Semiconductor structure and method for fabricating same
Embodiments relates to a semiconductor structure and a method for fabricating the same. The method includes: providing a substrate, where an isolation trench is formed in the substrate; forming a first isolation layer in the isolation trench, where the first isolation layer fills the isolation trench, and a crack extending to an upper surface of the first isolation layer along a vertical direction is formed in the first isolation layer; removing part of the first isolation layer by etching back to form an isolation filling groove in communication with a top opening of the crack; and forming a second isolation layer in the isolation filling groove to plug the top opening of the crack, where the first isolation layer and the second isolation layer jointly constitute an isolation structure.
1 . A method for fabricating a semiconductor structure, comprising:
providing a substrate, wherein an isolation trench is formed in the substrate, and the isolation trench separates a plurality of active pillar structures arranged in an array;
forming a sacrificial layer on a side wall of each of the plurality of active pillar structures; forming a first isolation layer in the isolation trench, wherein the first isolation layer fills the isolation trench, and a crack extending to an upper surface of the first isolation layer along a vertical direction is formed in the first isolation layer;
removing part of the first isolation layer by etching back to form an isolation filling groove in communication with a top opening of the crack; and
forming a second isolation layer in the isolation filling groove to plug the top opening of the crack, wherein the first isolation layer and the second isolation layer jointly constitute an isolation structure;
removing part of the sacrificial layer; and
forming a gate structure between each of the plurality of active pillar structures and the isolation structure, wherein the gate structure at least surrounds part of each of the plurality of active pillar structures.
2 . The method for fabricating the semiconductor structure according to claim 1 , wherein
the forming the first isolation layer in the isolation trench comprises:
forming a first initial isolation layer on each of the plurality of active pillar structures, and on a bottom wall and a side wall of the isolation trench; and
removing the first initial isolation layer positioned on each of the plurality of active pillar structures until an upper surface of the sacrificial layer is exposed, wherein the first initial isolation layer positioned in the isolation trench is retained to form the first isolation layer.
3 . The method for fabricating the semiconductor structure according to claim 2 , wherein
the removing the first initial isolation layer positioned on each of the plurality of active pillar structures comprises:
planarizing the first initial isolation layer to remove part of the first initial isolation layer until the sacrificial layer is exposed.
4 . The method for fabricating the semiconductor structure according to claim 3 , wherein
part of the first initial isolation layer is removed by means of a chemical mechanical polishing process to form the first isolation layer.
5 . The method for fabricating the semiconductor structure according to claim 1 , wherein
a depth of the isolation trench ranges from 100 nm to 200 nm;
and in the removing part of the first isolation layer by etching back, a depth of the first isolation layer removed ranges from 5 nm to 30 nm.
6 . The method for fabricating the semiconductor structure according to claim 1 , wherein
the forming the second isolation layer on the first isolation layer comprises:
forming a second initial isolation layer on each of the plurality of active pillar structures and a surface of the first isolation layer; and
removing part of the second initial isolation layer positioned on each of the plurality of active pillar structures, wherein the second initial isolation layer positioned on the first isolation layer and within the isolation filling groove is retained to form the second isolation layer.
7 . The method for fabricating the semiconductor structure according to claim 1 , wherein
the first isolation layer and the second isolation layer are deposited by means of an atomic layer deposition process.
8 . The method for fabricating the semiconductor structure according to claim 1 , wherein
a material of the sacrificial layer is silicon oxide, and materials of the first isolation layer and the second isolation layer are silicon nitride.
9 . The method for fabricating the semiconductor structure according to claim 1 , wherein
a bit line structure is formed in the substrate, and a bottom of the isolation trench exposes the bit line structure.
10 . The method for fabricating the semiconductor structure according to claim 1 , wherein
the forming the gate structure between each of the plurality of active pillar structures and the isolation structure comprises:
forming a gate oxide layer on the side wall of each of the plurality of active pillar structures; and
forming a gate layer on a surface of the gate oxide layer, wherein the gate layer and the gate oxide layer constitute the gate structure.
11 . The method for fabricating the semiconductor structure according to claim 1 , further comprising:
forming, above the gate structure, a third isolation layer between each of the plurality of active pillar structures and the isolation structure.
12 . The method for fabricating the semiconductor structure according to claim 11 , wherein
the forming the third isolation layer comprises: after forming the isolation structure and before forming the gate structure between each of the plurality of active pillar structures and the isolation structure, removing part of the sacrificial layer to form an isolation opening; forming a third isolation layer in the isolation opening; and in the removing part of the sacrificial layer to form the gate structure, removing part of the sacrificial layer positioned below the third isolation layer.
13 . The method for fabricating the semiconductor structure according to claim 11 , wherein
the forming the third isolation layer comprises: removing part of the sacrificial layer after forming the isolation structure and before forming the gate structure between each of the plurality of active pillar structures and the isolation structure; forming a gate initial structure between each of the plurality of active pillar structures and the isolation structure;
and removing part of the gate initial structure positioned on an upper part, and forming a third isolation layer above the gate structure, wherein part of the gate initial structure is retained to form the gate structure.
14 . A semiconductor structure, comprising:
a substrate, wherein an isolation trench is formed in the substrate; and
an isolation structure formed in the isolation trench, the isolation structure filling the isolation trench; wherein the isolation structure comprises a first isolation layer and a second isolation layer positioned on the first isolation layer; a crack extending to an upper surface of the first isolation layer along a vertical direction is formed in the first isolation layer; and the second isolation layer is configured to plug a top opening of the crack;
a gate structure, the isolation trench separating a plurality of active pillar structures arranged in an array, wherein the gate structure is positioned between each of the plurality of active pillar structures and the isolation structure, and the gate structure at least surrounds part of each of the plurality of active pillar structures; and
a third isolation layer, wherein the third isolation layer is positioned above the gate structure and between each of the plurality of active pillar structures and the isolation structure.
15 . A method for fabricating a semiconductor structure, comprising:
providing a substrate, wherein an isolation trench is formed in the substrate;
forming a first isolation layer in the isolation trench, wherein the first isolation layer fills the isolation trench, and a crack extending to an upper surface of the first isolation layer along a vertical direction is formed in the first isolation layer;
removing part of the first isolation layer by etching back to form an isolation filling groove in communication with a top opening of the crack; and
forming a second isolation layer in the isolation filling groove to plug the top opening of the crack, wherein the first isolation layer and the second isolation layer jointly constitute an isolation structure;
wherein a depth of the isolation trench ranges from 100 nm to 200 nm;
and in the removing part of the first isolation layer by etching back, a depth of the first isolation layer removed ranges from 5 nm to 30 nm.
16 . The method for fabricating the semiconductor structure according to claim 15 , wherein
a bit line structure is formed in the substrate, and a bottom of the isolation trench exposes the bit line structure.
17 . The method for fabricating the semiconductor structure according to claim 15 , wherein
the first isolation layer and the second isolation layer are deposited by means of an atomic layer deposition process.
18 . The semiconductor structure according to claim 14 , further comprising
a bit line structure formed in the substrate, wherein the bit line structure positioned below and in contact with the active pillar structure.
19 . The semiconductor structure according to claim 14 , wherein,
the third isolation layer in contact with the gate structure, and a contact position between the third isolation layer and the gate structure lower than a contact position between the second isolation layer and the first isolation layer.
20 . The semiconductor structure according to claim 14 , wherein,
the third isolation layer in contact with the gate structure, and a contact position between the third isolation layer and the gate structure high than a contact position between the second isolation layer and the first isolation layer.