IP Library Granted Patent US 12,528,151
Granted Patent B2
US 12,528,151 · App. 18/107,220 · Granted Jan 20, 2026

Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Inventors: Surajit Kumar (San Jose, CA); Hui Chen (San Jose, CA); Chih Chung Chou (San Jose, CA); Shou-Sung Chang (Mountain View, CA)
Assignee: Applied Materials, Inc.
B24B37/015B24B37/34B24B49/14B24B53/095B24B55/02B24B55/03B24B57/02
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Quick Facts
Patent No.
US 12,528,151
App. No.
18/107,220
Granted
Jan 20, 2026
Kind
B2
Abstract

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

Claims (30)

1 . A chemical mechanical polishing system, comprising:

a platen to support a polishing pad having a polishing surface; and

a pad cooling assembly including

an arm extending over the platen, wherein the arm comprises a support plate having an aperture therethrough,

a nozzle supported by the arm above the support plate and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source through the aperture onto the polishing surface of the polishing pad, and

a gap between an inner surface of the aperture and the nozzle such that a flow of coolant fluid from the nozzle entrains air from the gap.

2 . The system of claim 1 , wherein a portion of the nozzle extends into the aperture.

3 . The system of claim 1 , wherein a bottom of the nozzle is positioned above the support plate.

4 . The system of claim 1 , wherein a top of the support plate is uncovered.

5 . The system of claim 1 , wherein the arm comprises a housing covering the support plate and enclosing the nozzle.

6 . The system of claim 1 , comprising the source of coolant fluid and the coolant fluid, and wherein the coolant fluid is a liquid.

7 . The system of claim 6 , wherein the liquid is water, ethanol, and/or isopropyl alcohol.

8 . The system of claim 1 , comprising the source of coolant fluid and the coolant fluid, and wherein the coolant fluid is a gas.

9 . The system of claim 8 , wherein the gas is air, nitrogen, carbon dioxide, argon, evaporated ethanol and/or evaporated isopropyl alcohol.

10 . The system of claim 1 , wherein the nozzle comprises a convergent-divergent nozzle.

11 . A chemical mechanical polishing system, comprising:

a platen to support a polishing pad having a polishing surface; and

a pad cooling assembly including

an arm extending over the platen, wherein the arm comprises a support plate having an aperture therethrough,

a nozzle supported by the arm above the support plate and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source through the aperture onto the polishing surface of the polishing pad, and

a passage through the support plate from the aperture such that a flow of coolant fluid from the nozzle entrains air from the passage.

12 . The system of claim 11 , wherein the passage extends laterally through the support plate from at least one side wall of the aperture.

13 . The system of claim 12 , comprising a plurality of passages extending laterally from a plurality of different side walls of the aperture through the support plate.

14 . The system of claim 11 , wherein a top of the support plate is uncovered.

15 . The system of claim 11 , wherein the arm comprises a housing covering the support plate and enclosing the nozzle.

16 . The system of claim 11 , comprising the coolant source of coolant fluid and the coolant fluid, and wherein the coolant fluid is a liquid.

17 . The system of claim 16 , wherein the liquid is water, ethanol, and/or isopropyl alcohol.

18 . The system of claim 11 , comprising the source of coolant fluid and the coolant fluid, and wherein the coolant fluid is a gas.

19 . The system of claim 18 , wherein the gas is air, nitrogen, carbon dioxide, argon, evaporated ethanol and/or evaporated isopropyl alcohol.

20 . The system of claim 11 , wherein the nozzle comprises a convergent-divergent nozzle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2023
From: KUMAR, SURAJIT; CHEN, HUI; CHOU, CHIH CHUNG; CHANG, SHOU-SUNG
To: APPLIED MATERIALS, INC.
Reel/Frame 065202/0864 →
Continuity (3)
Continuation 16932615 · Jul 17, 2020
Provisional Application 63046414 · Jun 30, 2020
Related Publication 20230182259A1 · Jun 15, 2023
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