US 3432369A
· Naastepad
· 1969
[cited by applicant]
US 3640657A
· Rowe et al.
· 1972
[cited by applicant]
US 3661726A
· Denes
· 1972
[cited by applicant]
US 3684593A
· Benz et al.
· 1972
[cited by applicant]
US 3884062A
· Green
· 1975
[cited by applicant]
US 3892603A
· Reid
· 1975
[cited by applicant]
US 3924429A
· Fuchs, Jr.
· 1975
[cited by examiner]
US 3933536A
· Doser et al.
· 1976
[cited by applicant]
US 3977918A
· Paladino et al.
· 1976
[cited by applicant]
US 3989548A
· Morris
· 1976
[cited by applicant]
US 4287749A
· Bachrach et al.
· 1981
[cited by applicant]
US 4300378A
· Thiruvarudchelvan
· 1981
[cited by applicant]
US 4431467A
· Staley et al.
· 1984
[cited by applicant]
US 4585473A
· Narasimhan et al.
· 1986
[cited by applicant]
US 4778542A
· Clemens
· 1988
[cited by applicant]
US 4801340A
· Inoue et al.
· 1989
[cited by applicant]
US 4808224A
· Anderson et al.
· 1989
[cited by applicant]
US 4892596A
· Chatterjee
· 1990
[cited by applicant]
US 4985085A
· Chatterjee
· 1991
[cited by applicant]
US 5026438A
· Young et al.
· 1991
[cited by applicant]
US 5089060A
· Bradley et al.
· 1992
[cited by applicant]
US 5226989A
· Sukonnik
· 1993
[cited by applicant]
US 5242508A
· McCallum et al.
· 1993
[cited by applicant]
US 5262123A
· Thomas et al.
· 1993
[cited by applicant]
US 5283130A
· Bradley et al.
· 1994
[cited by applicant]
US 5437545A
· Hirai
· 1995
[cited by applicant]
US 5461898A
· Lessen
· 1995
[cited by applicant]
US 5470401A
· McCallum et al.
· 1995
[cited by applicant]
US 5492264A
· Wadleigh
· 1996
[cited by applicant]
US 5737959A
· Korbel et al.
· 1998
[cited by applicant]
US 5739498A
· Sunamoto et al.
· 1998
[cited by applicant]
US 5964117A
· Holroyd et al.
· 1999
[cited by applicant]
US 5988484A
· Osborn et al.
· 1999
[cited by applicant]
US 6022424A
· Sellers et al.
· 2000
[cited by applicant]
US 6036467A
· Jameson
· 2000
[cited by applicant]
US 6638462B2
· Davidson et al.
· 2003
[cited by applicant]
US 6843405B2
· Okamoto et al.
· 2005
[cited by applicant]
US 6940379B2
· Creighton
· 2005
[cited by applicant]
US 7096705B2
· Segal
· 2006
[cited by applicant]
US 7314670B2
· Bartsch et al.
· 2008
[cited by applicant]
US 7322508B2
· Chang
· 2008
[cited by applicant]
US 7954692B2
· Fukuda
· 2011
[cited by applicant]
US 8016179B2
· Burford
· 2011
[cited by applicant]
US 8240540B2
· Tanaka et al.
· 2012
[cited by applicant]
US 8313692B2
· Somekawa et al.
· 2012
[cited by applicant]
US 8695868B2
· Messer et al.
· 2014
[cited by applicant]
US 20020029601A1
· Kwok
· 2002
[cited by applicant]
US 20040238501A1
· Kawazoe et al.
· 2004
[cited by applicant]
US 20060005898A1
· Lui et al.
· 2006
[cited by applicant]
US 20080029581A1
· Kumagai et al.
· 2008
[cited by applicant]
US 20080048005A1
· Forrest et al.
· 2008
[cited by applicant]
US 20080202653A1
· Ignberg
· 2008
[cited by applicant]
US 20090269605A1
· Warke et al.
· 2009
[cited by applicant]
US 20090291322A1
· Watanabe et al.
· 2009
[cited by applicant]
US 20100059151A1
· Iwamura et al.
