Fabric die to fabric die interconnect for modularized integrated circuit devices
The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.
1. A device comprising:
a first die comprising:
a first plurality of sectors, wherein a first sector of the first plurality of sectors comprises:
a first row of logic blocks;
a first inter-die interconnect interface disposed in the first row of logic blocks; and
a first microbump electrically coupled to the first inter-die interconnect interface;
a second die comprising:
a second plurality of sectors, wherein a second sector of the second plurality of sectors comprises:
a second row of logic blocks; and
a second inter-die interconnect interface disposed in the second row of logic blocks; and
a second microbump electrically coupled to the second inter-die interconnect interface, wherein the first microbump and the second microbumps are electrically coupled together, and the first inter-die interconnect interface and the second inter-die interconnect interface are configured to enable communication between the first die and the second die via the first microbump and the second microbump.
2. The device of claim 1 , wherein the first row of logic blocks is disposed on a shoreline of the first die, and is parallel to the shoreline of the first die.
3. The device of claim 1 , wherein the first sector comprises a third row of logic blocks disposed on a shoreline of the first die and parallel to the shoreline of the first die, wherein the first row of logic blocks is adjacent to the third row of logic blocks and disposed parallel to the shoreline of the first die.
4. The device of claim 1 , comprising a plurality of horizontal input/output interfaces and a plurality of vertical input/output interfaces, wherein the plurality of horizontal input/output interfaces and the plurality of vertical input/output interface are configured to enable the first die to communicate with the second die.
5. The device of claim 1 , comprising an interposer, wherein the first die and the second die are disposed in the interposer.
6. The device of claim 5 , wherein the first microbump and the second microbump are electrically coupled together via a wire-to-wire connection disposed on the interposer.
7. A die comprising:
a shoreline; and
a plurality of sectors, wherein a sector of the plurality of sectors comprises:
a set of logic blocks separate from the shoreline of the die; and
an inter-die interconnect interface disposed in the set of logic blocks, wherein the inter-die interconnect interface is configured to communicatively couple the die to a second die.
8. The die of claim 7 , wherein the set of logic blocks comprises logic array blocks, memory logic array blocks, logic element input multiplexer blocks, configurable random-access memory, or a combination thereof.
9. The die of claim 7 , wherein the inter-die interconnect interface is configured to electrically couple to a plurality of microbumps disposed on a side of the die.
10. The die of claim 9 , wherein the plurality of microbumps are configured to facilitate bidirectional or unidirectional communication.
11. The die of claim 9 , wherein the plurality of microbumps are configured to communicatively couple to an additional plurality of microbumps of the second die, and the additional plurality of microbumps is configured to communicatively couple to an additional inter-die interconnect interface of the second die.
12. The die of claim 11 , wherein the plurality of microbumps and the additional plurality of microbumps are configured to communicatively couple via a wire-to-wire connection disposed in a silicon interposer.
13. The die of claim 7 , wherein the sector of the plurality of sectors comprises a plurality of sets of logic blocks comprising the set of logic blocks, wherein at least some sets of logic blocks of the plurality of sets of logic blocks comprise a plurality of logic array blocks, wherein at least some logic array blocks of the plurality of logic array blocks comprise a respective inter-die interconnect interface.
14. The die of claim 7 , wherein the sector comprises a second set of logic blocks disposed on the shoreline of the die, wherein the set of logic blocks is disposed adjacent to the second set of logic blocks but further away from the shoreline than the second set of logic blocks.
15. An integrated circuit system comprising:
a first die comprising a first sector comprising a first plurality of interconnect interfaces configured to electrically couple to a first plurality of microbumps disposed on a side of the first die;
a second die comprising a second sector comprising a second plurality of interconnect interfaces configured to electrically couple to a second plurality of microbumps disposed on a side of the second die; and
a silicon interposer configured to electrically couple to the first plurality of microbumps and the second plurality of microbumps.
16. The integrated circuit system of claim 15 , wherein the first sector comprises a first row of logic blocks, wherein the first row of logic blocks comprises the first plurality of interconnect interfaces.
17. The integrated circuit system of claim 16 , wherein the first row of logic blocks is disposed on a shoreline of the first die.
18. The integrated circuit system of claim 16 , wherein the first row of logic blocks is disposed apart from a shoreline of the first die.
19. The integrated circuit system of claim 15 , comprising a first plurality of input/output interfaces and a second plurality of input/output interfaces.
20. The integrated circuit system of claim 19 , wherein the first plurality of input/output interfaces, the second plurality of input/output interfaces, or both, comprise a plurality of vertical input/output interfaces and a plurality of horizontal input/output interfaces.