Customization of process variable transmitter with hermetically sealed electronics
A process variable transmitter includes a process variable sensor, and an electromagnetic interference (EMI) protection circuit coupled to the process variable sensor. The process variable transmitter also includes a hermetic module enclosing the EMI protection circuit, and electrical connectors coupled to the EMI protection circuit within the hermetic module. The electrical connectors are configurable from outside the hermetic module to connect electronic components of the EMI protection circuit in a configuration that provides transient protection.
1. A process variable transmitter, comprising: a process variable sensor; an electromagnetic interference (EMI) protection circuit coupled to the process variable sensor; a hermetic module enclosing the EMI protection circuit; and electrical connectors coupled to the EMI protection circuit within the hermetic module and configurable from outside the hermetic module to connect electronic components of the EMI protection circuit in a configuration that provides transient protection; wherein the electrical connectors coupled to the EMI protection circuit within the hermetic module are configurable from outside the hermetic module to connect the electronic components of the EMI protection circuit in a standard configuration without the transient protection.
2. The process variable transmitter of claim 1 and wherein the electrical connectors comprise a first electrical connector electrically coupled to a first electronic component of the electrical components of the EMI protection circuit, and wherein the first electronic component is further coupled to an active electrical conductor.
3. The process variable transmitter of claim 2 and wherein the first electrical connector is couplable to an electrical ground connector outside the hermetic module to enable the first electronic component to provide the transient protection.
4. The process variable transmitter of claim 2 and wherein the first electrical connector is couplable to the active electrical conductor from outside the hermetic module to disable the first electronic component from providing the transient protection.
5. The process variable transmitter of claim 1 and further comprising a feedthrough body at a first end of the hermetic module, and the electrical connectors comprising a plurality of feedthrough pins passing through the feedthrough body and hermetically sealed to the feedthrough body, the feedthrough pins comprising:
first and second active conductor feedthrough pins enabling electrical coupling of first and second active electrical conductors inside the hermetic module to first and second active electrical conductors outside the hermetic module; an electrical ground feedthrough pin enabling electrical coupling of an electrical ground connector inside the hermetic module to an electrical ground connector outside the hermetic module;
and first and second additional feedthrough pins coupled to different ones of the electronic components of the EMI protection circuit, wherein each different one of the electronic components is further coupled to the first or second active electrical conductors in the hermetic module.
6. The process variable transmitter of claim 5 and wherein the first and second additional feedthrough pins are coupled to the electrical ground connector outside the hermetic module to enable the transient protection from outside the hermetic module.
7. The process variable transmitter of claim 5 and wherein, to disable the transient protection, the first additional feedthrough pin is coupled to the first active electrical conductor outside the hermetic module, and the second additional feedthrough pin is coupled to the second active electrical conductor outside the hermetic module.
8. The process variable transmitter of claim 5 and wherein the electronic components comprise first and second transient voltage suppression (TVS) diodes, and a gas discharge tube.
9. The process variable transmitter of claim 8 and wherein: the first TVS diode is coupled to the first active electrical conductor in the hermetic module and coupled to the first additional feedthrough pin in the hermetic module; the second TVS diode is coupled to the second active electrical conductor in the hermetic module and coupled to the second additional feedthrough pin in the hermetic module; and
the gas discharge tube is coupled to the first and second active electrical conductors in the hermetic module and coupled to the second additional feedthrough pin in the hermetic module.
10. A method comprising: enclosing an electromagnetic interference (EMI) protection circuit, coupled to a process variable sensor, in a hermetic module with electrical connectors extending outside the hermetic module; from outside the hermetic module, connecting, via the electrical connectors, electronic components of the EMI protection circuit in a configuration that provides transient protection; and from outside the hermetic module, connecting, via the electrical connectors, the electronic components of the EMI protection circuit in a standard configuration without the transient protection.
11. The method of claim 10 and further comprising electrically coupling a first electrical connector of the electrical connectors to a first electronic component of the electrical components of the EMI protection circuit, wherein the first electronic component is further coupled to an active electrical conductor.
12. The method of claim 11 and further comprising coupling the first electrical connector to an electrical ground connector outside the hermetic module to provide the transient protection by the first electronic component.
13. The method of claim 11 and further comprising electrically coupling the first electrical connector to the active electrical conductor from outside the hermetic module to disable the first electronic component from providing the transient protection.
14. A process variable transmitter, comprising: a process variable sensor; an electromagnetic interference (EMI) protection circuit coupled to the process variable sensor; a hermetic module enclosing the EMI protection circuit, the hermetic module having a first end comprising a feedthrough body and a plurality of feedthrough pins passing through the feedthrough body and hermetically sealed to the feedthrough body, wherein the feedthrough pins are coupled to the EMI protection circuit within the hermetic module and are configurable from outside the hermetic module to connect electronic components of the EMI protection circuit in a configuration that provides transient protection, wherein the plurality of feedthrough pins comprises: first and second active conductor feedthrough pins enabling electrical coupling of first and second active electrical conductors inside the hermetic module to first and second active electrical conductors outside the hermetic module; an electrical ground feedthrough pin enabling electrical coupling of an electrical ground connector inside the hermetic module to an electrical ground connector outside the hermetic module; and
first and second additional feedthrough pins coupled to different one ones of the circuit electronic components of the EMI protection circuit, wherein each different one of the electronic components is further coupled to the first or second active electrical conductors in the hermetic module.
15. The process variable transmitter of claim 14 and wherein the first and second additional feedthrough pins are coupled to the electrical ground connector outside the hermetic module to enable the transient protection from outside the hermetic module.
16. The process variable transmitter of claim 14 and wherein, to disable the transient protection, the first additional feedthrough pin is coupled to the first active electrical conductor outside the hermetic module, and the second additional feedthrough pin is coupled to the second active electrical conductor outside the hermetic module.
17. The process variable transmitter of claim 14 and wherein the electronic components comprise first and second transient voltage suppression (TVS) diodes, and a gas discharge tube, and wherein: the first TVS diode is coupled to the first active electrical conductor in the hermetic module and coupled to the first additional feedthrough pin in the hermetic module; the second TVS diode is coupled to the second active electrical conductor in the hermetic module and coupled to the second additional feedthrough pin in the hermetic module; the gas discharge tube is coupled to the first and second active electrical conductors in the hermetic module and coupled to the second additional feedthrough pin in the hermetic module.