· 2010
[cited by applicant]
US 20110309131A1
· Hovanski et al.
· 2011
[cited by applicant]
US 20120006086A1
· Manchiraju et al.
· 2012
[cited by applicant]
US 20120052322A1
· Hatakeyama et al.
· 2012
[cited by applicant]
US 20120168045A1
· Ihara et al.
· 2012
[cited by applicant]
US 20140102159A1
· Denison
· 2014
[cited by applicant]
US 20140283574A1
· Lavender et al.
· 2014
[cited by applicant]
US 20140291886A1
· Mark et al.
· 2014
[cited by applicant]
US 20150075242A1
· Eller et al.
· 2015
[cited by applicant]
US 20150115019A1
· Pascal et al.
· 2015
[cited by applicant]
US 20150360317A1
· Kalvala et al.
· 2015
[cited by applicant]
US 20160008918A1
· Burford
· 2016
[cited by applicant]
US 20160167353A1
· Fan et al.
· 2016
[cited by applicant]
US 20160184922A1
· Kikyo
· 2016
[cited by applicant]
US 20160228932A1
· Hayashi et al.
· 2016
[cited by applicant]
US 20170008121A1
· Li
· 2017
[cited by applicant]
US 20170304933A1
· Miles et al.
· 2017
[cited by applicant]
US 20180043467A1
· Huysmans
· 2018
[cited by applicant]
US 20180050419A1
· Das et al.
· 2018
[cited by applicant]
US 20180073532A1
· Whalen et al.
· 2018
[cited by applicant]
US 20180354231A1
· Iwase
· 2018
[cited by applicant]
US 20190275608A1
· Das et al.
· 2019
[cited by applicant]
US 20230234115A1
· Kappagantula et al.
· 2023
[cited by applicant]
CN 106140847A
· 2016
[cited by applicant]
CN 107282671A
· 2017
[cited by applicant]
CN 105925846
· 2018
[cited by applicant]
CN 109295332B
· 2020
[cited by applicant]
CN 112512710B
· 2023
[cited by applicant]
EP 2990178
· 2014
[cited by applicant]
EP 2777837A1
· 2014
[cited by applicant]
EP 3817872B1
· 2025
[cited by applicant]
GB 1258141
· 1971
[cited by applicant]
JP 2002361320A
· 2002
[cited by examiner]
JP 2003275876
· 2003
[cited by applicant]
JP 2004174563A
· 2004
[cited by applicant]
JP 2007222925
· 2007
[cited by applicant]
JP 2009090359A
· 2009
[cited by applicant]
JP 2019115909A
· 2019
[cited by applicant]
KR 101316989B1
· 2013
[cited by applicant]
WO WOPCTUS2019040730
· 2019
[cited by applicant]
WO 2020010331
· 2020
[cited by applicant]
WO 2020053168
· 2020
[cited by applicant]
WO 2021050022
· 2021
[cited by applicant]
WO WO2021062415A1
· 2021
[cited by applicant]
WO 2022043532
· 2022
[cited by applicant]
WO 2022056358
· 2022
[cited by applicant]
WO 2023015228
· 2023
[cited by applicant]
WO WO2023177693A1
· 2023
[cited by applicant]
JP-2002361320-A Translation provided by FIT database (Year: 2025).
[cited by examiner]
WO PCT/US2019/040730 IPRP, Jan. 5, 2021, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2020/053168 IPRP, Apr. 7, 2022, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2020/053168 Search Rpt, Feb. 8, 2021, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2020/053168 Written Opin, Feb. 8, 2021, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2021/050022 IPRP, Dec. 1, 2022, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2021/050022 Search Rpt, Feb. 3, 2022, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2021/050022 Writ. Opin., Feb. 3, 2022, Battelle Memorial Institute.
[cited by applicant]
Abu-Farha, “A Preliminary Study on the Feasibility of Friction Stir Back Extrusion”, Scripta Materials, 66, 2012, United States, 615-618.
[cited by applicant]
Amancio-Filho et al., “Joining of Polymers and Polymer-Metal Hybrid Structures: Recent Developments and Trends”, Polymer Engineering & Science, 2009, United States, pp. 1461-1476.
