IP Library › Granted Patent US 11,860,495
Granted Patent B2
US 11,860,495 · App. 18/113,795 · Granted Jan 2, 2024

Liquid crystal display device and electronic device

Inventor: Hajime Kimura (Kanagawa, JP)
G02F1/136286G02F1/1337G02F1/1362G02F1/1368G02F1/133345G02F1/134363G02F1/136277G09G3/20G09G3/3659H01L27/1214H01L27/1218H04N9/3102G02F1/133553G02F1/134372G02F1/136231G09G3/342G09G3/3685G09G2300/0876G09G2310/024G09G2310/027G09G2310/0235G09G2310/0275G09G2310/0297G09G2320/0233G09G2320/0252G09G2320/0261G09G2320/106G09G2340/0435G09G2340/16G09G2352/00
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Quick Facts
Patent No.
US 11,860,495
App. No.
18/113,795
Granted
Jan 2, 2024
Kind
B2
Abstract

To provide a semiconductor device, a liquid crystal display device, and an electronic device which have a wide viewing angle and in which the number of manufacturing steps, the number of masks, and manufacturing cost are reduced compared with a conventional one. The liquid crystal display device includes a first electrode formed over an entire surface of one side of a substrate; a first insulating film formed over the first electrode; a thin film transistor formed over the first insulating film; a second insulating film formed over the thin film transistor; a second electrode formed over the second insulating film and having a plurality of openings; and a liquid crystal over the second electrode. The liquid crystal is controlled by an electric field between the first electrode and the second electrode.

Claims (66)

1. A semiconductor device comprising:

a common electrode over a first substrate;

a first conductive layer over the first substrate, the first conductive layer electrically connected to the common electrode;

a semiconductor layer over the first substrate, the semiconductor layer comprising polycrystalline silicon;

a gate wiring, a part of the gate wiring overlapping with the semiconductor layer;

a source wiring, a part of the source wiring being over and in contact with the semiconductor layer;

a second conductive layer over and in contact with the semiconductor layer;

an insulating film over the common electrode, the first conductive layer, and the second conductive layer;

a pixel electrode over the insulating film, the pixel electrode electrically connected to the second conductive layer; and

liquid crystal molecules over the common electrode and the pixel electrode,

wherein the first conductive layer, the source wiring, and the second conductive layer comprise a same material,

wherein the pixel electrode has a plurality of slits,

wherein the part of the gate wiring and a first region of the common electrode overlap with each other, and

wherein the source wiring and a second region of the common electrode overlap with each other.

2. The semiconductor device according to claim 1 , wherein the gate wiring comprises molybdenum.

3. The semiconductor device according to claim 1 , wherein the insulating film comprises silicon nitride.

4. The semiconductor device according to claim 1 , wherein each of the first conductive layer, the source wiring, and the second conductive layer has a stacked-layer structure comprising a layer containing aluminum interposed between layers containing one of molybdenum and titanium.

5. The semiconductor device according to claim 1 , further comprising:

a color filter over the liquid crystal molecules; and

a second substrate over the color filter.

6. The semiconductor device according to claim 1 , wherein the common electrode is arranged for a plurality of pixels.

7. A semiconductor device comprising:

a common electrode over a first substrate;

a first conductive layer over the first substrate, the first conductive layer electrically connected to the common electrode;

a semiconductor layer over the first substrate, the semiconductor layer comprising polycrystalline silicon;

a gate wiring, a part of the gate wiring overlapping with the semiconductor layer;

a source wiring, a part of the source wiring being over and in contact with the semiconductor layer;

a second conductive layer over and in contact with the semiconductor layer;

an insulating film over the common electrode, the first conductive layer, and the second conductive layer;

a pixel electrode over the insulating film, the pixel electrode electrically connected to the second conductive layer; and

liquid crystal molecules over the common electrode and the pixel electrode,

wherein the first conductive layer, the source wiring, and the second conductive layer comprise a same material,

wherein the pixel electrode has a plurality of slits,

wherein the part of the gate wiring and a first region of the common electrode overlap with each other,

wherein the source wiring and a second region of the common electrode overlap with each other, and

wherein the pixel electrode with the plurality of slits and a third region of the common electrode overlap with each other.

8. The semiconductor device according to claim 7 , wherein the gate wiring comprises molybdenum.

9. The semiconductor device according to claim 7 , wherein the insulating film comprises silicon nitride.

10. The semiconductor device according to claim 7 , wherein each of the first conductive layer, the source wiring, and the second conductive layer has a stacked-layer structure comprising a layer containing aluminum interposed between layers containing one of molybdenum and titanium.

11. The semiconductor device according to claim 7 , further comprising:

a color filter over the liquid crystal molecules; and

a second substrate over the color filter.

12. The semiconductor device according to claim 7 , wherein the common electrode is arranged for a plurality of pixels.

13. A semiconductor device comprising:

a common electrode over a first substrate;

a first conductive layer over the first substrate, the first conductive layer electrically connected to the common electrode;

a semiconductor layer over the first substrate, the semiconductor layer comprising polycrystalline silicon;

a gate wiring, a part of the gate wiring overlapping with the semiconductor layer;

a source wiring, a part of the source wiring being over and in contact with the semiconductor layer;

a second conductive layer over and in contact with the semiconductor layer;

an insulating film over the common electrode, the first conductive layer, and the second conductive layer;

a pixel electrode over the insulating film, the pixel electrode electrically connected to the second conductive layer; and

liquid crystal molecules over the common electrode and the pixel electrode,

wherein the first conductive layer, the source wiring, and the second conductive layer comprise a same material,

wherein the pixel electrode has a plurality of slits,

wherein the part of the gate wiring and a first region of the common electrode overlap with each other,

wherein the source wiring and a second region of the common electrode overlap with each other, and

wherein each of the common electrode and the pixel electrode comprises a light-transmitting conductive layer.

14. The semiconductor device according to claim 13 , wherein each of the common electrode and the pixel electrode comprises indium tin oxide.

15. The semiconductor device according to claim 13 , wherein the gate wiring comprises molybdenum.

16. The semiconductor device according to claim 13 , wherein the insulating film comprises silicon nitride.

17. The semiconductor device according to claim 13 , wherein each of the first conductive layer, the source wiring, and the second conductive layer has a stacked-layer structure comprising a layer containing aluminum interposed between layers containing one of molybdenum and titanium.

18. The semiconductor device according to claim 13 , further comprising:

a color filter over the liquid crystal molecules; and

a second substrate over the color filter.

19. The semiconductor device according to claim 13 , wherein the common electrode is arranged for a plurality of pixels.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2023
From: KIMURA, HAJIME
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 062795/0839 →
Priority Claims (1)
JP 2006-297009 · Oct 31, 2006 · national
Continuity (10)
Continuation 17848727 · Jun 24, 2022
Continuation 17325402 · May 20, 2021
Continuation 16912911 · Jun 26, 2020
Continuation 15823026 · Nov 27, 2017
Continuation 14628459 · Feb 23, 2015
Continuation 14322999 · Jul 3, 2014
Continuation 13409288 · Mar 1, 2012
Continuation 12977217 · Dec 23, 2010
Continuation 11923128 · Oct 24, 2007
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