); Myung Ok Kyun (Gyeonggi-do, KR)
Assignee: Senic Inc.
C30B29/36C01B32/956C30B23/02C01P2004/61
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,359,344
App. No.
18/087,156
Granted
Jul 15, 2025
Kind
B2
Abstract

Disclosed are a silicon carbide powder and a method of manufacturing a silicon carbide ingot using the same. More particularly, the silicon carbide powder includes carbon and silicon and has a particle circularity of 0.4 to 0.9 measured through 2D image analysis.

Claims (20)

1. A silicon carbide powder, comprising carbon and silicon,

wherein a particle circularity measured through 2D image analysis is 0.4 to 0.9,

wherein a particle curvature measured through the 2D image analysis is 0.8 to 0.99,

wherein a particle elongation measured through the 2D image analysis is 0.7 to 0.95, and

wherein an equivalent circle diameter measured through the 2D image analysis is 150 μm to 3 mm.

2. The silicon carbide powder according to claim 1 , wherein a particle ellipticity measured through the 2D image analysis is 0.92 or more.

3. The silicon carbide powder according to claim 1 , wherein a charge space elongation measured through the 2D image analysis is 0.6 to 0.9.

4. The silicon carbide powder according to claim 1 , wherein a charge space curvature measured through the 2D image analysis is 0.8 to 0.95.

5. The silicon carbide powder according to claim 1 , wherein the equivalent circle diameter measured through the 2D image analysis is 200 μm to 350 μm.

6. The silicon carbide powder according to claim 1 , wherein the equivalent circle diameter measured through the 2D image analysis is 350 μm to 700 μm.

7. The silicon carbide powder according to claim 1 , wherein the equivalent circle diameter measured through the 2D image analysis is 800 μm to 30003500 μm.

8. A method of manufacturing a silicon carbide wafer, the method comprising:

preparing a silicon carbide powder comprising a silicon carbide powder carbon and silicon and having a particle circularity of 0.4 to 0.9 measured through 2D image analysis;

growing a silicon carbide ingot using the silicon carbide powder; and

processing the silicon carbide ingot,

wherein a particle curvature measured through the 2D image analysis is 0.8 to 0.99,

wherein a particle elongation measured through the 2D image analysis is 0.7 to 0.95, and

wherein an equivalent circle diameter measured through the 2D image analysis is 150 μm to 3 mm.

9. The method according to claim 8 , wherein in the growing, the silicon carbide powder is filled in a crucible, wherein the silicon carbide powder filled in the crucible has a porosity of 10 vol % to 50 vol %, and

in the growing, the silicon carbide ingot has a growth rate of 250 μm/hr to 400 μm/hr.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2025
From: SENIC INC.
To: EIN CRYSTAL CO., LTD.
Reel/Frame 072990/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2022
From: PARK, JONG HWI; KU, KAP RYEOL; KIM, JUNG GYU; CHOI, JUNG WOO; SEO, JUNG DOO; KYUN, MYUNG OK
To: SENIC INC.
Reel/Frame 062186/0691 →
Priority Claims (1)
KR 10-2021-0186628 · Dec 23, 2021 · national
Continuity (1)
Related Publication 20230203710A1 · Jun 29, 2023
References Cited (37)
US 10822720B1 · Park et al. · 2020 [cited by applicant]
US 20020165078A1 · Otsuki et al. · 2002 [cited by applicant]
US 20040161376A1 · Otsuki et al. · 2004 [cited by applicant]
US 20120183466A1 · Sasaki · 2012 [cited by applicant]
US 20140004303A1 · Sasaki · 2014 [cited by applicant]
US 20160160386A1 · Masuda et al. · 2016 [cited by applicant]
US 20160289863A1 · Sasaki · 2016 [cited by applicant]
US 20210163301A1 · Park et al. · 2021 [cited by applicant]
CN 102795626A · 2012 [cited by applicant]
CN 105503195A · 2016 [cited by applicant]
CN 105734673A · 2016 [cited by applicant]
CN 106185945A · 2016 [cited by applicant]
CN 107244919A · 2017 [cited by applicant]
DE 4224173A1 · 1994 [cited by applicant]
EP 2660362A1 · 2013 [cited by applicant]
JP 2002032676A · 2002 [cited by applicant]
JP 2002293660A · 2002 [cited by applicant]
JP 2002326876A · 2002 [cited by applicant]
JP 2003202707A · 2003 [cited by applicant]
JP 2008001532A · 2008 [cited by applicant]
JP 2010222155A · 2010 [cited by applicant]
JP 2011023094A · 2011 [cited by applicant]
JP 2019006651A · 2019 [cited by applicant]
JP 2019119663A · 2019 [cited by applicant]
JP 2021014395A · 2021 [cited by applicant]
KR 1020120130318A · 2012 [cited by applicant]
KR 1020150053367A · 2015 [cited by applicant]
KR 1020160036527A · 2016 [cited by applicant]
KR 102068933B1 · 2020 [cited by applicant]
KR 1020200077184A · 2020 [cited by applicant]
KR 102218607B1 · 2021 [cited by applicant]
KR 1020210066523A · 2021 [cited by applicant]
KR 102293576B1 · 2021 [cited by applicant]
WO 2015079906A1 · 2015 [cited by applicant]
Office Action for the Japanese Patent Application No. 2022-197515 issued by the Japanese Patent Office on Jan. 23, 2024. [cited by applicant]
Extended European Search Report for the European Patent Application No. 22209769.3 issued by the European Patent Office on May 23, 2023. [cited by applicant]
Office Action for Chinese Patent Application No. 202211665374.6 issued by the Chinese Patent Office on Jan. 27, 2025. [cited by applicant]