[cited by applicant]
Bozzi et al., “Intermetallic Compounds in AI 6016/IF-Steel Friction Stir Spot Welds”, Materials Science and Engineering, 2010, Netherlands, pp. 4505-4509.
[cited by applicant]
Cole et al., “Lightweight materials for Automotive Applications”, Materials Characterization, 35, 1995, United States, pp. 3-9.
[cited by applicant]
Evans et al., “Friction Stir Extrusion: A new process for joining dissimilar materials”, Manufacturing Letters, 5, 2015, United States, pp. 25-28.
[cited by applicant]
Gann, J.A., “Magnesium Industry's Lightest Structural Metal”, SAE Transactions, vol. 25-26, 1930-1931, United States, pp. 620-634, 641.
[cited by applicant]
Hammond et al., “Equal-Channel Angular Extrusion of a Low-Density High-Entropy Alloy Produced by High-Energy Cryogenic Mechanical Alloying”, JOM. vol. 66, No. 10, United States, 2014, pp. 2021-2029.
[cited by applicant]
Kaiser et al., “Anisotropic Properties of Magnesium Sheet AZ31”, Materials Science Forum, vols. 419-422, Switzerland, 2003, pp. 315-320.
[cited by applicant]
Kuo et al., “Fabrication of High Performance Magnesium/Carbon-Fiber/PEEK/Laminated Composites”, Materials Transactions, vol. 44, No. 8 (2003), Japan, pp. 1613-1619.
[cited by applicant]
Leitao et al., “Aluminum-steel lap joining by multipass friction stir welding”, Materials and Design, 106, 2016, United States, pp. 153-160.
[cited by applicant]
Liu et al., “A Review of Dissimilar Welding Techniques for Magnesium Alloys to Aluminum Alloys”, Materials, 7, 2014, United States, pp. 3735-3757.
[cited by applicant]
Liu et al., “Microstructure and mechanical properties of equimolar FeCoCrNi high entropy alloy prepared via powder extrusion”, Intermetallics 75 (2016) , United States, pp. 25-30.
[cited by applicant]
Luo, Alan, “Magnesium: Current and Potential Automotive Applications”, JOM, 54(2), 2002, United States, pp. 42-48.
[cited by applicant]
Martinsen et al., “Joining of Dissimilar Materials”, CIRP Annals—Manufacturing Technology, 2015, United States, 21 pages.
[cited by applicant]
Nakamura et al., “Tool Temperature and Process Modeling of Friction Stir Welding”, (2018) Modern Mechanical Engineering, 8, 78-94.
[cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Nov. 6, 2015, 10 pages.
[cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Apr. 1, 2016, 10 pages.
[cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date May 20, 2016, 3 pages.
[cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Jan. 26, 2017, 9 pages.
[cited by applicant]
Office Action for U.S. Appl. No. 14/268,220, filed May 2, 2014, First Named Inventor Jun Cui, Notification date Dec. 1, 2015, 7 pages.
[cited by applicant]
Pickens, “Aluminum Powder Metallurgy Technology for High-Strength Applications”, Journal of Materials Science 16 (1981) 1437-1457, United Kingdom, 21 pages.
[cited by applicant]
Rodewald et al. “Top Nd—Fe—B Magnets with Greater Than 56 MGOe Energy Density and 9.8 kOe Coercivity”, IEEE Transactions on Magnetics, vol. 38, No. 5, 2002, United States, pp. 2955-2957.
[cited by applicant]
Saha, “Aluminum Extrusion Technology, Chapter 1, Fundamentals of Extrusion”, The Materials Information Society, ASM International, 2000, United States, pp. 1-29.
[cited by applicant]
ThomasNet.com, https:/www.thomasnet.com/articles/custom-manufacturing-fabricating/friction-stir-welding/ Feb. 10, 2011 (Year: 2011).
[cited by applicant]
Trang et al., “Designing a Magnesium Alloy with High Strength and High Formability”, Nature Communications, 2018, United Kingdom, 6 pages.
