Granted Patent B2

US 12,087,680 · App. 18/156,484 · Granted Sep 10, 2024

Inventors: Zach Cole (Summers, AR); Steven Ericksen (St. Rogers, AR)

Assignee: Wolfspeed, Inc.

H01L23/49838H01L25/072H05K1/147H05K1/181H05K1/142H05K2201/042H05K2201/10151H05K2201/10166

Abstract

Claims (124)

1. A power module, comprising:

at least one electrically conductive power substrate;

a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;

at least one elevated power plane electrically connected to the at least one electrically conductive power substrate, electrically connected to the plurality of power devices, and arranged vertically offset from the at least one electrically conductive power substrate; and

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated signal element comprises a plurality of windows.

2. The power module of claim 1 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated signal element comprises a first elevated signal element and a second elevated signal element; and

wherein at least one of the first elevated signal element and/or the second elevated signal element are arranged above or below a generally parallel portion of the at least one elevated power plane.

3. The power module of claim 1 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated signal element comprises one of the following: a printed circuit board (PCB) or an insulated metal substrate (IMS); and

wherein the power devices are arranged in a plurality of rows extending along a first axis and a plurality of rows extending along a second axis on at least one implementation of the at least one electrically conductive power substrate.

4. The power module of claim 3 , wherein:

the at least one elevated signal element comprises the insulated metal substrate (IMS) with a metal layer configured as a high-current conductor.

5. The power module of claim 1 ,

wherein the at least one elevated power plane comprises an inclined portion that is inclined with respect a surface of the at least one electrically conductive power substrate; and

wherein the power devices comprise power connections that connect the power devices to the at least one elevated power plane.

6. The power module of claim 1 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from and generally parallel to the at least one electrically conductive power substrate,

wherein the at least one elevated power plane comprises a portion that is arranged generally parallel to the at least one electrically conductive power substrate; and

wherein the at least one elevated signal element is arranged in one of the following: vertically offset from and separated from the at least one elevated power plane, arranged vertically offset from and on the at least one elevated power plane, and arranged vertically offset from and directly on the at least one elevated power plane.

7. The power module of claim 1 , wherein:

the at least one elevated power plane comprises a plurality of first windows;

the plurality of first windows are configured to provide power connections to the power devices; and

the power devices are arranged in a plurality of rows extending along a first axis and a plurality of rows extending along a second axis on at least one implementation of the at least one electrically conductive power substrate.

8. The power module of claim 7 , wherein:

the plurality of first windows are configured to allow power connections to extend vertically from the power devices to the at least one elevated power plane.

9. The power module of claim 1 ,

wherein the plurality of windows are configured to provide signal connections to the power devices.

10. The power module of claim 9 , wherein:

the plurality of windows are configured to allow signal connections to extend vertically from the power devices to the at least one elevated signal element.

11. The power module of claim 1 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate; and

one or more sensors,

wherein the one or more sensors are arranged on one of the following: the at least one elevated power plane and the at least one electrically conductive power substrate, and

wherein the one or more sensors are connected to the at least one elevated signal element.

12. The power module of claim 1 , wherein:

the at least one elevated power plane comprises a first elevated power plane, a second elevated power plane, and a third elevated power plane.

13. The power module of claim 1 , wherein the power devices are arranged in a pattern on the at least one electrically conductive power substrate.

14. A power module, comprising:

at least one electrically conductive power substrate;

a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate; and

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the plurality of power devices are arranged between the at least one electrically conductive power substrate and the at least one elevated signal element; and

wherein the at least one elevated signal element comprises a plurality of windows.

15. The power module of claim 14 , further comprising:

at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices,

wherein the at least one elevated signal element comprises a portion that is arranged generally parallel to a surface of the at least one electrically conductive power substrate; and

wherein the portion of the at least one elevated signal element is generally parallel to a portion of the at least one elevated power plane.

16. The power module of claim 15 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated signal element comprises one of the following: a printed circuit board (PCB) or an insulated metal substrate (IMS).

17. The power module of claim 16 , wherein:

the at least one elevated signal element comprises the insulated metal substrate (IMS) with a metal layer configured as a high-current conductor.

18. The power module of claim 15 ,

wherein the power devices are arranged in a plurality of rows extending along a first axis and a plurality of rows extending along a second axis on at least one implementation of the at least one electrically conductive power substrate;

wherein the first axis is perpendicular to the second axis; and

wherein the power devices comprise power connections that connect the power devices to the at least one elevated power plane.

19. The power module of claim 15 ,

wherein the at least one elevated power plane comprises an inclined portion that is inclined with respect a surface of the at least one electrically conductive power substrate; and

wherein the at least one elevated signal element is arranged in one of the following: vertically offset from and separated from the at least one elevated power plane, arranged vertically offset from and on the at least one elevated power plane, and arranged vertically offset from and directly on the at least one elevated power plane.

