Vapor phase thermal etch solutions for metal oxo photoresists
Embodiments disclosed herein include methods of developing a metal oxo photoresist. In an embodiment, the method comprises providing a substrate with the metal oxo photoresist into a vacuum chamber, where the metal oxo photoresist comprises exposed regions and unexposed regions. In an embodiment, the unexposed regions comprise a higher carbon concentration than the exposed regions. The method may further comprise vaporizing a halogenating agent into the vacuum chamber, where the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct. In an embodiment, the method may further comprise purging the vacuum chamber.
1. A method of developing a metal oxo photoresist, comprising:
providing a substrate with the metal oxo photoresist into a vacuum chamber, wherein the metal oxo photoresist comprises exposed regions and unexposed regions, and wherein the unexposed regions comprise a higher carbon concentration than the exposed regions;
vaporizing a halogenating agent into the vacuum chamber, wherein the halogenating agent reacts with the exposed regions to produce a volatile byproduct, wherein the halogenating agent comprises methanesulfonyl chloride (CH 3 SO 2 Cl), trichloromethanesulfonyl chloride (CCl 3 SO 2 Cl), 4-toluenesulfonyl chloride (tosyl chloride), oxalyl chloride (ClCOCOCl), tert-butyl hypochlorite ((CH 3 ) 3 COCl), N-chlorophthalimide, 1,3-dichloro-5,5-dimethylhydantoin, trimethylsilyl chloride, PCl 5 , CCl 3 Br, 1,2-dibromo-1,1,2,2-tetrachloroethane (Cl 2 CBrCBrCl 2 ), PBr 3 , N-bromosuccinimide, N-bromoacetamide, 2-bromo-2-cyano-N,N-dimethylacetamide, 1,3-dibromo-5,5-dimethylhydantoin, 2,4,4,6-tetrabromo-2,5-cyclohexadienone, trimethylsilyl bromide, SO 2 Cl 2 (sulfuryl chloride), or SO 2 Br 2 (sulfuryl bromide); and
purging the vacuum chamber.
2. The method of claim 1 , wherein the halogenating agent is diluted with a gas selected from the group consisting of Ar, N 2 and He.
3. A method of developing a metal oxo photoresist, comprising:
providing a substrate with the metal oxo photoresist into a vacuum chamber, wherein the metal oxo photoresist comprises exposed regions and unexposed regions, and wherein the unexposed regions comprise a higher carbon concentration than the exposed regions;
vaporizing an organic acid into the vacuum chamber, wherein the organic acid reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct, wherein the organic acid is a carboxylic acid (RCO 2 H), and wherein the R group comprises CH 3 , tBu, or iPr; and
purging the vacuum chamber.
4. The method of claim 3 , wherein the organic acid is diluted with a gas selected from the group consisting of Ar, N 2 and He.
5. The method of claim 3 , wherein the organic acid reacts with the unexposed regions to produce the volatile byproduct.
6. The method of claim 3 , wherein the organic acid reacts with the exposed regions to produce the volatile byproduct.