[cited by applicant]
Whalen et al., “High Ductility Aluminum Alloy Made from Powder by Friction Extrusion”, Materalia 6 (2019) 100260, Netherlands, 6 pages.
[cited by applicant]
Whalen et al., U.S. Appl. No. 15/694,565, filed Sep. 1, 2017, titled “System and Process for Joining Dissimilar Materials and Solid-State Interocking Joint with Intermetallic Interface Formed Thereby”, 69 pages.
[cited by applicant]
Zhang et al., “Numerical Studies on Effect of Axial Pressure in Friction Stir Welding”, (2007) Science and Technology of Welding and Joining, vol. 12, No. 3, United Kingdom, pp. 226-248.
[cited by applicant]
WO PCT/US2023/015228 Search Rpt, Jun. 15, 2023, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US2023/015228 Written Opin, Jun. 15, 2023, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US22/43532 Search Rept, Jan. 12, 2023, Battelle Memorial Institute.
[cited by applicant]
WO PCT/US22/43532 Written Opin, Jan. 12, 2023, Battelle Memorial Institute.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Final Office Action mailed Mar. 28, 2024”, 12 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Non Final Office Action mailed Oct. 4, 2023”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Mar. 7, 2024 to Non Final Office Action mailed Oct. 4, 2023”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Feb. 28, 2024 to Non Final Office Action mailed Aug. 28, 2023”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Advisory Action mailed Jan. 3, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Final Office Action mailed Oct. 20, 2023”, 9 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Jan. 3, 2024”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Jul. 10, 2023 to Non Final Office Action mailed Feb. 8, 2023”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Dec. 20, 2023 to Final Office Action mailed Oct. 20, 2023”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Non Final Office Action mailed Mar. 8, 2024”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/874,140, Non Final Office Action mailed Mar. 20, 2024”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/984,144, Non Final Office Action mailed Mar. 29, 2024”, 14 pgs.
[cited by applicant]
“U.S. Appl. No. 17/985,611, Non Final Office Action mailed Mar. 27, 2024”, 10 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,105,375 Examiners Rule 86 2 Requisition mailed Dec. 28, 2023”, 7 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,192,375, Voluntary Amendment filed Dec. 28, 2023”, 59 pgs.
[cited by applicant]
“Chinese Application Serial No. 202180062766.0, Voluntary Amendment filed Nov. 13, 2023”, with English claims, 91 pages.
[cited by applicant]
“Chinese Application Serial No. 202311192831.9, Response filed Dec. 28, 2023 to Notification to Make Rectification issued Nov. 1, 2023”, with English claims, 21 pages.
[cited by applicant]
“European Application Serial No. 19745460.6, Summons to attend oral proceedings pursuant to Rule 115(1) EPC mailed Jan. 4, 2024”, 6 pgs.
[cited by applicant]
“European Application Serial No. 21867741.7, Response to Communication Pursuant to Rules 161 & 162 EPC filed Oct. 16, 2023”, 15 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Final Office Action mailed Jun. 7, 20 23”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Final Office Action mailed May 10, 2023”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Feb. 8, 2023”, 22 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Preliminary Amendment filed Jul. 13, 2023”, 9 pgs.
[cited by applicant]
“International Application Serial No. PCT US2019 040730, Written Opinion mailed Oct. 21, 2019”, (Oct. 21, 2019), 7 pages.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Aug. 7, 2023 to Final Office Action mailed Jun. 7, 2023”, 9 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Advisory Action mailed Aug. 16, 2023”, 4 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Non Final Office Action mailed Aug. 28, 2023”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/242,166, Final Office Action mailed Aug. 30, 2023”, 7 pgs.
[cited by applicant]
“European Application Serial No. 19745460.6, Response filed Sep. 18, 2023 to Communication Pursuant to Article 94(3) EPC mailed May 10, 2023”, 9 pgs.
[cited by applicant]
“European Application Serial No. 19745460.6, Communication Pursuant to Article 94(3) EPC mailed May 10, 2023”, 6 pgs.
