Backside deep trench capacitor and inductor structures
Single-chip solutions that result in high capacitance and/or inductance densities. Embodiments provide relatively large capacitance and/or inductance values for applications utilizing DC and/or sub-KHz signals up to RF signals. Embodiments may include an integrated circuit having a substrate having a backside, a substructure formed on the substrate, and a superstructure formed on the substructure and having a metallization layer, the integrated circuit further including at least one backside deep trench capacitor structure including: one or more trenches formed in the backside of the substrate and lined with a first conductive layer, a dielectric, and a second conductive layer; a first electrical connection between the first conductive layer and a first portion of the metallization layer; and a second electrical connection between the second conductive layer and a second portion of the metallization layer. Embodiments may also include an integrated circuit having at least one backside deep trench capacitor structure.
1 . An integrated circuit including a substrate having a backside and a front side, a substructure formed on the front side of the substrate and including an active layer, and a superstructure formed on the substructure, the superstructure including a metallization layer, the integrated circuit further including at least one backside deep trench capacitor structure including:
(a) one or more trenches formed in the backside of the substrate and lined with a first conductive layer, a dielectric, and a second conductive layer;
(b) a first electrical connection between the first conductive layer and a first portion of the metallization layer; and
(c) a second electrical connection between the second conductive layer and a second portion of the metallization layer.
2 . The invention of claim 1 , wherein at least one of the first electrical connection or the second electrical connection is a through-silicon via.
3 . The invention of claim 1 , wherein at least one of the one or more trenches is formed from the backside of the substrate and through the substrate to the first portion of the metallization layer.
4 . The invention of claim 1 , wherein the second electrical connection is formed from a capped connector trench.
5 . The invention of claim 1 , wherein the first conductive layer includes a conductive region of the substrate around at least one of the one or more trenches.
6 . The invention of claim 5 , wherein the second electrical connection is formed from a connector trench.
7 . An integrated circuit including a substrate having a backside and a front side, a substructure formed on the front side of the substrate and including an active layer, and a superstructure formed on the substructure, the superstructure including at least one metallization layer, the integrated circuit further including at least one backside deep trench capacitor structure including:
(a) one or more trenches formed in the backside of the substrate and lined with a first set of layers including a first conductive layer, a dielectric, and a second conductive layer, wherein the first conductive layer of the first set of layers of at least one of the one or more trenches is in electrical contact with a corresponding portion of the at least one metallization layer; and
(b) a capped connector trench formed in the backside of the substrate and lined with a second set of layers including a first conductive layer, a dielectric, and a second conductive layer, wherein the first conductive layer and the second conductive layer of the second set of layers of the capped connector trench are shorted together and (1) in electrical contact with the second conductive layer of the first set of layers of the one or more trenches, and (2) in electrical contact with an associated portion of the at least one metallization layer.
8 . A method of making at least one backside deep trench capacitor structure in an integrated circuit having a substrate having a backside and a front side, a substructure formed on the front side of the substrate and including an active layer, and a superstructure formed on the substructure, the superstructure including a metallization layer, the method including:
(a) forming one or more trenches in the backside of the substrate;
(b) lining at least one of the one or more trenches with a first conductive layer, a dielectric, and a second conductive layer;
(c) forming a first electrical connection between the first conductive layer and a first portion of the metallization layer; and
(d) forming a second electrical connection between the second conductive layer and a second portion of the metallization layer.
9 . The method of claim 8 , wherein at least one of the first electrical connection or the second electrical connection is a through-silicon via.
10 . The method of claim 8 , wherein at least one of the one or more trenches is formed from the backside of the substrate and through the substrate to the first portion of the metallization layer.
11 . The method of claim 8 , further including forming the second electrical connection as a capped connector trench.
12 . The method of claim 8 , wherein the first conductive layer includes a conductive region of the substrate around at least one of the one or more trenches.
13 . The method of claim 12 , further including forming the second electrical connection as a connector trench.
14 . The method of claim 8 , further including mounting the integrated circuit on another structure before making the at least one backside deep trench capacitor structure.
15 . The method of claim 14 , wherein the other structure is one of an interposer or laminate.
16 . The method of claim 14 , wherein the other structure is a second integrated circuit.