Temperature control device, electronic component handling apparatus, electronic component test apparatus, and DUT temperature control method
A temperature control device controls a temperature of a device under test (DUT) including a device flow path in testing the DUT, and includes: a first flow path that has a first connection port to be connected to an inlet of the device flow path; and a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path.
1. A temperature control device that controls a temperature of a device under test (DUT) in testing the DUT by an electronic component test apparatus, the temperature control device comprising:
a first flow path that has a first connection port configured to be separably connected to an inlet of a device flow path of the DUT, wherein the device flow path is a space between a board of the DUT and a lid that is attached to the board and covers a die mounted on the board, and the inlet is formed in the board or the lid; and
a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path such that the first fluid passes through the device flow path and directly contacts the die.
2. A device under test (DUT) temperature control method for controlling a temperature of a DUT using the temperature control device according to claim 1 , the DUT temperature control method comprising:
(a) connecting the first connection port to the inlet of the device flow path; and
(b) supplying the first fluid to the device flow path through the first flow path.
3. A temperature control device that controls a temperature of a device under test (DUT) comprising a device flow path in testing the DUT, the temperature control device comprising:
a first flow path that has a first connection port to be connected to an inlet of the device flow path;
a second flow path that has a second connection port to be connected to an outlet of the device flow path;
a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path; and
a purge system that is connected to the first and second flow paths and supplies a second fluid for purge to the device flow path.
4. The temperature control device according to claim 3 , wherein
he fluid supply system comprises:
a third flow path connected to the first flow path;
a fourth flow path connected to the second flow path;
a first valve disposed on the third flow path; and
a second valve disposed on the fourth flow path,
the purge system comprises:
a connection part to which a first supply source that supplies the second fluid is connected;
a fifth flow path that connects the connection part and the first flow path;
a sixth flow path connected to the second flow path;
a third valve disposed on the fifth flow path; and
a fourth valve disposed on the sixth flow path,
the fluid supply system opens the first and second valves to supply the first fluid to the device flow path in a state where the third and fourth valves are closed, and
the purge system opens the third and fourth valves to supply the second fluid to the device flow path in a state where the first and second valves are closed.
5. The temperature control device according to claim 4 , wherein
the sixth flow path is connected to the fluid supply system.
6. The temperature control device according to claim 4 , wherein
at a time when the first and second connection ports move away from the inlet and the outlet, the purge system opens the third valve to supply the second fluid to the device flow path in a state where the first, second, and fourth valves are closed.
7. The temperature control device according to claim 3 , further comprising:
a pressure sensor that detects a pressure value in the first flow path; and
a controller that determines a first seal state between the inlet and the first connection port and a second seal state between the second connection port and the outlet based on the pressure value.
8. The temperature control device according to claim 7 , wherein
the fluid supply system comprises:
a third flow path connected to the first flow path;
a fourth flow path connected to the second flow path;
a first valve disposed on the third flow path; and
a second valve disposed on the fourth flow path,
the purge system comprises:
a connection part to which a first supply source that supplies the second fluid is connected;
a fifth flow path that connects the connection part and the first flow path;
a sixth flow path connected to the second flow path;
a third valve disposed on the fifth flow path; and
a fourth valve disposed on the sixth flow path,
the purge system opens the third valve to supply the second fluid in a state where the first, second, and fourth valves are closed,
the pressure sensor detects first and second pressure values at different timings after the third valve is closed, and
the controller determines the first and second seal states based on the first and second pressure values.
9. The temperature control device according to claim 3 , wherein
the fluid supply system comprises:
multiple first seal rings disposed to surround the first connection port; and
multiple second seal rings disposed to surround the second connection port.
10. The temperature control device according to claim 3 , wherein
the first fluid includes:
a third fluid; and
a fourth fluid having a temperature different from a temperature of the third fluid, and
the fluid supply system comprises:
a second supply source that supplies the third fluid; and
a third supply source that supplies the fourth fluid.
11. An electronic component handling apparatus handling a DUT, the electronic component handling apparatus comprising:
the temperature control device according to claim 3 ; and
a pusher in which the first and second flow paths of the temperature control device are disposed and that contacts and presses the DUT against a socket.
12. The electronic component handling apparatus according to claim 11 , wherein the outlet is formed in the lid.
13. An electronic component test apparatus comprising:
the electronic component handling apparatus according to claim 11 ; and
a tester that comprises a socket.
14. A device under test (DUT) temperature control method for controlling a temperature of a DUT using the temperature control device according to claim 3 , the DUT temperature control method comprising:
(a) connecting the first connection port to the inlet of the device flow path;
(b) supplying the first fluid to the device flow path through the first flow path; and
(c) supplying the second fluid to the device flow path after stopping the supply of the first fluid.
15. The DUT temperature control method according to claim 14 , wherein
the purge system comprises:
a connection part to which a first supply source that supplies the second fluid is connected;
a fifth flow path that connects the connection part and the first flow path;
a sixth flow path connected to the second flow path;
a third valve disposed on the fifth flow path; and
a fourth valve disposed on the sixth flow path, and
the DUT temperature control method further comprises:
(d) at a time when the first and second connection ports move away from the inlet and the outlet, opening the third valve to supply the second fluid to the device flow path in a state where the fourth valve is closed.
16. The DUT temperature control method according to claim 14 , wherein
the temperature control device comprises a pressure sensor that detects first and second pressure values in the first flow path, and
the DUT temperature control method further comprises:
(e) supplying the second fluid;
(f) detecting the first pressure value after stopping the supply of the second fluid;
(g) detecting the second pressure value after step (f); and
(h) determining a first seal state between the inlet and the first connection port and a second seal state between the second connection port and the outlet based on the first and second pressure values,
steps (e) to (h) are executed before step (b) is executed, and
after determining that the first and second seal states are secured in step (h), step (b) is executed.