[cited by applicant]
“CN 201980045070X Office Action mailed Sep. 6, 2022”, with English translation, 13 pages.
[cited by applicant]
“CN 201980045070X Response mailed Apr. 11, 2023 to Office Action Sep. 6, 2022”, with English claims, 8 pages.
[cited by applicant]
“U.S. Appl. No. 14/222,468, Non-Final Office Action mailed Nov. 6, 2015”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Advisory Action mailed Jun. 5, 2024”, 4 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Examiner Interview Summary mailed Jul. 30, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Notice of Allowance mailed Sep. 20, 2024”, 16 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed May 28, 2024 to Final Office Action mailed Mar. 28, 2024”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Aug. 23, 2024 to Advisory Action mailed Jun. 5, 2024”, 17 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Examiner Interview Summary mailed Aug. 22, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Final Office Action mailed Apr. 17, 2024”, 23 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Non Final Office Action mailed Sep. 6, 2024”, 19 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Aug. 19, 2024 to Final Office Action mailed Apr. 17, 2024”, 17 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Sep. 11, 2023 to Non Final Office Action mailed Aug. 28, 2023”, 61 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Final Office Action mailed Jun. 14, 2024”, 21 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Feb. 28, 2024”, 19 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Apr. 11, 2024 to Non Final Office Action mailed Jan. 3, 2024”, 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed May 28, 2024 to Non Final Office Action mailed Feb. 28, 2024”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Examiner Interview Summary mailed Jul. 30, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Response filed Aug. 8, 2024 to Non Final Office Action mailed Mar. 8, 2024”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/874,140, Response filed Sep. 16, 2024 to Non Final Office Action mailed Mar. 20, 2024”, 15 pgs.
[cited by applicant]
“U.S. Appl. No. 17/957,207, Final Office Action mailed Jun. 12, 2024”, 13 pgs.
[cited by applicant]
“U.S. Appl. No. 17/984,144, Response filed Sep. 17, 2024 to Non Final Office Action mailed Mar. 29, 2024”, 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/985,611, Response filed Sep. 17, 2024 to Non Final Office Action mailed Mar. 27, 2024”, 12 pgs.
[cited by applicant]
“Application Serial No. PCT/US2023/015228, IPRP mailed Sep. 26, 2024”, 11 pgs.
[cited by applicant]
“Application Serial No. PCT/US2023/015228, Written Opinion mailed Jun. 15, 2023”, 6 pgs.
[cited by applicant]
“Canadian Application No. 3155420, Examiners Rule 862 Requisition Report Consolidated Correspondence Jul. 20, 2023”, 5 pgs.
[cited by applicant]
“Canadian Application No. 3155420, Examiners Rule mailed May 11, 2023”, 4 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,105,375, Response filed Apr. 26, 2024 to Examiners Rule 86 2 Requisition mailed Dec. 28, 2023”, 27 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,155,420, Examiners Rule 862 Requisition Report Apr. 18, 2024”, 3 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,155,420, Response filed Aug. 13, 2024 to Examiners Rule 862 Requisition Report Apr. 18, 2024”, 10 pgs.
[cited by applicant]
“European Application Serial No. 19745460.6, Response filed Jun. 20, 2024 to Summons to attend oral proceedings pursuant to Rule 115(1) EPC mailed Jan. 4, 2024”, 12 pgs.
[cited by applicant]
“European Application Serial No. 20869757, Extended European Search Report mailed Sep. 19, 2023”, 10 pgs.
[cited by applicant]
“European Application Serial No. 20869757, Response filed Apr. 12, 2024 to Extended European Search Report mailed Sep. 19, 2023”, 13 pgs.
[cited by applicant]
“European Application Serial No. 20869757.3, Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2024”, 6 pgs.
