Laser processing device having function for avoiding interference at the time of nozzle approach
A laser processing device having a function for avoiding interference during an approach motion of a processing nozzle of the laser processing device. When a distance between a processing nozzle and a workpiece is equal to a setting value where gap control can be started, it is judged as to whether or not the mechanical position of the processing nozzle is above a predetermined processing start position. When the mechanical position of the processing nozzle is higher than the processing start position, a controller judges that an abnormality occurs by which laser processing cannot be carried out, and automatically stops the approach motion of the processing nozzle.
1. A laser processing device comprising:
a processing nozzle configured to be moved toward or away from an object to be processed and configured to irradiate a laser beam;
a gap sensor which detects a distance between the processing nozzle and the object;
a position detector which detects a position of the processing nozzle relative to a fixed predetermined start position; and
a controller configured to execute a processing program for carrying out laser processing of the object by controlling a motion of the processing nozzle, while executing gap control for controlling the distance between the processing nozzle and the object based on a detection value of the gap sensor,
wherein the controller receives a gap signal from the gap sensor and a position signal from the position detector, and executes the processing program to stop an approach motion of the processing nozzle toward the object, in response to:
1) the controller determining from the received gap signal that the gap sensor detects that the distance between the processing nozzle and the object is equal to a setting value in which the gap control can be started, and
2) the controller determining from the received position signal that the position detector detects that the processing nozzle is positioned at a position higher than the fixed predetermined start position.
2. The laser processing device as set forth in claim 1 , wherein, after the approach motion is stopped, the controller carries out an evacuation motion for moving the processing nozzle away from the object.
3. The laser processing device as set forth in claim 2 , wherein, the controller executes a processing program for carrying out the laser processing, the controller searches a subsequent command block of the processing program next to a command block of the processing program executed when the approach motion is stopped, the command block indicating commands for carrying out laser processing at a first location on the object, the subsequent command block indicating commands for carrying out laser processing at a second location on the object different from the first location, and continues the laser processing from the subsequent command block of the processing program at the second location.
4. The laser processing device as set forth in claim 1 , wherein the controller executes a processing program for carrying out the laser processing, the controller stores information regarding a command block of the processing program executed when the approach motion is stopped, and informs an operator of the information, the command block indicating commands for carrying out laser processing at a first location on the object.