20. The power module of claim 15 , wherein:

the at least one elevated power plane comprises a plurality of windows;

the plurality of windows of the at least one elevated power plane are configured to provide power connections to the power devices; and

the power devices are arranged in a plurality of rows extending along a first axis and a plurality of rows extending along a second axis on at least one implementation of the at least one electrically conductive power substrate.

21. The power module of claim 20 , wherein:

the plurality of windows are configured to allow power connections to extend vertically from the power devices to the at least one elevated power plane.

22. The power module of claim 15 , wherein:

the at least one elevated power plane comprises a first elevated power plane, a second elevated power plane, and a third elevated power plane.

23. The power module of claim 14 , wherein the plurality of windows of the at least one elevated signal element are configured to provide signal connections to the power devices.

24. The power module of claim 23 , wherein:

the plurality of windows are configured to allow signal connections to extend vertically from the power devices to the at least one elevated signal element.

25. The power module of claim 14 , further comprising:

at least one elevated power plane electrically connected to the at least one electrically conductive power substrate, electrically connected to the plurality of power devices, and arranged vertically offset from the at least one electrically conductive power substrate; and

one or more sensors,

wherein the one or more sensors are arranged on one of the following: the at least one elevated power plane and the at least one electrically conductive power substrate, and

wherein the one or more sensors are connected to the at least one elevated signal element.

26. The power module of claim 14 , wherein the power devices are arranged in a pattern on the at least one electrically conductive power substrate.

27. A power module, comprising:

at least one electrically conductive power substrate;

a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;

at least one elevated power plane electrically connected to the at least one electrically conductive power substrate, electrically connected to the plurality of power devices, and arranged spatially offset from the plurality of power devices; and

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated signal element comprises a plurality of windows.

28. The power module of claim 27 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated power plane comprises a portion that is arranged generally parallel to a surface of the at least one electrically conductive power substrate; and

wherein the at least one elevated signal element comprises a first elevated signal element and a second elevated signal element.

29. The power module of claim 27 ,

wherein the at least one elevated power plane comprises a portion that is arranged generally parallel to a surface of the at least one electrically conductive power substrate; and

wherein the power devices comprise power connections that connect the power devices to the at least one elevated power plane.

30. The power module of claim 27 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from and generally parallel to the at least one electrically conductive power substrate,

wherein the at least one elevated power plane comprises a portion that is arranged generally parallel to a surface of the at least one electrically conductive power substrate; and

wherein the at least one elevated signal element is arranged in one of the following: vertically offset from and separated from the at least one elevated power plane, arranged vertically offset from and on the at least one elevated power plane, and arranged vertically offset from and directly on the at least one elevated power plane.

31. The power module of claim 27 , wherein:

the at least one elevated power plane comprises a plurality of first windows;

the plurality of first windows are configured to provide power connections to the power devices; and

the power devices are arranged in a plurality of rows extending along a first axis and a plurality of rows extending along a second axis on at least one implementation of the at least one electrically conductive power substrate.

32. The power module of claim 31 , wherein:

the plurality of first windows are configured to allow power connections to extend vertically from the power devices to the at least one elevated power plane.

33. The power module of claim 27 ,

wherein the plurality of windows are configured to provide signal connections to the power devices.

34. The power module of claim 33 , wherein:

the plurality of windows are configured to allow signal connections to extend vertically from the power devices to the at least one elevated signal element.

35. The power module of claim 27 , further comprising:

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate; and

one or more sensors,

wherein the one or more sensors are arranged on one of the following: the at least one elevated power plane and the at least one electrically conductive power substrate, and

wherein the one or more sensors are connected to the at least one elevated signal element.

36. The power module of claim 27 , wherein:

the at least one elevated power plane comprises a first elevated power plane, a second elevated power plane, and a third elevated power plane.

37. The power module of claim 27 , wherein the power devices are arranged in a pattern on the at least one electrically conductive power substrate.

38. A power module, comprising:

at least one electrically conductive power substrate;

a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;

at least one elevated power plane electrically connected to the at least one electrically conductive power substrate, electrically connected to the plurality of power devices, and arranged spatially offset from the plurality of power devices; and

at least one elevated signal element electrically connected to the plurality of power devices and arranged vertically offset from the at least one electrically conductive power substrate,

wherein the at least one elevated power plane comprises an inclined portion that is inclined with respect a surface of the at least one electrically conductive power substrate; and

wherein the at least one elevated signal element comprises one of the following: a printed circuit board (PCB) or an insulated metal substrate (IMS).

39. The power module of claim 38 , wherein:

the at least one elevated signal element comprises the insulated metal substrate (IMS) with a metal layer configured as a high-current conductor.

Assignments (6)