SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY AND BROADBAND SIGNALS
A printed circuit board (PCB) core structure is provided for the transition of signals from one side of a PCB to an opposing side of the PCB. The PCB core structure may include a laminated core including an inner core including a plurality of conductive layers (N layers), a first dielectric layer, a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core. The PCB core structure may also include a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core. The PCB core structure may also include a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer. The PCB core structure may also include a cavity removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material. The cavity filled with the dielectric material prevents the first conductive trace from shorting to the shielding structure. The PCB core structure may be fabricated by using a single-lamination cycle.
1 . A printed circuit board (PCB) core structure for a transition of signals from one side of a PCB to an opposing side of the PCB, the PCB core structure comprising:
a laminated core comprising an inner core comprising a plurality of conductive layers (N−1 layers), a first dielectric layer disposed over an (N−1)th conductive layer of the inner core, and an Nth conductive layer over the first dielectric layer;
a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core;
a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core;
a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer; and
a cavity formed by removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material, wherein the cavity filled with the dielectric material prevents the first conductive trace from shorting to the shielding structure.
2 . The PCB core structure of claim 1 , wherein N is an integer and is equal to or greater than 4.
3 . The PCB core structure of claim 1 , wherein the shielding structure comprises an outer shell having a first segment extending from the first conductive layer to the Nth conductive layer and a second segment extending from the first conductive layer to the (N−1)th conductive layer, wherein the outer shell is coaxial with the signal via.
4 . The PCB core structure of claim 3 , wherein the second segment of the outer shell is configured to avoid shorting to the first conductive trace.
5 . The PCB core structure of claim 1 , wherein the shielding structure comprises a plurality of ground vias surrounding the signal via.
6 . The PCB core structure of claim 5 , wherein the plurality of ground vias comprises a first subset of the plurality of ground vias extending from the first conductive layer to the Nth conductive layer, and a second subset of the plurality of ground vias extending from the first conductive layer to the (N−1)th conductive layer to prevent the second subset of the plurality of ground vias from shorting to the first conductive trace.
7 . The PCB core structure of claim 1 , further comprising a plurality of blind vias in the first dielectric layer, and the plurality of blind vias configured for shielding the first conductive trace.
8 . The PCB core structure of claim 1 , wherein the signals have an RF frequency ranging from 0 to 90 GHz.
9 . The PCB core structure of claim 1 , wherein the first dielectric layer between the Nth conductive layer and the (N−1)th conductive layer comprises an RF-friendly dielectric material being substantially isotropic and having a dielectric constant Dk ranging from 2.0 to 5.0 and a loss tangent Df less than 0.003.
10 . The PCB core structure of claim 1 , wherein the second dielectric layer between the (N−1)th conductive layer and another (N−2)th conductive layer comprises a generic dielectric material.
11 . The PCB core structure of claim 1 , wherein the signal via transitions the signals from the first conductive trace to the second conductive trace to provide a horizontal to horizontal (H2H) transition.
12 . The PCB core structure of claim 1 , wherein the signal via transitions the signals from the pin to the first conductive trace to the pin to provide a vertical to horizontal (V2H) transition.
13 . The PCB core structure of claim 1 , wherein the signals have millimeter (mm) wavelengths or frequency content in a range from 0 GHz to 90 GHz or are broadband in nature.
14 . The PCB core structure of claim 1 , further comprising a conductive pad connected to the pin on the second side of the laminated core.
15 . A method for forming a PCB core structure for transition of signals from one side of a printed circuit board (PCB) to an opposing side of the PCB, the method comprising:
providing a laminated core comprising an inner core comprising a plurality of conductive layers (N−1 layers), a first RF-friendly dielectric layer disposed over an (N−1)th conductive layer of the inner core, and an Nth conductive layer over the first RF-friendly dielectric layer;
forming a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core;
generating a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core;
creating a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer; and
forming a cavity by removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material, wherein the cavity filled with the dielectric material prevents the first conductive trace from shorting to the shield structure.
16 . The method of claim 15 , wherein N is an integer and is equal to or greater than 4.
17 . The method of claim 15 , wherein the shielding structure comprises an outer shell having a first segment extending from the first conductive layer to the Nth conductive layer and a second segment extending from the first conductive layer to the (N−1)th conductive layer, wherein the second segment of the outer shell is configured to avoid shorting to the first conductive trace, wherein the outer shell is coaxial with the signal via.
18 . The method of claim 15 , wherein the shielding structure comprises a plurality of ground vias surrounding the signal via.
19 . The method of claim 18 , wherein the plurality of ground vias comprising a first subset of ground vias extending from the first conductive layer to the Nth conductive layer, and a second subset of the plurality of ground vias extending from the first conductive layer to the (N−1)th conductive layer to prevent the second subset of the plurality of ground vias from shorting to the first conductive trace.
20 . The method of claim 15 , further comprising forming a plurality of blind vias in the first dielectric layer, and a plurality of blind vias configured for shielding the first conductive trace.