Optical device and method of manufacture
Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.
1 . A method of manufacturing an optical device, the method comprising:
receiving a laser die, the laser die comprising a first contact along a first side; side, the first side being planar from a first side to a second side opposite the first side;
bonding the first side of the laser die to an optical interposer, wherein after the bonding the optical interposer comprises a first waveguide adjacent to the laser die and optically coupled to the first contact; and
bonding an electrical integrated circuit to the optical interposer.
2 . The method of claim 1 , wherein the bonding the first side of the laser die is performed at least in part with a dielectric-to-dielectric and metal-to-metal bond process.
3 . The method of claim 1 , wherein the bonding is performed with a fusion bonding process.
4 . The method of claim 3 , further comprising, after the bonding, forming a through via to the laser die.
5 . The method of claim 1 , further comprising, after the bonding, forming optical components on an opposite side of the optical interposer from the laser die.
6 . The method of claim 1 , further comprising bonding the optical interposer to an interposer substrate.
7 . The method of claim 1 , further comprising bonding the optical interposer to an integrated fan out substrate.
8 . An optical device comprising:
a laser die, the laser die comprising a first contact along a first side;
an optical interposer with a planar second side, the planar second side being bonded to the first side of the laser die, wherein the optical interposer comprises a first waveguide adjacent to the laser die and optically coupled to the first contact; and
an electrical integrated circuit bonded to the planar second side of the optical interposer.
9 . The optical device of claim 8 , wherein the optical interposer is bonded to the laser die with a dielectric-to-dielectric bond and a metal-to-metal bond.
10 . The optical device of claim 8 , wherein the optical interposer is bonded to the laser die with a fusion bond.
11 . The optical device of claim 10 , wherein a through via is connected to the laser die.
12 . The optical device of claim 8 , further comprising optical components located on an opposite side of the optical interposer from the laser die.
13 . The optical device of claim 8 , further comprising an integrated fan out substrate bonded to the optical interposer.
14 . An optical device comprising:
a laser die, the laser die comprising a first contact along a first side;
an electrical integrated circuit adjacent to the laser die; and
an optical interposer physically bonded to both the electrical integrated circuit and the laser, die along a planar surface, wherein the optical interposer comprises a first waveguide adjacent to the laser die and coupled to the first contact.
15 . The optical device of claim 14 , wherein the optical interposer is physically bonded to the electrical integrated circuit with a dielectric-to-dielectric and metal-to-metal bond.
16 . The optical device of claim 14 , wherein the optical interposer is physically bonded to the laser die with a dielectric-to-dielectric and metal-to-metal bond.
17 . The optical device of claim 14 , further comprising an encapsulant extending between the laser die and the electrical integrated circuit.
18 . The optical device of claim 17 , further comprising a support substrate bonded to the laser die, the electrical integrated circuit, and the encapsulant.
19 . The optical device of claim 18 , wherein the support substrate comprises a lens.
20 . The optical device of claim 14 , wherein the optical interposer comprises external connections.