[cited by applicant]
“European Application Serial No. 21867741.7, Extended European Search Report mailed Aug. 12, 2024”, 8 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2019/040730, International Preliminary Report on Patentability mailed Jan. 5, 2021”, 8 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2019/040730, International Search Report mailed Oct. 21, 2019”, 4 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2019/040730, Written Opinion mailed Oct. 21, 2019”, 7 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2020/05168 International Search Report mailed Feb. 8, 2021”, 5 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2020/05168 Written Opinion mailed Feb. 8, 2021”, 6 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2020/053168, International Preliminary Report on Patentability mailed Apr. 7, 2022”, 8 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2021/050022, International Preliminary Report on Patentability mailed Dec. 1, 2022”, 17 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2021/050022, International Search Report mailed Feb. 3, 2022”, 5 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2021/050022, Written Opinion mailed Feb. 3, 2022”, 6 pgs.
[cited by applicant]
“International Application Serial No. PCT/US2023/015228, International Search Report mailed Jun. 15, 2023”, 5 pgs.
[cited by applicant]
“JP 2004-174563 Translation from FIT database”, (Year: 2024), 22 pgs.
[cited by applicant]
“U.S. Appl. No. 17/957,207, Response filed Oct. 14, 2024 to Final Office Action mailed Jun. 12, 2024”, 14 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Oct. 14, 2024 to Final Office Action mailed Jun. 14, 2024”, 14 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Examiner Interview Summary mailed Oct. 16, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Final Office Action mailed Oct. 18, 2024”, 14 pgs.
[cited by applicant]
“U.S. Appl. No. 17/957,207, Response filed Nov. 8, 2024 to Advisory Action mailed Oct. 31, 2024 and Final Office Action mailed Jun. 12, 2024”, 16 pgs.
[cited by applicant]
“U.S. Appl. No. 17/957,207, Advisory Action mailed Oct. 31, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Advisory Action mailed Oct. 31, 2024”, 3 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Nov. 8, 2024 to Advisory Action mailed Oct. 31, 2024 and Final Office Action Jun. 14, 2024”, 14 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,105,375, Examiners Rule 86(2) Report mailed Nov. 6, 2024”, 9 pgs.
[cited by applicant]
“U.S. Appl. No. 17/874,140, Final Office Action mailed Nov. 15, 2024”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/957,207, Notice of Allowance mailed Nov. 22, 2024”, 9 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Notice of Allowance mailed Nov. 25, 2024”, 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/984,144, Notice of Allowance mailed Nov. 26, 2024”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/985,611, Final Office Action mailed Dec. 5, 2024”, 15 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Response filed Jan. 6, 2025 to Final Office Action mailed Oct. 18, 2024”, 9 pgs.
[cited by applicant]
X, Li, “CN105925846-B translation provided by FIT database (Year: 2024)”, (Feb. 23, 2018), 12 pgs.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Feb. 6, 2025 to Non Final Office Action mailed Sep. 6, 2024”, 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/473,178, Notice of Allowance mailed Mar. 28, 2025”, 12 pgs.
[cited by applicant]
“U.S. Appl. No. 17/826,054, Notice of Allowance mailed Feb. 26, 2025”, 10 pgs.
[cited by applicant]
“U.S. Appl. No. 17/984,144, Notice of Allowance mailed Mar. 27, 2025”, 11 pgs.
[cited by applicant]
“U.S. Appl. No. 17/985,611, Response filed Apr. 7, 2025 to Final Office Action mailed Dec. 5, 2024”, 9 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,105,375, Response filed Mar. 3, 2025 to Examiners Rule 86(2) Report mailed Nov. 6, 2024”, 7 pgs.
[cited by applicant]
“European Application Serial No. 20869757.3, Response filed Jan. 3, 2025 to Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2024”, 10 pgs.
[cited by applicant]
“European Application Serial No. 25156776.4, Response filed Mar. 20, 2025 to Invitation to Remedy Deficiencies (R. 58 EPC) mailed Feb. 20, 2025”, 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/874,140, Response filed Apr. 15, 2025 to Final Office Action mailed Nov. 15, 2024”, 8 pages.
[cited by applicant]
“U.S. Appl. No. 17/035,597, Notice of Allowance mailed May 7, 2025”, 12 pages.
[cited by applicant]
“European Application Serial No. 23771340.9, Response to Communication pursuant to Rules 161 and 162 EPC filed Apr. 22, 2025”, 10 pages.
