IP Library › Granted Patent US 12,539,559
Granted Patent B2
US 12,539,559 · App. 18/138,955 · Granted Feb 3, 2026

Laser processing device

Inventor: Junji Okuma (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
B23K26/064B23K26/032B23K26/042B23K26/0665B23K26/0853B23K26/359B23K26/702B23K26/705B23K2103/56
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Quick Facts
Patent No.
US 12,539,559
App. No.
18/138,955
Granted
Feb 3, 2026
Kind
B2
Abstract

A laser processing device includes a support unit, a laser light source, a reflecting spatial light modulator, a light collection optical system, an imaging optical system, a mirror, a first sensor configured to acquire displacement data on a laser light entry surface, and a second sensor configured to acquire displacement data on the laser light entry surface. An optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction. An optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction. The first sensor is disposed on one side of the light collection optical system in a third direction.

Claims (37)

1 . A laser processing device comprising:

a support unit configured to support an object to be processed;

a laser light source configured to emit laser light;

a reflecting spatial light modulator configured to modulate and reflect the laser light;

a light collection optical system configured to converge the laser light at the object;

an imaging optical system constituting a both-side telecentric optical system in which a reflecting surface of the reflecting spatial light modulator and an entrance pupil surface of the light collection optical system have an imaging relation;

a mirror configured to reflect, toward the light collection optical system, the laser light passing through the imaging optical system;

a first sensor configured to irradiate the object with first ranging laser light different in axis from the laser light without through the light collection optical system and receive reflected light of the first ranging laser light to acquire displacement data on a laser light entry surface of the object; and

a second sensor configured to irradiate the object with second ranging laser light coaxial with the laser light through the light collection optical system and receive reflected light of the second ranging laser light to acquire displacement data on the laser light entry surface, wherein

an optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction,

an optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction orthogonal to the first direction, and

the first sensor is disposed on one side of the light collection optical system in a third direction orthogonal to the first direction and the second direction.

2 . The laser processing device according to claim 1 , further comprising:

a housing configured to support at least the reflecting spatial light modulator, the light collection optical system, the imaging optical system, the mirror, and the first sensor; and

a transfer mechanism configured to move the housing in the first direction, wherein

the light collection optical system and the first sensor are attached to one end of the housing in the second direction, and

the transfer mechanism is attached to one side surface of the housing in the third direction.

3 . The laser processing device according to claim 1 , wherein

a plurality of the first sensors are provided,

one of the plurality of first sensors is disposed on the one side of the light collection optical system in the third direction, and

another of the plurality of first sensors is disposed on another side of the light collection optical system in the third direction.

4 . The laser processing device according to claim 1 , further comprising:

a drive mechanism configured to move the light collection optical system along an optical axis; and

a controller configured to control drive for the drive mechanism, wherein

the controller drives the drive mechanism based on at least any one of the displacement data acquired by the first sensor and the displacement data acquired by the second sensor to cause the light collection optical system to follow the laser light entry surface.

5 . The laser processing device according to claim 2 , wherein

a plurality of the first sensors are provided,

one of the plurality of first sensors is disposed on the one side of the light collection optical system in the third direction, and

another of the plurality of first sensors is disposed on another side of the light collection optical system in the third direction.

6 . The laser processing device according to claim 2 , further comprising:

a drive mechanism configured to move the light collection optical system along an optical axis; and

a controller configured to control drive for the drive mechanism, wherein

the controller drives the drive mechanism based on at least any one of the displacement data acquired by the first sensor and the displacement data acquired by the second sensor to cause the light collection optical system to follow the laser light entry surface.

7 . The laser processing device according to claim 3 , further comprising:

a drive mechanism configured to move the light collection optical system along an optical axis; and

a controller configured to control drive for the drive mechanism, wherein

the controller drives the drive mechanism based on at least any one of the displacement data acquired by the first sensor and the displacement data acquired by the second sensor to cause the light collection optical system to follow the laser light entry surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2023
From: OKUMA, JUNJI
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 063433/0400 →
Priority Claims (1)
JP 2017-143627 · Jul 25, 2017 · national
Continuity (2)
Continuation 16632707
Related Publication 20230256535A1 · Aug 17, 2023
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