[cited by applicant]
“Canadian Application Serial No. 3,192,375 Requisition by the Examiner in Accordance With Subsection 86(2) mailed May 27, 2025”, 6 pages.
[cited by applicant]
Tang, W., “Production of wire via friction extrusion of aluminum alloy machining chips”, Journal of Materials Processing Technology vol. 210 Issue 15, (Nov. 19, 2010), 7 pages.
[cited by applicant]
“U.S. Appl. No. 17/874,140, Non Final Office Action mailed Jun. 12, 2025”, 15 pgs.
[cited by applicant]
“A Translation from FIT database”, JP 2002361320, (Year: 2025), 8 pgs.
[cited by applicant]
“U.S. Appl. No. 17/985,611, Notice of Allowance mailed Jun. 27, 2025”, 12 pgs.
[cited by applicant]
“European Application Serial No. 20869757.3, Summons to attend oral proceedings mailed Jun. 13, 2025”, 8 pgs.
[cited by applicant]
“European Application Serial No. 20869757.3, Response filed Sep. 4, 2025 to Summons to attend oral proceedings mailed Jun. 13, 2025”, 8 pgs.
[cited by applicant]
U.S. Appl. No. 18/426,042, filed Jan. 29, 2024, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, System and Process for Formation of Extrusion Structures.
[cited by applicant]
U.S. Appl. No. 15/351,201 U.S. Pat. No. 10,189,063, filed Nov. 14, 2016, System and Process for Formation of Extrusion Structures.
[cited by applicant]
U.S. Appl. No. 62/460,227, filed Feb. 17, 2017, Functionally Graded Coatings and Claddings.
[cited by applicant]
U.S. Appl. No. 15/898,515 U.S. Pat. No. 10,695,811, filed Feb. 17, 2018, Functionally Graded Coatings and Claddings.
[cited by applicant]
U.S. Appl. No. 16/916,548 U.S. Pat. No. 11,517,952, filed Jun. 30, 2020, Shear Assisted Extrusion Process.
[cited by applicant]
U.S. Appl. No. 17/984,144, filed Nov. 9, 2022, Functionally Graded Coatings and Claddings.
[cited by applicant]
U.S. Appl. No. 16/028,173 U.S. Pat. No. 11,045,851, filed Jul. 5, 2018, Method for Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape).
[cited by applicant]
U.S. Appl. No. 17/985,611, filed Nov. 11, 2022, Method for Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape).
[cited by applicant]
U.S. Appl. No. 17/175,464 U.S. Pat. No. 11,534,811, filed Feb. 12, 2021, Method for Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape).
[cited by applicant]
U.S. Appl. No. 16/562,314 U.S. Pat. No. 11,383,280, filed Sep. 5, 2019, Devices and Methods for Performing Shear-Assisted Extrusion, Extrusion Feedstocks, Extrusion Processes, and Methods for Preparing Metal Sheets.
[cited by applicant]
U.S. Appl. No. 17/826,054, filed May 26, 2022, Devices and Methods for Performing Shear-Assisted Extrusion, Extrusion Feedstocks, Extrusion Processes, and Methods for Preparing Metal Sheets.
[cited by applicant]
U.S. Appl. No. 17/665,433 U.S. Pat. No. 11,684,959, filed Feb. 4, 2022, Extrusion Processes for Forming Extrusions of a Desired Composition From a Feedstock.
[cited by applicant]
U.S. Appl. No. 17/033,854, filed Sep. 27, 2020, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 17/874,140, filed Jul. 26, 2022, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 17/035,597, filed Sep. 28, 2020, Shape Processes, Feedstock Materials, Conductive Materials and/or Assemblies.
[cited by applicant]
U.S. Appl. No. 17/242,166, filed Apr. 27, 2021, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 17/957,207, filed Sep. 30, 2022, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 17/473,178, filed Sep. 13, 2021, Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes.
[cited by applicant]
U.S. Appl. No. 18/121,563, filed Mar. 14, 2023, Extrusion Prcesses, Feedstock Materials, Conductive Materials and/or Assemblies.
[cited by applicant]